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Exodus Advanced Communications

IC Package Outlines
Click on the image of the package family of interest for dimensioned drawings of common pin counts.

For detailed PCB layout drawings click here to go to the Semiconductor Vendor Links page on RF Cafe. See table of package information at bottom of page.












DIP
(Dual Inline Package) 		SOIC
(Small Outline Integrated Circuit)
DIP package drawing - RF Cafe SOIC package drawing - RF Cafe
PLCC
(Plastic Leaded Chip Carrier)		 LCC
PLCC package drawing - RF Cafe LCC package drawing - RF Cafe
TO
(Transistor Outline)		 TSSOP
(Thin Shrink Small Outline Package)
TO package drawing - RF Cafe  TO package drawing - RF Cafe TSSOP package drawing - RF Cafe
SOT
(Small Outline Transistor)		 SSOP
(Shrink Small Outline Package)
SOT package drawing - RF Cafe  

Small Package Designations
Designation Package
DIP Dual inline package
MSOP Micro SOP
PDIP Plastic DIP
QSOP Quarter SOP
SIP Single inline package
SOIC (or SO) Small-outline IC
SOJ J-lead SOP
SOP Small-outline package
SOT Small-outline transistor
SSOP Shrink SOP
TSOP Thin SOP
TSSOP Thin shrink SOP
TVSOP Thin very fine SOP
Note: These designations are often followed by numbers that indicate the number of leads.

Small Package Dimensions
Package designation
and pin count		 Nominal body size
(L3W3H) (mm)		 Total footprint
(L3W) (mm)		 Lead pitch
(mm)
DIP-8 10×6×5 5×7.5 2.54 (0.1 in.)
SO-8 5×4×1.75 5×6 1.27 (0.05 in.)
SSOP-8 3×5.3×2 3×8 0.65
TSSOP-8 3×4.4×1.2 3×6.4 0.65
MSOP-8 3×3×1.1 3×5 0.65
TVSOP-14 3.6×4.4×1.2 3×6.4 0.4
QSOP-16 4.9×3.9×1.7 4.9×6 0.635 (0.025 in.)
SOT23-5 3×1.6×1 3×3 0.95
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    BSEE - KB3UON

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