|
 |
Hittite Expands Its Optical Modulator Driver Product Line
|
January 28, 2013 Press Release
-- 32 Gbps Compact Dual Channel Optical Modulator Driver
Swings 8 Vp-p
Chelmsford, MA, 1/28/2013 - Hittite Microwave Corporation,
the world class supplier of complete MMIC based solutions for communication & military markets,
has released a compact dual channel 32 Gbps Mach-Zehnder Optical Modulator Driver to further
expand its fiber optics portfolio to support the next generation of 40 Gbps and 100 Gbps Metro
and Long-haul applications. The
HMC6620BG
is the first dual channel modulator driver in a compact BGA package with excellent channel-to-channel
isolation of > 30 dB up to 30 GHz and optional top or bottom cooling capability to ease space
constrained module designs.
  Features
such as high gain across a wide frequency range, low power dissipation, compact size, integrated
peak detector function, fast rise/fall time, and integrated bias-tee inductor make the
HMC6620BG
a best-in-class product. The driver provides 8 Vp-p saturated output swing up to 32 Gbps
and features output swing cross point adjustment. With a wide supply operating range from +5V
to +7V, the HMC6620BG
is an environmentally friendly product consuming only 0.9 W of power with output swing of 6V
and supply at +5V.
The
HMC6620BG
provides Long Haul system designers with scalable power dissipation for varying output drive
requirements. The integrated peak detector function enables monitoring and maintains a constant
output swing from the modulator driver to help designers improve system lifetime margin. Integrated
high speed bias-tee eliminates the requirement for external components. The
HMC6620BG
can interface with the
HMC981LP3E
active bias controller, enabling stability of performance over all operating conditions. The
HMC6620BG
is rated for operations from -5 °C to +85 °C, provides up to 30 dB of gain, exhibits very low
additive rms jitter of 300 fs and supports up to 32 Gbps operation. The output swing is adjustable
from 5 Vp-p to 8.5 Vp-p.
Detailed package design reduces the channel-to-channel
skew to only 1ps. The HMC6620BG
is housed in 13.76 mm x 13 mm x 3.63 mm laminate substrate based BGA surface-mount package with
integrated ESD protection. Samples and evaluation PC boards for all SMT packaged products are
available from stock and can be ordered via the company's e-commerce site or via direct purchase
order. Request a data sheet on-line at www.hittite.com.
Follow Hittite on Twitter: @HittiteMWCorp
[borders/inc-300x250.htm]About
Hittite Microwave
Hittite Microwave Corporation is an innovative designer and
manufacturer of high performance integrated circuits, or ICs, modules, subsystems and instrumentation
for technically demanding digital, RF, microwave and millimeterwave applications covering DC
to 110 GHz. The Company's standard and custom products apply analog, digital and mixed-signal
semiconductor technologies, which are used in a wide variety of wireless / wired communication
and sensor applications for Automotive, Broadband, Cellular Infrastructure, Fiber Optics &
Networking, Microwave & Millimeterwave Communications, Military, Test & Measurement,
and Space markets. The Company is headquartered in Chelmsford, Massachusetts.
Contact
Beth McGreevy
Marketing Communications Manager
mcgreevy@hittite.com
Hittite Microwave Corporation
2 Elizabeth Dr.
Chelmsford,
MA 01824
978-250-3343, ext. 1117
978-250-3373 Fax
Posted 1/28/2013
|
|
|
|
