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Note: Many answers contain passages quoted in whole or in part from the text.
quiz is based on the information presented in Microwave and Millimeter-Wave Electronic Packaging,
by Rick Sturdivant.
Graciously provided by
1. Match the following frequency band ranges with their proper letter
|30 kHz - 300 MHz
300 MHz - 1 GHz
1 GHz - 2 GHz
2 GHz - 4 GHz
4 GHz - 8 GHz
8 GHz - 12 GHz
12 GHz - 18 GHz
18 GHz - 27 GHz
27 GHz - 40 GHz
40 GHz - 75 GHz
75 GHz - 110 GHz
What is the main additional issue concerning high versus
low frequency design?
b) Distributed reactance
d) All the above3.
the difference between loss tangent and dissipation factor?
a) Loss tangent has no
b) Dissipation factor does not account for permittivity being complex
at high frequencies
c) Loss tangent includes resistance
d) There is no difference
between the two4.
What is a first-level interconnect
in reference to RFIC design?
a) Electrical connection between the semiconductor device
and the package
b) Electrical connection between the first and second level semiconductor
c) Electrical connection from the bottom metallization of the semiconductor
to the heatsink
d) Mechanical connection from the bottom metallization of the semiconductor
to the heatsink5.
Match the following terms with their
||Occurs when molecules with ionic bonds have a displacement of the positive ions relative
to negative ions in the presence of an electric field.
||Occurs when the center of an electron cloud of an atom is displaced relative to the center
of the nucleus in the presence of an electric field.
||Occurs when molecules that have a permanent dipole moment, but are naturally randomly
oriented, orient themselves in the presence of an electric field.
What makes metals good electrical conductors?
a) Bound electrons
b) Free electrons
c) Reciprocal mho effect
What are properties of ceramics that
make them good as microwave circuitry substrates?
a) Inherently stable due to high
b) Low insertion loss for types like alumina and quartz
line resolutions for impedance control
d) a & b
e) a & c
b & c
g) All the above8.
What type of
thick film pastes are available for use on ceramic substrates?
d) a & b
e) a & c
f) b &
g) All the above
What are the names of the two ends of the depicted
type of wire
a) Sphere and plane
b) Circle and line
c) Ball and wedge
d) Ball and stitch10.
What is one of the main
advantages of flip chip mounting for high frequency ICs?
a) Larger die possible
b) Lower cost
c) Lower wire bond inductance
d) Higher reliability
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