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Package Outlines - TSSOP |
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Thin shrink small-outline
packages, or TSSOPs are a type of surface mount IC package. They are notably very low-profile (about 1mm) and have
tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs dues to their high pin
count and small volume. However, they are being supplanted by ball grid array packages which can achieve even
higher densities. - Wikipedia Thin Shrink Small Outline Package
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| About RF Cafe | |
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RF Cafe began life in 1996 as "RF Tools" in an AOL screen name web space totaling 2 MB. Its primary purpose was to provide me with ready access to commonly needed formulas and reference material while performing my work as an RF system and circuit design engineer. The World Wide Web (Internet) was largely an unknown entity at the time and bandwidth was a scarce commodity. Dial-up modems blazed along at 14.4 kbps while typing up your telephone line, and a nice lady's voice announced "You've Got Mail" when a new message arrived... All trademarks, copyrights, patents, and other rights of ownership to images and text used on the RF Cafe website are hereby acknowledged. My Hobby Website: AirplanesAndRockets.com
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