Government bureaucracy is notoriously... bureaucratic. Commercial entities have
learned the ropes all too well, unfortunately. Having needed to locate test methods
for both government and commercial purposes and having some trouble doing so, I
decided to make my own list. Here it is. Please let me know if you have any others
that should be added to the list. NOTE: Always search for the most recent
release of the MIL-STD document you intend to use for official purposes.
| DoD |
MIL-STD-883E |
1001 |
Barometric pressure, reduced (altitude operation) |
| DoD |
MIL-STD-883E |
1002 |
Immersion |
| DoD |
MIL-STD-883E |
1003 |
Insulation resistance |
| DoD |
MIL-STD-883E |
1004.7 |
Moisture resistance |
| DoD |
MIL-STD-883E |
1005.8 |
Steady state life |
| DoD |
MIL-STD-883E |
1006 |
Intermittent life |
| DoD |
MIL-STD-883E |
1007 |
Agree life |
| DoD |
MIL-STD-883E |
1008.2 |
Stabilization bake |
| DoD |
MIL-STD-883E |
1009.8 |
Salt atmosphere (corrosion) |
| DoD |
MIL-STD-883E |
1010.7 |
Temperature cycling |
| DoD |
MIL-STD-883E |
1011.9 |
Thermal shock |
| DoD |
MIL-STD-883E |
1012.1 |
Thermal characteristics |
| DoD |
MIL-STD-883E |
1013 |
Dew point |
| DoD |
MIL-STD-883E |
1014.1 |
Seal |
| DoD |
MIL-STD-883E |
1015.9 |
Burn-in test |
| DoD |
MIL-STD-883E |
1016 |
Life/reliability characterization tests |
| DoD |
MIL-STD-883E |
1017.2 |
Neutron irradiation |
| DoD |
MIL-STD-883E |
1015.2 |
Internal water-vapor content |
| DoD |
MIL-STD-883E |
1019.4 |
Ionizing radiation (total dose) test procedure |
| DoD |
MIL-STD-883E |
1020.1 |
Dose rate induced latchup test procedure |
| DoD |
MIL-STD-883E |
1021.2 |
Dose rate upset testing of digital microcircuits |
| DoD |
MIL-STD-883E |
1022 |
Mosfet threshold voltage |
| DoD |
MIL-STD-883E |
1023.2 |
Dose rate response of linear microcircuits |
| DoD |
MIL-STD-883E |
1030.1 |
Preseal burn-in |
| DoD |
MIL-STD-883E |
1031 |
Thin film corrosion test |
| DoD |
MIL-STD-883E |
1032.1 |
Package induced soft error test procedure (due to alpha particles) |
| DoD |
MIL-STD-883E |
1033 |
Endurance life test |
| DoD |
MIL-STD-883E |
1034 |
Die penetrant test (for plastic devices) |
| DoD |
MIL-STD-883E |
2001.2 |
Constant acceleration |
| DoD |
MIL-STD-883E |
2002.3 |
Mechanical shock |
| DoD |
MIL-STD-883E |
2003.7 |
Solderability |
| DoD |
MIL-STD-883E |
2004.5 |
Lead integrity |
| DoD |
MIL-STD-883E |
2005.2 |
Vibration fatigue |
| DoD |
MIL-STD-883E |
2006.1 |
Vibration noise |
| DoD |
MIL-STD-883E |
2007.2 |
Vibration, variable frequency |
| DoD |
MIL-STD-883E |
2008.1 |
Visual and mechanical |
| DoD |
MIL-STD-883E |
2009.9 |
External visual |
| DoD |
MIL-STD-883E |
2010.10 |
Internal visual (monolithic) |
| DoD |
MIL-STD-883E |
2011.7 |
Bond strength (destructive bond pull test) |
| DoD |
MIL-STD-883E |
2012.7 |
Radiography |
| DoD |
MIL-STD-883E |
2013.1 |
Internal visual inspection for DPA |
| DoD |
MIL-STD-883E |
2014 |
Internal visual and mechanical |
| DoD |
MIL-STD-883E |
2015.11 |
Resistance to solvents |
| DoD |
MIL-STD-883E |
2016 |
Physical dimensions |
| DoD |
MIL-STD-883E |
2017.7 |
Internal visual (hybrid) |
| DoD |
MIL-STD-883E |
2015.3 |
Scanning electron microscope (SEM) inspection of metallization |
| DoD |
MIL-STD-883E |
2019.5 |
Die shear strength |
| DoD |
MIL-STD-883E |
2020.7 |
Particle impact noise detection test |
| DoD |
MIL-STD-883E |
2021.3 |
Glassivation layer integrity |
| DoD |
MIL-STD-883E |
2022.2 |
Wetting balance solderability |
| DoD |
MIL-STD-883E |
2023.5 |
Nondestructive bond pull |
| DoD |
MIL-STD-883E |
2024.2 |
Lid torque for glass-frit-sealed packages |
| DoD |
MIL-STD-883E |
2025.4 |
Adhesion of lead finish |
| DoD |
MIL-STD-883E |
2026 |
Random vibration |
| DoD |
MIL-STD-883E |
2027.2 |
Substrate attach strength |
| DoD |
MIL-STD-883E |
2028.4 |
Pin grid package destructive lead pull test |
| DoD |
MIL-STD-883E |
2029 |
Ceramic chip carrier bond strength |
| DoD |
MIL-STD-883E |
2030 |
Ultrasonic inspection of die attach |
| DoD |
MIL-STD-883E |
2031.1 |
Flip chip pull-off test |
| DoD |
MIL-STD-883E |
2032.1 |
Visual inspection of passive elements |
| DoD |
MIL-STD-883E |
2035 |
