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 Wire bonding is the primary method of making interconnections
between an integrated circuit (IC) and a printed circuit board (PCB) during semiconductor
device fabrication. Although less common, wire bonding can be used to connect an IC to other
electronics or to connect from one PCB to another. Wire bonding is generally considered the
most cost-effective and flexible interconnect technology, and is used to assemble the vast
majority of semiconductor packages. Bond wires usually consist of one of the following materials:
Gold - Aluminum - Copper. Wire diameters start at 15 µm and can be up to several hundred micrometers
for high-powered applications. There are two main classes of wire bonding: Ball bonding and
Wedge bonding. Ball bonding usually is restricted to gold and copper wire and usually requires
heat. Wedge bonding can use either gold or aluminum wire, with only the gold wire requiring
heat. -Wikipedia
These values (for a constant current) are typical for standard industry bond wire, and could vary from one product
to another.
Here is an article gives equations for calculating fusing current when the duty
cycle is very small, "Bond Wire Fusing in ICs with Pulsed
Current." Note that much larger currents can be handled with very short pulses. Here
is the whitepaper for
the formula.
This study by Sandia National Laboratories is titled, "1
Mil Gold Bond Wire Study."
| Gold |
1.00 |
0.79 |
1.16 |
0.6-0.7 |
4 x 4 |
| 1.30 |
1.33 |
0.693 |
0.9-1.0 |
5 x 5 |
| 1.50 |
1.77 |
0.521 |
1.2-1.4 |
6 x 6 |
| 2.00 |
3.14 |
0.294 |
1.6-2.0 |
8 x 8 |
| Aluminum |
1.00 |
0.79 |
1.33 |
0.27-0.30 |
3.5 x 3.5 |
| 1.25 |
1.23 |
0.856 |
0.4-0.5 |
4 x 4 |
| 1.50 |
1.77 |
0.595 |
0.6-0.7 |
6 x 6 |
| 2.00 |
3.14 |
0.335 |
1.0-1.2 |
6 x 8 |
| 3.00 |
7.07 |
0.149 |
2-2.5 |
9 x 12 |
| 4.00 |
12.57 |
0.0838 |
3.5-4.0 |
12 x 20 |
| 5.00 |
19.63 |
0.0537 |
5-6 |
15 x 25 |
| 8.00 |
50.27 |
0.0210 |
11-12 |
20 x 32 |
| 10.00 |
78.54 |
0.0134 |
16-18 |
25 x 40 |
| 12.00 |
113.10 |
0.0093 |
21-23 |
30 x 48 |
| 15.00 |
176.71 |
0.0059 |
20-35 |
40 x 60 |
| 20.00 |
314.16 |
0.0033 |
50-60 |
50 x 80 |
99.99% purity @ 20°C
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