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AWR Sponsors and Exhibits at EDICON 2013
Presents a Wide Array
of Technical Papers and Workshops
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EL SEGUNDO, Calif. – Feb. 26, 2013
 What:
AWR is a gold sponsor at the
Electronic Design
Innovations Conference ( EDICON) 2013, which runs from March 12
-14 in Beijing, China. Together with parent company National Instruments,
AWR will be showcasing at Booth #255 joint hardware/software solutions,
as well as the first update in 2013 of the AWR Design Environment™,
inclusive of Microwave Office®/Analog Office® circuit design software,
Visual System Simulator™ (VSS) system design software, as well as AXIEM®
3D planar electromagnetic (EM) software and Analyst™ 3D finite element
method (FEM) EM software.
In addition to software demonstrations
within booth #255, AWR will present a number of papers and workshops
that include:
- Design of a Novel Multi-Slot Antenna
- MMIC Design Workshop: Design Methodology for GaAs MMIC 1 Watt
X-band PA
- RF Power Amplifier IIB: Device Characterization Methods for
Advanced RF/Microwave Design
- Fully Integrating 3D Electromagnetic (EM) Simulation into Circuit
Simulation
- Digital Pre-Distortion Techniques Workshop:
- Optimizing the Design and Verification
of 4G RF Power Amplifiers
- Simulating an NXP Doherty Power Amplifier with Digital Pre-Distortion
[borders/inc-300x250.htm]For
more information about AWR’s activities at EDICON 2013 and the detailed
schedule of AWR conference papers and workshops, please visit
http://www.awrcorp.com/news/events/event/edi-con-2013.
Where:
Booth #255, Beijing International Convention Center, Beijing, China
When:
March 12-14, 2013
Contacts:
Sherry Hess
Vice
President of Marketing
AWR Corporation
(310) 726-3000
hess@awrcorp.com
Posted 2/26/2013
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