Ultrasonic inspection of TAB bonds |
| DoD |
MIL-STD-883E |
3001.1 |
Drive source, dynamic |
| DoD |
MIL-STD-883E |
3002.1 |
Load conditions |
| DoD |
MIL-STD-883E |
3003.1 |
Delay measurements |
| DoD |
MIL-STD-883E |
3004.1 |
Transition time measurements |
| DoD |
MIL-STD-883E |
3005.1 |
Power supply current |
| DoD |
MIL-STD-883E |
3006.1 |
High level output voltage |
| DoD |
MIL-STD-883E |
3007.1 |
Low level output voltage |
| DoD |
MIL-STD-883E |
3008.1 |
Breakdown voltage, input or output |
| DoD |
MIL-STD-883E |
3009.1 |
Input current, low level |
| DoD |
MIL-STD-883E |
3010.1 |
Input current, high level |
| DoD |
MIL-STD-883E |
3011.1 |
Output short circuit current |
| DoD |
MIL-STD-883E |
3012.1 |
Terminal capacitance |
| DoD |
MIL-STD-883E |
3013.1 |
Noise margin measurements for digital microelectronic devices |
| DoD |
MIL-STD-883E |
3014 |
Functional testing |
| DoD |
MIL-STD-883E |
3015.7 |
Electrostatic discharge sensitivity classification |
| DoD |
MIL-STD-883E |
3016 |
Activation time verification |
| DoD |
MIL-STD-883E |
3017 |
Microelectronics package digital signal transmission |
| DoD |
MIL-STD-883E |
3015 |
Crosstalk measurements for digital microelectronic device packages |
| DoD |
MIL-STD-883E |
3019.1 |
Ground and power supply impedance measurements for digital microelectronics
device packages |
| DoD |
MIL-STD-883E |
3020 |
High impedance (off-state) low-level output leakage current |
| DoD |
MIL-STD-883E |
3021 |
High impedance (off-state) high-level output leakage current |
| DoD |
MIL-STD-883E |
3022 |
Input clamp voltage |
| DoD |
MIL-STD-883E |
3023 |
Static latch-up measurements for digital CMOS microelectronic devices |
| DoD |
MIL-STD-883E |
3024 |
Simultaneous switching noise measurements for digital microelectronic devices |
| DoD |
MIL-STD-883E |
4001.1 |
Input offset voltage and current and bias current |
| DoD |
MIL-STD-883E |
4002.1 |
Phase margin and slew rate measurements |
| DoD |
MIL-STD-883E |
4003.1 |
Common mode input voltage range, Common mode rejection ratio, Supply voltage
rejection ratio |
| DoD |
MIL-STD-883E |
4004.1 |
Open loop performance |
| DoD |
MIL-STD-883E |
4005.1 |
Output performance |
| DoD |
MIL-STD-883E |
4006.1 |
Power gain and noise figure |
| DoD |
MIL-STD-883E |
4007 |
Automatic gain control range |
| DoD |
MIL-STD-883E |
5001 |
Parameter mean value control |
| DoD |
MIL-STD-883E |
5002.1 |
Parameter distribution control |
| DoD |
MIL-STD-883E |
5003 |
Failure analysis procedures for microcircuits |
| DoD |
MIL-STD-883E |
5004.10 |
Screening procedures |
| DoD |
MIL-STD-883E |
5005.13 |
Qualification and quality conformance procedures |
| DoD |
MIL-STD-883E |
5006 |
Limit testing |
| DoD |
MIL-STD-883E |
5007.6 |
Wafer lot acceptance |
| DoD |
MIL-STD-883E |
5008.8 |
Test procedures for hybrid and multichip microcircuits |
| DoD |
MIL-STD-883E |
5009.1 |
Destructive physical analysis |
| DoD |
MIL-STD-883E |
5010.3 |
Test procedures for custom monolithic microcircuits |
| DoD |
MIL-STD-883E |
5011.4 |
Evaluation and acceptance procedures for polymeric adhesives. |
| DoD |
MIL-STD-883E |
5012.1 |
Fault coverage measurement for digital microcircuits. |
| DoD |
MIL-STD-883E |
5013 |
Wafer fabrication control and wafer acceptance procedures for processed GaAs
wafers. |
| IPC |
TM-650 |
2.1.1D |
Microsectioning - 3/98 |
| IPC |
TM-650 |
2.1.1.1 |
Microsectioning, Ceramic Substrate - 12/87 |
| IPC |
TM-650 |
2.1.1.2 |
Microsectioning - Semi or Automatic Technique Microsection Equipment (Alternate)
- 7/93 |
| IPC |
TM-650 |
2.1.2A |
Pinhole Evaluation, Dye Penetration Method - 3/76 |
| IPC |
TM-650 |
2.1.3A |
Plated-Through Hole Structure Evaluation - 8/76 |
| IPC |
TM-650 |
2.1.5A |
Surface Examination, Unclad and Metal Clad Material - 12/82 |
| IPC |
TM-650 |
2.1.6B |
Thickness of Glass Fabric - 12/94 |
| IPC |
TM-650 |
2.1.6.1 |
Weight of Fabric Reinforcements - 12/94 |
| IPC |
TM-650 |
2.1.7C |
Thread Count of Glass Fabric - 12/94 |
| IPC |
TM-650 |
2.1.7.1 |
Thread Count, Organic Fibers - 12/87 |
| IPC |
TM-650 |
2.1.8B |
Workmanship - 12/94 |
| IPC |
TM-650 |
2.1.9 |
