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of school or are relatively new to the work world. Come to think of it, they would make equally excellent study material for the same persons
who are going to be interviewed for a job.
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Note: Many answers contain passages quoted in whole or in part from the text.
quiz is based on the information presented in Component Reliability for Electronic Systems, authored by
Titu-Marius I. Bajenescu & Marius I. Bazu. Published by
Note: Some of these books are available as prizes in the monthly
RF Cafe Giveaway
What are the two main components of product quality?
a) Price and volume
b) Price and manufacturability
c) Conformity and reliability
d) Brand recognition and country of origin
What are the two main ways to quantify the reliability of a system?
a) Spreadsheet equations
and designer experience
b) Company reputation and user habits
c) Distributor marketing and the "greenness"
of the product
d) Laboratory tests, field operational data3.
Quality Management) requires which behaviors?
a) Teamwork & professional
b) Commitment & motivation
c) Personal adoption of the concept by everyone
d) All the above4.
A properly designed Accelerated Lift Test (ACL) must do
a) Pass through all states, in the same order as normal, but in shorter time
b) Subject in
random order the UUT to conditions well beyond normal operational conditions
c) Perform a computer simulation
of the lifetime of a components or system
d) All the above
What are some key components of meaningful failure analysis?
a) Knowing who to blame
it on and determining appropriate punishment
b) Knowledge of the failure mechanism and establishment of the
c) Having an effective Public Relations (PR) plan in place to handle the media
an upgrade at a reasonable cost to pacify angry users6.
What type of failure has
the highest occurrence in semiconductors?
a) Connection defects
b) Metallization defects
d) Die defects7.
Which of the following are likely causes for
passive component failure?
b) Design errors
c) Manufacturing errors
d) All the
What is radiation hardness?
a) Immunity to failure due to
radiation, wave or particle
b) Physical hardening of IC packaging using radiation
c) Prevention of radiation from ICs to other components
d) A scale of 1 to 10 that rates radioactive
What is the well-known Arrhenius model determine the relationship
a) Relationship between gate thickness and switching speed
b) Relationship between voltage and
c) Relationship between failure rate and device junction temperature
d) Relationship between
vibration level and mechanical cracking10.
What is a failure mode unique to MEMS
devices compared to traditional ICs?
a) Spatial disorientation
b) Color shifting
c) Moving parts can fail
d) No unique failure types
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