Microwave and Millimeter-Wave Electronic Packaging
RF Cafe Quiz #58

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Microwave and Millimeter-Wave Electronic Packaging  - RF CafeThis quiz is based on the information presented in Microwave and Millimeter-Wave Electronic Packaging, by Rick Sturdivant.

Graciously provided by Artech House





1.  Match the following frequency band ranges with their proper letter designations.

Letter Frequency Range
30 kHz - 300 MHz
300 MHz - 1 GHz
1 GHz - 2 GHz
2 GHz - 4 GHz
4 GHz - 8 GHz
8 GHz - 12 GHz
12 GHz - 18 GHz
18 GHz - 27 GHz
27 GHz - 40 GHz
40 GHz - 75 GHz
75 GHz - 110 GHz

2.  What is the main additional issue concerning high versus low frequency design?

a)  Resonances
b)  Distributed reactance
c)  Cross-coupling
d)  All the above

3.  What is the difference between loss tangent and dissipation factor?

a)  Loss tangent has no resistance value
b)  Dissipation factor does not account for permittivity being complex at high frequencies
c)  Loss tangent includes resistance
d)  There is no difference between the two

4.  What is a first-level interconnect in reference to RFIC design?

a)  Electrical connection between the semiconductor device and the package
b)  Electrical connection between the first and second level semiconductor metallization
c)  Electrical connection from the bottom metallization of the semiconductor to the heatsink
d)  Mechanical connection from the bottom metallization of the semiconductor to the heatsink

5.  Match the following terms with their proper definitions.

Term Definition
Atomic polarization Occurs when molecules with ionic bonds have a displacement of the positive ions relative to negative ions in the presence of an electric field.
Ionic polarization Occurs when the center of an electron cloud of an atom is displaced relative to the center of the nucleus in the presence of an electric field.
Orientation polarization Occurs when molecules that have a permanent dipole moment, but are naturally randomly oriented, orient themselves in the presence of an electric field.

6.  What makes metals good electrical conductors?

a)  Bound electrons
b)  Free electrons
c)  Reciprocal mho effect
d)  Free protons

7.  What are properties of ceramics that make them good as microwave circuitry substrates?

a)  Inherently stable due to high Young's modulus
b)  Low insertion loss for types like alumina and quartz
c)  Tight line resolutions for impedance control
d)  a & b
e)  a & c
f)  b & c
g)  All the above

8.  What type of thick film pastes are available for use on ceramic substrates?

a)  Metals
b)  Resistive
c)  Insulative
d)  a & b
e)  a & c
f)  b & c
g)  All the above

Wire bond designations - RF Cafe9.  What are the names of the two ends of the depicted
      type of wire bond?

a)  Sphere and plane
b)  Circle and line
c)  Ball and wedge
d)  Ball and stitch

10.  What is one of the main advantages of flip chip mounting for high frequency ICs?

a)  Larger die possible
b)  Lower cost
c)  Lower wire bond inductance
d)  Higher reliability

Need some help? Click here for the answers and explanations.