Surface Scratch Examination Metal Clad Foil - 5/86 |
| IPC |
TM-650 |
2.1.10A |
Visual Inspection for Undissolved Dicyandiamide - 12/94 |
| IPC |
TM-650 |
2.1.13A |
Inspection for Inclusions and Voids in Flexible Printed Wiring Materials - 5/98 |
| IPC |
TM-650 |
2.2.1A |
Mechanical Dimensional Verification - 8/97 |
| IPC |
TM-650 |
2.2.2B |
Optical Dimensional Verification - 8/97 |
| IPC |
TM-650 |
2.2.4C |
Dimensional Stability, Flexible Dielectric Materials - 5/98 |
| IPC |
TM-650 |
2.2.5A |
Dimensional Inspections Using Mircosections - 8/97 |
| IPC |
TM-650 |
2.2.6A |
Hole Size Measurement, Drilled - 8/97 |
| IPC |
TM-650 |
2.2.7A |
Hole Size Measurement, Plated - 5/86 |
| IPC |
TM-650 |
2.2.8 |
Location of Holes - 4/73 |
| IPC |
TM-650 |
2.2.10A |
Hole Location and Conductor Location - 12/83 |
| IPC |
TM-650 |
2.2.12A |
Thickness of Copper by Weight- 3/76 |
| IPC |
TM-650 |
2.2.12.1 |
Overall Thickness and Profile Factor of Copper Foils Treated and Untreated -
9/87 |
| IPC |
TM-650 |
2.2.12.2 |
Weight and Thickness of Copper Foils with Releasable Carriers - 7/89 |
| IPC |
TM-650 |
2.2.12.3 |
Weight and Thickness Determination of Copper Foils With Etchable Carriers -
7/89 |
| IPC |
TM-650 |
2.2.13.1A |
Thickness, Plating in Holes, Microhm Method - 1/83 |
| IPC |
TM-650 |
2.2.14 |
Solder Powder Particle Size Distribution - Screen Method for Types 1-4 - 1/95 |
| IPC |
TM-650 |
2.2.14.1 |
Solder Powder Particle Size Distribution - Measuring Microscope Method - 1/95 |
| IPC |
TM-650 |
2.2.14.2 |
Solder Powder Particle Size Distribution - Optical Image Analyzer Method--1/95 |
| IPC |
TM-650 |
2.2.14.3 |
Determination of Maximum Solder Powder Particle Size - 1/95 |
| IPC |
TM-650 |
2.2.15 |
Cable Dimensions (Flat Cable) - 6/79 |
| IPC |
TM-650 |
2.2.16 |
Artwork Master Evaluation by Use of a Drilled Panel - 12/87 |
| IPC |
TM-650 |
2.2.16.1 |
Artwork Master Evaluation by Overlay - 12/87 |
| IPC |
TM-650 |
2.2.17 |
Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique)-
3/90 |
| IPC |
TM-650 |
2.2.15 |
Determination of Thickness of Laminates by Mechanical Measurement - 12/94 |
| IPC |
TM-650 |
2.2.15.1 |
Determination of Thickness of Metallic Clad Laminates, Cross-sectional - 12/94 |
| IPC |
TM-650 |
2.2.19 |
Measuring Hole Pattern Location-12/87 |
| IPC |
TM-650 |
2.2.19.1 |
Length, Width and Perpendicularity of Laminate and Prepreg Panels - 12/94 |
| IPC |
TM-650 |
2.2.20 |
Solder Paste Metal Content by Weight - 1/95 |
| IPC |
TM-650 |
2.2.21 |
Planarity of Dielectrics for High Density Interconnection (HDI) Microvia Technology
- 11-98 |
| IPC |
TM-650 |
2.3.1 |
Chemical Processing, Suitable Processing Material- 4/73 |
| IPC |
TM-650 |
2.3.1.1B |
Chemical Cleaning of Metal Clad Laminates- 5/86 |
| IPC |
TM-650 |
2.3.2F |
Chemical Resistance Of Flexible Printed Wiring Materials - 5/98 |
| IPC |
TM-650 |
2.3.3A |
Chemical Resistance of Insulating Materials- 2/78 |
| IPC |
TM-650 |
2.3.4B |
Chemical Resistance, Marking Paints and Inks - 8/97 |
| IPC |
TM-650 |
2.3.4.2A |
Chemical Resistance of Laminates, Prepreg and Coated Foil Products, by Solvent
Exposure - 12/94 |
| IPC |
TM-650 |
2.3.4.3 |
Chemical Resistance of Core Materials to Methylene Chloride- 5/86 |
| IPC |
TM-650 |
2.3.5B |
Density, Insulating Material - 8/97 |
| IPC |
TM-650 |
2.3.6A |
Etching, Ammonium Persulfate Method - 7/75 |
| IPC |
TM-650 |
2.3.7A |
Etching, Ferric Chloride Method - 7/75 |
| IPC |
TM-650 |
2.3.7.1A |
Cupric Chloride Etching Method - 12/94 |
| IPC |
TM-650 |
2.3.7.2A |
Alkaline Etching Method - 12/94 |
| IPC |
TM-650 |
2.3.8A |
Flammability, Flexible Insulating Materials- 12/82 |
| IPC |
TM-650 |
2.3.8.1 |
Flammability of Flexible Printed Wiring- 12/88 |
| IPC |
TM-650 |
2.3.9D |
Flammability of Prepreg and Thin Laminate - 8/97 |
| IPC |
TM-650 |
2.3.10B |
Flammability of Laminate - 12/94 |
| IPC |
TM-650 |
2.3.10.1 |
Flammability of Soldermask on Printed Wiring Laminate- 8/98 |
| IPC |
TM-650 |
2.3.11 |
Glass Fabric Construction- 4/73 |
| IPC |
TM-650 |
2.3.13 |
Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual
Titration Methods- 1/95 |
| IPC |
TM-650 |
2.3.14 |
Print, Etch, and Plate Test- 4/73 |
