Greetings: There is so much good stuff on RF Cafe that there is no way to list or
link to all of it here. Please use the Search box or the Site
Map to find what you want - there is a good chance I have it. Thanks!
Thin shrink small-outline
packages, or TSSOPs are a type of surface mount IC package. They are notably very low-profile (about 1mm) and have
tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs dues to their high pin
count and small volume. However, they are being supplanted by ball grid array packages which can achieve even
higher densities. - Wikipedia