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IC Package Outlines |
Click on the image of the package family of interest for dimensioned drawings of common pin counts.
For detailed PCB layout drawings click here to go to the Semiconductor Vendor Links page on RF Cafe. See table of package information at bottom of page.
DIP
(Dual Inline Package) | SOIC
(Small Outline Integrated Circuit) |  |  | PLCC
(Plastic Leaded Chip Carrier) | LCC |  |  | TO
(Transistor Outline) | TSSOP
(Thin Shrink Small Outline Package) |   |  | SOT
(Small Outline Transistor) | SSOP
(Shrink Small Outline Package) |  | |
Small Package Designations
| | Designation | Package | | DIP | Dual inline package | | MSOP | Micro SOP | | PDIP | Plastic DIP | | QSOP | Quarter SOP | | SIP | Single inline package | | SOIC (or SO) | Small-outline IC | | SOJ | J-lead SOP | | SOP | Small-outline package | | SOT | Small-outline transistor | | SSOP | Shrink SOP | | TSOP | Thin SOP | | TSSOP | Thin shrink SOP | | TVSOP | Thin very fine SOP | | Note: These designations are often followed by numbers that indicate the number of leads. |
| Small Package Dimensions | Package designation
and pin count | Nominal body size
(L3W3H) (mm) | Total footprint
(L3W) (mm) | Lead pitch
(mm) | | DIP-8 | 10×6×5 | 5×7.5 | 2.54 (0.1 in.) | | SO-8 | 5×4×1.75 | 5×6 | 1.27 (0.05 in.) | | SSOP-8 | 3×5.3×2 | 3×8 | 0.65 | | TSSOP-8 | 3×4.4×1.2 | 3×6.4 | 0.65 | | MSOP-8 | 3×3×1.1 | 3×5 | 0.65 | | TVSOP-14 | 3.6×4.4×1.2 | 3×6.4 | 0.4 | | QSOP-16 | 4.9×3.9×1.7 | 4.9×6 | 0.635 (0.025 in.) | | SOT23-5 | 3×1.6×1 | 3×3 | 0.95 |
Webmaster: Kirt Blattenberger, BSEE, UVM 1989 | |
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