| IPC |
TM-650 |
2.3.15C |
Purity, Copper Foil or Plating - 8/97 |
| IPC |
TM-650 |
2.3.16B |
Resin Content of Prepreg, by Burn-off - 12/94 |
| IPC |
TM-650 |
2.3.16.1C |
Resin Content of Prepreg, by Treated Weight--12/94 |
| IPC |
TM-650 |
2.3.16.2 |
Treated Weight of Prepreg - 12/94 |
| IPC |
TM-650 |
2.3.17D |
Resin Flow Percent of Prepreg - 8/97 |
| IPC |
TM-650 |
2.3.17.1B |
Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films - 5/98 |
| IPC |
TM-650 |
2.3.17.2B |
Resin Flow of "No Flow" Prepreg - 8/97 |
| IPC |
TM-650 |
2.3.15A |
Gel Time, Prepreg Materials - 4/86 |
| IPC |
TM-650 |
2.3.19C |
Volatile Content of Prepreg - 12/94 |
| IPC |
TM-650 |
2.3.20 |
Plating Quality, Hull Cell Method - 8/97 |
| IPC |
TM-650 |
2.3.22 |
Copper Protective Coating Quality - 2-78 |
| IPC |
TM-650 |
2.3.23B |
Cure (Permanency) Thermally Cured Solder Mask - 2/88 |
| IPC |
TM-650 |
2.3.23.1A |
Cure (Permanency) UV Initiated Dry Film Solder Mask - 2/88 |
| IPC |
TM-650 |
2.3.24 |
Porosity of Gold Plating- 2/78 |
| IPC |
TM-650 |
2.3.24.1 |
Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate
Electrographic Method - 10/85 |
| IPC |
TM-650 |
2.3.24.2A |
Porosity of Metallic Coatings on Copper-Based Alloys and Nickel (Nitric Acid
Vapor Test) - 8/97 |
| IPC |
TM-650 |
2.3.25B |
Detection and Measurement of Ionizable Surface Contaminants - 8/97 |
| IPC |
TM-650 |
2.3.26A |
Ionizable Detection of Surface Contaminants (Dynamic Method) - 11/94 |
| IPC |
TM-650 |
2.3.26.1 |
Ionizable Detection of Surface Contaminants (Static Method) - 11/94 |
| IPC |
TM-650 |
2.3.26.2 |
Mobile Ion Content of Polymer Films - 7/95 |
| IPC |
TM-650 |
2.3.27 |
Cleanliness Test - Residual Rosin - 1/95 |
| IPC |
TM-650 |
2.3.27.1 |
Rosin Flux Residue Analysis-HPLC Method - 1/95 |
| IPC |
TM-650 |
2.3.28 |
Ionic Analysis of Circuit Boards, Ion Chromatography Method - 1/95 |
| IPC |
TM-650 |
2.3.29 |
Flammability, Flexible Flat Cable- 11/88 |
| IPC |
TM-650 |
2.3.30A |
Solvent pH Determination in Anhydrous Flourocarbon Solvents- 11/81 |
| IPC |
TM-650 |
2.3.31 |
Relative Degree of Cure of U.V. Curable Material - 2/88 |
| IPC |
TM-650 |
2.3.32C |
Flux Induced Corrosion (Copper Mirror Method)- 1/95 |
| IPC |
TM-650 |
2.3.33C |
Presence of Halides in Flux, Silver Chromate Method - 1/95 |
| IPC |
TM-650 |
2.3.34B |
Solids Content, Flux - 1/95 |
| IPC |
TM-650 |
2.3.34.1B |
Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder - 1/95 |
| IPC |
TM-650 |
2.3.35B |
Halide Content, Quantitative (Chloride and Bromide)- 1/95 |
| IPC |
TM-650 |
2.3.35.1 |
Fluorides by Spot Test, Fluxes - Qualitative - 1/95 |
| IPC |
TM-650 |
2.3.35.2 |
Flouride Concentration, Fluxes - Quantitative--1/95 |
| IPC |
TM-650 |
2.3.36 |
Acid Acceptance of Chlorinated Solvents- 10/85 |
| IPC |
TM-650 |
2.3.37B |
Volatile Content of Adhesive Coated Dielectric Films - 5/98 |
| IPC |
TM-650 |
2.3.38B |
Surface Organic Contaminant Detection Test - 8/97 |
| IPC |
TM-650 |
2.3.39B |
Surface Organic Contaminant Identification Test (Infrared Analytical Method)
- 8/97 |
| IPC |
TM-650 |
2.3.40 |
Thermal Stability - 7/95 |
| IPC |
TM-650 |
2.4.1D |
Adhesion, Tape Testing--8/97 |
| IPC |
TM-650 |
2.4.1.1B |
Adhesion, Marking Paints and Inks--11/88 |
| IPC |
TM-650 |
2.4.1.2 |
Adhesion of Conductors on Hybrid Substrates--12/87 |
| IPC |
TM-650 |
2.4.1.3 |
Adhesion, Resistors (Hybrid Circuits)--12/87 |
| IPC |
TM-650 |
2.4.1.4 |
Adhesion, Overglaze (Hybrid Circuits)--12/87 |
| IPC |
TM-650 |
2.4.1.5A |
Determination of Heat Transfer--5/95 |
| IPC |
TM-650 |
2.4.1.6 |
Adhesion, Polymer Coating--7/95 |
| IPC |
TM-650 |
2.4.2A |
Ductility of Copper Foil--3/76 |
| IPC |
TM-650 |
2.4.2.1D |
Flexural Fatigue and Ductility, Foil--3/91 |
| IPC |
TM-650 |
2.4.3D |
Flexural Fatigue, Flexible Printed Wiring Materials--5/98 |
| IPC |
TM-650 |
2.4.3.1C |
Flexural Fatigue and Ductility, Flexible Printed Wiring--3/91 |
| IPC |
TM-650 |
2.4.3.2C |
Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics--3/91 |
| IPC |
TM-650 |
2.4.4B |
Flexural Strength of Laminates (at Ambient Temperature)--12/94 |
| IPC |
TM-650 |
2.4.4.1A |
