Electronic Design Innovation Conference (EDI CON) Expands into the U.S. Market |
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Electronic Design Innovation Conference (EDI CON) Expands into the U.S. Market First event will be held in Boston, Mass. September 20-22, 2016 May 5, 2015 (Norwood, Mass.) - Horizon House Publications and Microwave Journal announce that their annual RF/microwave, EMC/EMI and high-speed digital Electronic Design Conference and exhibition, EDI CON, is expanding into the U.S. market after three successful events in Beijing, China. EDI CON China drew more than 2,600 attendees at the April 2015 event held at the China National Convention Center (CNCC). Each year the event has grown 10 to 20 percent and is on target to become the largest RF/microwave and high-speed digital design event in China next year. The first EDI CON USA will take place September 20-22, 2016 at the Hynes Convention Center in Boston, Mass. Boston has an extensive electronic design industry especially in the RF/microwave area where many industry leading companies reside in the New England region. Horizon House president , Ivar Bazzy, said, "It is a natural extension of the popular industry driven EDI CON platform to expand to the USA, one of the largest electronics design markets in the world. Microwave Journal is a leading media brand in the RF/microwave market and will be an active promotional partner along with taking the technical lead on the conference side with their design expertise." EDI CON USA will partner with other media and engineering organizations to promote the event in the RF/microwave, EMC/EMI and high-speed digital design markets. EDI CON USA will only take place in cities with a large concentration of RF/microwave and high-speed digital engineers such as Boston/New England, Baltimore/Washington DC, San Diego/Los Angeles and San Francisco/Santa Clara. Boston is a natural first choice with Horizon House/Microwave Journal headquarters located just west of Boston. EDI CON USA will partner with Keysight Technologies, as they do with EDI CON China, as Keysight takes the host sponsorship role, and Rohde & Schwarz will be the Diamond sponsor. EDI CON USA will offer key sponsorships to its other EDI CON China partners such as, National Instruments/AWR, Mini-Circuits, Anritsu, Richardson RFPD, CST, ANSYS, RFHIC, Peregrine, MACOM and others. The first EDI CON USA event expects to attract thousands of engineers through its sponsors, international electronic design companies and local New England companies such as Raytheon, BAe Systems, Mercury Systems, Cobham/Aeroflex, Skyworks, MACOM, Qorvo, ADI/Hittite, Rogers Corp. and others. Unlike most trade shows in the industry that tend to run a more academically oriented conference, EDI CON is an industry driven event where most of the sessions are given by experts from leading companies in the industry about practical applications for today's design challenges. This provides an educational event that is more practical for engineers and designers facing rapidly changing markets and technologies. Coupled closely with the conference is the exhibition where engineers can learn more about the products, services and solutions discussed in the conference that can solve their engineering challenges which in turn provides a high ROI for the sponsors. To learn more, visit the web site at www.ediconusa.com. About EDI CON EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The technical program and exhibition includes the leading international RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers. The conference features the most recent trends in high-frequency electronics and wireless communication technology, addressing all aspects of design, simulation and test verification through an understanding of system requirements for wireless communication networks such as small cell infrastructure, SATCOM and microwave backhaul. About Horizon House Horizon House is an experienced and well-established organizer of targeted events, including European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA), and several major microwave related conferences/exhibitions such as the RF/Microwave, M2M and Microwave Backhaul Zones at CTIA. Microwave Journal, a Horizon House Publication, will actively promote and publicize EDI CON USA 2016 to engineers, technology companies and academia, while also providing input from, and a link to, the wider high speed, high frequency, RF and microwave community. For information on the conference program, ongoing updates and major announcements or to register for EDI CON USA 2016 visit: www.EDICONUSA.com.
Contacts: North America:
International:
Posted April 5, 2015 |
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