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AWR Kicks off ADF 2013 This July in Asia
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EL SEGUNDO, Calif. – April 29, 2013 –
AWR Corporation,
the innovation leader in high-frequency EDA software, today announced
the start of its
AWR Design
Forum 2013 tour with a diverse schedule of dates and venues in the
Asia Pacific region starting this summer. ADF is an open event
at which designers of microwave and RF circuits and systems such as
MMIC, RF PCB, and LTE can network and share useful information and resources
pertinent to high-frequency design, discuss AWR products and technologies,
and collaborate on industry issues and trends. Details are available
at http://www.awrcorp.com/ADF2013.
Locations and Dates:
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Seoul, Korea - July 8, 2013
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Tokyo, Japan - July 12, 2013
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Nanjing, China - September 4, 2013
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Shanghai, China - September 5, 2013
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Taipei, Taiwan - September 10, 2013
Call for Papers:
[borders/inc-300x250.htm]ADF
also provides an opportunity for the presentation of interesting and
informative papers from customers and partners working in the microwave &
RF industry, as well as from research and educational institutions.
The Call for Papers is now open and suggested topics include but are
not limited to MMIC design, communications system and radar simulation,
microwave components, RF and microwave circuit boards, and RF SoCs,
SiPs, and modules. All presentations will be made available for download
from the AWR website after the event concludes. Additionally, speaker
gifts and a lucky draw will be provided. For deadlines and more
information, visit
http://www.awrcorp.com/ADF2013/call-papers.
About AWR
AWR, the innovation leader in
high-frequency EDA software, dramatically reduces development time and
cost for products employed in wireless, high-speed wired, broadband,
aerospace and defense, and electro-optical applications.
Learn more at www.awrcorp.com
Contacts:
Sherry Hess
Vice President
of Marketing
AWR Corporation
(310) 726-3000
hess@awrcorp.com
Posted
5/1/2013
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