Flexural Strength of Laminates (at Elevated Temperature)--12/94 |
| IPC |
TM-650 |
2.4.5 |
Folding Endurance, Flexible Printed Wiring Materials--4/73 |
| IPC |
TM-650 |
2.4.6 |
Hot Oil--4/73 |
| IPC |
TM-650 |
2.4.7A |
Machinability, Printed Wiring Materials--7/75 |
| IPC |
TM-650 |
2.4.8C |
Peel Strength of Metallic Clad Laminates--12/94 |
| IPC |
TM-650 |
2.4.8.1 |
Peel Strength, Metal Foil (Keyhole Method for Thin Laminates)--1/86 |
| IPC |
TM-650 |
2.4.8.2A |
Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid
Method)--12/94 |
| IPC |
TM-650 |
2.4.8.3A |
Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method)--12/94 |
| IPC |
TM-650 |
2.4.8.4 |
Carrier Release, Thin Copper--1/90 |
| IPC |
TM-650 |
2.4.9D |
Peel Strength, Flexible Dielectric Materials--10/88 |
| IPC |
TM-650 |
2.4.9.1 |
Peel Strength of Flexible Circuits - 11/98 |
| IPC |
TM-650 |
2.4.9.2 |
Bonding Process - 11/98 |
| IPC |
TM-650 |
2.4.10 |
Plating Adhesion--4/73 |
| IPC |
TM-650 |
2.4.11 |
Shear Strength Flexible Dielectric Materials--4/73 |
| IPC |
TM-650 |
2.4.12A |
Solderability, Edge Dip Method--6/91 |
| IPC |
TM-650 |
2.4.13F |
Solder Float Resistance Flexible Printed Wiring Materials--5/98 |
| IPC |
TM-650 |
2.4.13.1 |
Thermal Stress of Laminates--12/94 |
| IPC |
TM-650 |
2.4.14 |
Solderability of Metallic Surfaces--4/73 |
| IPC |
TM-650 |
2.4.14.1 |
Solderability, Wave Solder Method--3/79 |
| IPC |
TM-650 |
2.4.14.2 |
Liquid Flux Activity, Wetting Balance Method--1/95 |
| IPC |
TM-650 |
2.4.15A |
Surface Finish, Metal Foil--3/76 |
| IPC |
TM-650 |
2.4.16A |
Initiation Tear Strength, Flexible Insulating Materials--12/82 |
| IPC |
TM-650 |
2.4.17 |
Tear Strength, Propagation--4/73 |
| IPC |
TM-650 |
2.4.17.1A |
Propagation, Tear Strength, Flexible Insulating Materials--12/82 |
| IPC |
TM-650 |
2.4.15B |
Tensile Strength and Elongation, Copper Foil--8/80 |
| IPC |
TM-650 |
2.4.15.1 |
Tensile Strength and Elongation, In-House Plating--8/97 |
| IPC |
TM-650 |
2.4.15.2 |
Hot Rupture Strength, Foil--7/89 |
| IPC |
TM-650 |
2.4.15.3 |
Tensile Strength, Elongation, and Modulus--7/95 |
| IPC |
TM-650 |
2.4.19C |
Tensile Strength and Elongation, Flexible Printed Wiring Materials--5/98 |
| IPC |
TM-650 |
2.4.20 |
Terminal Bond Strength, Flexible Printed Wiring--4/73 |
| IPC |
TM-650 |
2.4.21D |
Land Bond Strength, Unsupported Component Hole--8/97 |
| IPC |
TM-650 |
2.4.21.1C |
Bond Strength, Surface Mount Lands Perpendicular Pull Method--5/91 |
| IPC |
TM-650 |
2.4.22C |
Bow and Twist (Percentage)--6/99 |
| IPC |
TM-650 |
2.4.22.1C |
Bow and Twist-Laminate--5/93 |
| IPC |
TM-650 |
2.4.22.2 |
Substrate Curvature: Silicon Wafers with Deposited Dielectrics--7/95 |
| IPC |
TM-650 |
2.4.23 |
Soldering Resistance of Laminate Materials--3/79 |
| IPC |
TM-650 |
2.4.24C |
Glass Transition Temperature and Z-Axis Thermal Expansion by TMA--12/94 |
| IPC |
TM-650 |
2.4.24.1 |
Time to Delamination (TMA Method)--12/94 |
| IPC |
TM-650 |
2.4.24.2 |
Glass Transition Temperature of Organic Films - DMA Method--7/95 |
| IPC |
TM-650 |
2.4.24.3 |
Glass Transition Temperature of Organic Films - TMA Method--7/95 |
| IPC |
TM-650 |
2.4.24.4 |
Glass Transition and Modulus of Materials Used in High Density Interconnection
(HDI) and Microvias -DMA Method - 11/98 |
| IPC |
TM-650 |
2.4.24.5 |
Glass Transition Temperature and Thermal Expansion of Materials Used In High
Density Interconnection (HDI) and Microvias -TMA Method -11/98 |
| IPC |
TM-650 |
2.4.25C |
Glass Transition Temperature and Cure Factor by DSC--12/94 |
| IPC |
TM-650 |
2.4.26 |
Tape Test for Additive Printed Boards--3/79 |
| IPC |
TM-650 |
2.4.27.1B |
Abrasion (Taber Method), Solder Mask and Conformal Coating--1/95 |
| IPC |
TM-650 |
2.4.27.2A |
Solder Mask Abrasion (Pencil Method)--2/88 |
| IPC |
TM-650 |
2.4.28B |
Adhesion, Solder Mask (Non-Melting Metals)--8/97 |
| IPC |
TM-650 |
2.4.28.1B |
Adhesion, Solder Resist (Mask), Tape Test Method--8/97 |
| IPC |
TM-650 |
2.4.29B |
Adhesion, Solder Mask, Flexible Circuit--2/88 |
| IPC |
TM-650 |
2.4.30 |
Impact Resistance, Polymer Film--10/86 |
| IPC |
TM-650 |
2.4.31A |
Folding, Flexible Flat Cable--4/86 |
| IPC |
TM-650 |
