Leading RADAR speakers bring expertise
to event that covers RF/microwave and high-speed digital topics.
Norwood, Mass., June 6, 2017 - The Electronic Design Innovation Conference and
Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave
and high-speed digital design engineers and system integrators, announced today
the addition of the
European Radar Summit to its conference program at the Hynes
Convention Center, September 11-13 in Boston, Mass.
 EDI CON USA 2017 is building on its inaugural
2016 conference with multiple parallel tracks covering RF/microwave, high-speed
digital and EMC/EMI topics. The conference features extended tutorials and short
courses on Monday, September 11 followed by technical sessions, invited talks, workshops,
panels and exhibition on Tuesday and Wednesday. Technical sessions focus on actionable,
educational information for working engineers rather than product pitches and commercial
presentations.
Organizers of Radar technology sessions at the IEEE Phased Array Conference and
the European Microwave Week Defense Forum have selected a number of papers to present
at the EDI CON USA European Radar Summit on Tuesday, September 12. Led by Alfonso
Farina, Selex ES-Italy retired, the session's papers will cover topics such as conformal
and phased array antennas, multi-static passive/active array radar, wide band signal
processing and overall radar trends.
Planned papers include:
- "A Family of Secondary Surveillance Radars based on Conformal Antenna Array
Geometries," Massimo Angelilli, Leopoldo Infante, Paolo Pacifici, Leonardo Company
S.p.A., Land and Naval Defense Electronics Division (Rome, Italy)
- "Enhanced target detection and localization by cueing in multistatic passive-active
radar systems," T. Brenner, L. Lamentowski, R. Mularzuk, PIT-RADWAR SA (Warsaw,
Poland).
- "Design Aspects for Dual-Polarized Phased Array Antennas with Low X-pol Contribution,"
Dennis Vollbracht, Selex-ES GmbH (Neuss, Germany)
- "Innovative Algorithm for Wide Band Digital Signal Processing in modern AESA
RADAR Architecture," Roberto Lalli, Caterina Rapisarda¸ Alessandro Manuale, Valerio
Tocca, Land & Naval Defence Electronics Leonardo S.p.A. (Rome, Italy)
- "Technology Trends for Radar," Hans van Bezouwen and Dr. Michael Brandfass,
HENSOLDT (Ulm, Germany)
This year, EDI CON USA is the only RF/microwave industry conference and exhibition
in the continental USA, and the largest high-speed technical conference on the US
East Coast. Networking opportunities will abound on the exhibit floor, and attendees
can enjoy a welcome reception and happy hour. More information, including registration
and how to exhibit, is available at www.ediconusa.com. Attendees to the EDI CON USA European Radar
Summit will require a Conference Pass.
EDI CON USA 2017 is supported by its primary media sponsors,
Microwave Journal
and Signal Integrity
Journal. For future planning, EDI CON USA 2018 will be held at the Santa Clara
Convention Center (Santa Clara, CA) October 17-19, 2018.
About EDI CON USA
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital
design engineers and system integrators for networking, training, and learning opportunities.
Attendees come to EDI CON USA to find solutions, products, and design ideas that
they can put into immediate practice for today's communication, defense, consumer
electronics, aerospace, and medical industries. Drawing attendees from both the
analog and digital spheres, EDI CON enables designers to see techniques and technologies
used in other applications that could be applied or adapted to solve their latest
design challenges. The exhibition hall features product displays, demonstrations,
design contests, interactive sessions, speed trainings, networking opportunities,
and educational talks that address all aspects of design, simulation, test, and
verification. www.ediconusa.com
About the Organizers EDI CON USA is organized by Microwave Journal, the Signal
Integrity Journal, and the event planning division of their parent company, Horizon
House. Microwave Journal, Signal Integrity Journal, and Horizon House also team
with Microwave Journal China and ACT International (Hong Kong) to organize and produce
EDI CON China (April 25-27, 2017 in Shanghai, China). An experienced and well-established
organizer of targeted events, Horizon House additionally organizes European Microwave
Week (EuMW) on behalf of the European Microwave Association (EuMA) and the M2M Zone
at CTIA Super Mobility Week/Mobile World Congress Americas. To subscribe to Signal
Integrity Journal, visit www.signalintegrityjournal.com
The EDI CON technical program is developed in collaboration with leading international
technology companies and experts in high-frequency and high-speed electronic design
with experience ranging from modeling and design to component characterization,
system integration, and verification.
Event Contact:
Janine Love, Event Director +1-857-350-2216
jlove@horizonhouse.com Twitter: @tb_janine
Sales Contact:
Carl Sheffres, Publisher +1-781-619-1949
csheffres@mwjournal.com
Editorial Contacts:
NNorth America: Pat Hindle +1 781-619-1946
PHindle@MWJournal.com Twitter: @pathindle
International: Richard Mumford +44 207 596 8787
RMumford@MWJournal.com
Posted June 12, 2017
|