2.4.32A |
Fold Temperature Testing, Flexible Flat Cable--4/86 |
| IPC |
TM-650 |
2.4.33C |
Flexural Fatigue and Ductility, Flat Cable--3/91 |
| IPC |
TM-650 |
2.4.34 |
Solder Paste Viscosity - T-Bar Spin Spindle Method (applicable for 300,000 to
1,600,000 Centipose)--1/95 |
| IPC |
TM-650 |
2.4.34.1 |
Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000
Centipose)--1/95 |
| IPC |
TM-650 |
2.4.34.2 |
Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000
Centipose)--1/95 |
| IPC |
TM-650 |
2.4.34.3 |
Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000
Centipose)--1/95 |
| IPC |
TM-650 |
2.4.34.4 |
Paste Flux Viscosity - T-Bar Spindle Method--1/95 |
| IPC |
TM-650 |
2.4.35 |
Solder Paste - Slump Test--1/95 |
| IPC |
TM-650 |
2.4.36B |
Rework Simulation, Plated-Through Holes for Leaded Components--8/97 |
| IPC |
TM-650 |
2.4.37A |
Evaluation of Hand Soldering Tools for Terminal Connections--7/91 |
| IPC |
TM-650 |
2.4.37.1A |
Evaluation of Hand Soldering Tools for Printed Wiring Board Applications--7/91 |
| IPC |
TM-650 |
2.4.37.2 |
Evaluation of Hand Soldering Tools on Heavy Thermal Loads--7/93 |
| IPC |
TM-650 |
2.4.38A |
Prepeg Scaled Flow Testing--6/91 |
| IPC |
TM-650 |
2.4.39A |
Dimensional Stability, Glass Reinforced Thin Laminates--2/86 |
| IPC |
TM-650 |
2.4.40 |
Inner Layer Bond Strength of Multilayer Printed Circuit Boards--10/87 |
| IPC |
TM-650 |
2.4.41 |
Coefficient of Lintear Thermal Expansion of Electrical Insulating Boards--3/86 |
| IPC |
TM-650 |
2.4.41.1A |
Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer
Method--8/97 |
| IPC |
TM-650 |
2.4.41.2 |
Coefficient of Thermal Expansion - Strain Gage Method--8/97 |
| IPC |
TM-650 |
2.4.41.3 |
In-Plane Coefficient of Thermal Expansion, Organic Films--7/95 |
| IPC |
TM-650 |
2.4.41.4 |
Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates--7/95 |
| IPC |
TM-650 |
2.4.42 |
Torsional Strength of Chip Adhesives--2/88 |
| IPC |
TM-650 |
2.4.42.1 |
High Tempreature Mechanical Strength Retention of Adhesives--3/88 |
| IPC |
TM-650 |
2.4.42.2 |
Die Shear Strength--2/98 |
| IPC |
TM-650 |
2.4.42.3 |
Wire Bond Pull Strength--2/98 |
| IPC |
TM-650 |
2.4.43 |
Solder Paste - Solder Ball Test--1/95 |
| IPC |
TM-650 |
2.4.44 |
Solder Paste - Tack Test--3/98 |
| IPC |
TM-650 |
2.4.45 |
Solder Paste - Wetting Test--1/95 |
| IPC |
TM-650 |
2.4.46 |
Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored
Wires or Preforms--1/95 |
| IPC |
TM-650 |
2.4.47 |
Flux Residue Dryness--1/95 |
| IPC |
TM-650 |
2.4.48 |
Spitting of Flux-Cored Wire Solder--1/95 |
| IPC |
TM-650 |
2.4.49 |
Solder Pool Test--1/95 |
| IPC |
TM-650 |
2.4.50 |
Thermal Conductivity, Polymer Films--7/95 |
| IPC |
TM-650 |
2.4.51 |
Self Shimming Thermally Conductive Adhesives--1/95 |
| IPC |
TM-650 |
2.5.1B |
Arc Resistance of Printed Wiring Materials--5/86 |
| IPC |
TM-650 |
2.5.2A |
Capacitance of Insulating Materials--7/75 |
| IPC |
TM-650 |
2.5.3B |
Current Breakdown, Plated Through Holes--8/97 |
| IPC |
TM-650 |
2.5.4 |
Current Carrying Capacity, Multilayer Printed Wring--4/73 |
| IPC |
TM-650 |
2.5.4.1A |
Conductor Temperature Rise Due to Current Changes in Conductors--8/97 |
| IPC |
TM-650 |
2.5.5A |
Dielectric Constant of Printed Wiring Materials--7/75 |
| IPC |
TM-650 |
2.5.5.1B |
Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of
Insulating Material at 100MHz (Contacting Electrode Systems)--5/86 |
| IPC |
TM-650 |
2.5.5.2A |
Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Clip
Method--12/87 |
| IPC |
TM-650 |
2.5.5.3C |
Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of
Materials (Two Fluid Cell Method)--12/87 |
| IPC |
TM-650 |
2.5.5.4 |
Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Micrometer
Method--10/85 |
| IPC |
TM-650 |
2.5.5.5C |
Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation
Factor) at X-Band--3/98 |
| IPC |
TM-650 |
2.5.5.5.1 |
Stripline Test for Complex Relative Permittivity of Circuit Board Materials
to 14 GHZ--3/98 |
| IPC |
TM-650 |
2.5.5.6 |
Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates--5/89 |
| IPC |
TM-650 |
2.5.5.7 |
Characteristic Impedance and Time Delay of Lines on Printed Boards by TDR--11/92
|
| IPC |
TM-650 |
2.5.5.8 |
Low Frequency Dielectric Constant and Loss Tangent, Polymer Films--7/95 |
| IPC |
TM-650 |
2.5.5.9 |
Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz--11/98 |
| IPC |
TM-650 |
2.5.6B |
Dielectric Breakdown of Rigid Printed Wiring Material--5/86 |
| IPC |
TM-650 |
2.5.6.1A |
Dielectric Strength, Polymer Solder Mask and/or Conformal Coatings--2/88 |
| IPC |
TM-650 |
2.5.6.2A |
Electric Strength of Printed Wiring Material--8/97 |
| IPC |
TM-650 |
2.5.6.3 |
Dielectric Breakdown Voltage and Dielectric Strength--10/86 |
| IPC |
TM-650 |
2.5.7C |
Dielectric Withstanding Voltage, PWB--8/97 |
| IPC |
TM-650 |
2.5.8A |
Dissipation Factor of Flexible Printed Wiring Material--7/75 |
| IPC |
TM-650 |
2.5.10A |
Insulation Resistance, Multilayer Printed Wiring (Between Layers)--12/87 |
| IPC |
TM-650 |
2.5.10.1 |
Insulation Resistivity for Adhesive Interconnection Bonds--11/98 |
| IPC |
TM-650 |
2.5.11 |
Insulation Resistance, Multilayer Printed Wiring (Within a Layer)--4/73 |
| IPC |
TM-650 |
2.5.12 |
Interconnection Resistance, Multilayer Printed Wiring--4/73 |
| IPC |
TM-650 |
2.5.13A |
Resistance of Copper Foil--3/76 |
| IPC |
TM-650 |
2.5.14A |
Resistivity of Copper Foil--8/76 |
| IPC |
TM-650 |
2.5.15A |
Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable--10/86 |
| IPC |
TM-650 |
2.5.16A |
Shorts, Internal on Multilayer Printed Wiring--11/88 |
| IPC |
TM-650 |
2.5.17E |
Volume Resistivity and Surface Resistance of Printed Wiring Materials--5/98 |
| IPC |
TM-650 |
2.5.17.1A |
Volume and Surface Resistivity of Dielectric Materials--12/94 |
| IPC |
TM-650 |
2.5.17.2 |
Volume Resistivity of Conductive Resistance Used in High Dentisty Interconnection
(HDI) and Microvias, Two-Wire Method--11/98 |
| IPC |
TM-650 |
2.5.15B |
Characteristic Impedance Flat Cables (Unbalanced)--7/84 |
| IPC |
TM-650 |
2.5.19A |
Propagation Delay of Flat Cables Using Time Domain Reflectometer--7/84 |
| IPC |
TM-650 |
2.5.19.1A |
Propagation Delay of Flat Cables Using Time Domain Reflectometer (TDR)--7/84 |
| IPC |
TM-650 |
2.5.21A |
Digital Unbalanced Crosstalk, Flat Cable--3/84 |
| IPC |
TM-650 |
2.5.24 |
Conductor Resistance, Flexible Flat Cable--6/79 |
| IPC |
TM-650 |
2.5.25A |
Dielectric Withstand Voltage Flexible Fat Cable--11/85 |
| IPC |
TM-650 |
2.5.26A |
Insulation Resistance Flexible Flat Cable--11/85 |
| IPC |
TM-650 |
2.5.27 |
Surface Insulation Resistance of Raw Printed Wiring Board Material--3/79 |
| IPC |
TM-650 |
2.5.28A |
Q Resonance, Flexible Printed Wiring Materials--4/88 |
| IPC |
TM-650 |
2.5.30 |
Balanced and Unbalanced Cable Attenuation Measurements--12/87 |
| IPC |
TM-650 |
2.5.31 |
Current Leakage (Through Overglaze Films)--12/87 |
| IPC |
TM-650 |
2.5.32 |
Resistance Test, Plated Through-Holes--12/87 |
| IPC |
TM-650 |
2.5.33 |
Measurement of Electrical Overstress from Soldering Hand Tools--11/98 |
| IPC |
TM-650 |
2.5.33.1 |
Measurement of Electrical Overstress from Soldering Hand Tools (Ground Measurements)--11/98 |
| IPC |
TM-650 |
2.5.33.2 |
Measurement of Electrical Overstress from Soldering Hand Tools (Transient Measurements)--11/98 |
| IPC |
TM-650 |
2.5.33.3 |
Measurement of Electrical Overstress from Soldering Hand Tools (Current Leakage
Measurements)--11/98 |
| IPC |
TM-650 |
2.5.33.4 |
Measurement of Electrical Overstress from Soldering Hand Tools (Shielded Enclosure)--11/98 |
| IPC |
TM-650 |
2.6.1E |
Fungus Resistance Printed Wiring Materials--8/97 |
| IPC |
TM-650 |
2.6.2C |
Water Absorption, Flexible Printed Wiring--5/98 |
| IPC |
TM-650 |
2.6.2.1A |
Water Absorption, Metal Clad Plastic Laminates--5/86 |
| IPC |
TM-650 |
2.6.3E |
Moisture and Insulation Resistance, Printed Boards--8/97 |
| IPC |
TM-650 |
2.6.3.1C |
Moisture and Insulation Resistance-Polymeric Solder Masks and Conformal Coatings--11/98 |
| IPC |
TM-650 |
2.6.3.2B |
Moisture and Insulation Resistance, Flexible Base Dielectric--5/88 |
| IPC |
TM-650 |
2.6.3.3A |
Surface Insulation Resistance, Fluxes--1/95 |
| IPC |
TM-650 |
2.6.4A |
Outgassing, Printed Boards--8/97 |
| IPC |
TM-650 |
2.6.5C |
Physical Shock, Multilayer Printed Wiring--8/97 |
| IPC |
TM-650 |
2.6.6B |
Temperature Cycling, Printed Wiring Board--12/87 |
| IPC |
TM-650 |
2.6.7A |
Thermal Shock and Continuity, Printed Board--8/97 |
| IPC |
TM-650 |
2.6.7.1 |
Thermal Shock--Polymer Solder Mask Coatings--2/88 |
| IPC |
TM-650 |
2.6.7.2A |
Thermal Shock, Continuity and Microsection, Printed Board--8/97 |
| IPC |
TM-650 |
2.6.8D |
Thermal Stress, Plated Through-Holes--3/98 |
| IPC |
TM-650 |
2.6.8.1 |
Thermal Stress, Laminate--9/91 |
| IPC |
TM-650 |
2.6.9A |
Vibration, Rigid Printed Wiring--8/97 |
| IPC |
TM-650 |
2.6.9.1 |
Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy--1/95 |
| IPC |
TM-650 |
2.6.9.2 |
Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy--1/95 |
| IPC |
TM-650 |
2.6.10A |
X-Ray (Radiography), Multilayer Printed Wiring Board Test Methods--8/97 |
| IPC |
TM-650 |
2.6.11B |
Hydrolytic Stability Solder Mask and/or Conformal Coating--11/88 |
| IPC |
TM-650 |
2.6.12 |
Temperature Testing, Flexible Flat Cable--6/79 |
| IPC |
TM-650 |
2.6.13 |
Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed
Wiring--10/85 |
| IPC |
TM-650 |
2.6.14A |
Resistance to Electrochemical Migration, Polymer Solder Mask--8/87 |
| IPC |
TM-650 |
2.6.15B |
Corrosion, Flux--1/95 |
| IPC |
TM-650 |
2.6.16 |
Pressure Vessel Method for Glass Epoxy Laminate Integrity--7/85 |
| IPC |
TM-650 |
2.6.16.1 |
Moisture Resistance of HDIS Under High Temperature and Pressure (Pressure Vessel)--8/98 |
| IPC |
TM-650 |
2.6.17 |
Hydrolitic Stability, Flexible Printed Wiring Material--12/82 |
| IPC |
TM-650 |
2.6.15A |
Low Temperature Flexibility, Flexible Printed Wiring Materials--7/85 |
| IPC |
TM-650 |
2.6.19 |
Environmental and Insulation Resistance Test of Hybrid Ceramic Multilayer Substrate
Boards--12/87 |
| IPC |
TM-650 |
2.6.20A |
Assessment of Plastic Encapsulated Electronic Components for Susceptibility
to Moisture/Reflow Induced Damage--1/95 |
| IPC |
TM-650 |
2.6.21 |
Service Temperature of Flexible Printed Wiring--12/88 |
| IPC |
TM-650 |
2.6.22 |
Superseded by J-STD-035 |
| IPC |
TM-650 |
2.6.23 |
Test Procedure for Steam Ager Temperature Repeatability--7/93 |
| JEDEC |
JESD-22 |
22-A100-A |
Cycled Temperature Humidity Bias Life Test |
| JEDEC |
JESD-22 |
22-A101-B |
Steady State Temperature Humidity Bias Life Test |
| JEDEC |
JESD-22 |
22-A102-B |
Accelerated Moisture Resistance - Unbiased Autoclave |
| JEDEC |
JESD-22 |
22-A103-A |
High Temperature Storage Life |
| JEDEC |
JESD-22 |
22-A104-A |
Temperature Cycling |
| JEDEC |
JESD-22 |
22-A105-B |
Power and Temperature Cycling |
| JEDEC |
JESD-22 |
22-A106-A |
Thermal Shock |
| JEDEC |
JESD-22 |
22-A107-A |
Salt Atmosphere |
| JEDEC |
JESD-22 |
22-A108-A |
Bias Life |
| JEDEC |
JESD-22 |
22-A109 |
Hermeticity |
| JEDEC |
JESD-22 |
22-A110-B |
Highly-Accelerated Temperature and Humidity Stress Test (HAST) |
| JEDEC |
JESD-22 |
22-A112-A |
Moisture-Induced Stress Sensitivity for Plastic Surface Mount Devices |
| JEDEC |
JESD-22 |
22-A113-B |
Preconditioning of Nonhermetic Surface Mount Devices prior to Reliability Testing |
| JEDEC |
JESD-22 |
22-A114-A |
Electrostatic Discharge (ESD) Sensitivity Testing, Human Body Model (HBM) |
| JEDEC |
JESD-22 |
22-A115-A |
Electrostatic Discharge (ESD) Sensitivity Testing, Machine Model (MM) |
| JEDEC |
JESD-22 |
22-B100-A |
Physical Dimensions |
| JEDEC |
JESD-22 |
22-B101 |
External Visual |
| JEDEC |
JESD-22 |
22-B102-C |
Solderability |
| JEDEC |
JESD-22 |
22-B103-A |
Vibration, Variable Frequency |
| JEDEC |
JESD-22 |
22-B104-A |
Mechanical Shock |
| JEDEC |
JESD-22 |
22-B105-A |
Lead Integrity |
| JEDEC |
JESD-22 |
22-B106-B |
Resistance to Soldering Temperature for Through-Hole Mounted Devices |
| JEDEC |
JESD-22 |
22-B107-A |
Marking Permanency |
| JEDEC |
JESD-22 |
22-B108 |
Coplanarity Test for Surface-Mount Semiconductor Devices |
| JEDEC |
JESD-22 |
22-C100-A |
High Temperature Continuity |
| JEDEC |
JESD-22 |
22-C101 |
Field-Induced Charged-Device Model Test Method for Electrostatic Discharge Withstand
Thresholds of Microelectronic Components |
Thanks to the University of Maryland CALCE website
for the info.