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Attendees earn IEEE CEU/PDHs while learning from industry leaders in RF, microwave,
signal integrity, and power integrity.
July 23, 2018 (Norwood, Mass.) - Electronic Design Innovation Conference and Exhibition (EDI CON)
USA, the industry event that brings together RF/microwave and high-speed digital design
engineers and system integrators, is pleased to introduce its EDI CON University 2018
program at its event this October 17 and 18 at the Santa Clara Convention Center. These
2-hour sessions offer in-depth training in a particular topic, such as MIMO Test, Amplifier
Design, and Measuring Impedance.
All conference pass holders are eligible to attend, but pre-registration happens during
the registration process. After attending an
EDI CON University
course, attendees can earn IEEE Continuing Education Unit/Personal Development Hour
(CEU/PDH) certificates and enjoy a complimentary lunch on the expo floor. This year's
EDI CON University sessions are sponsored by Teledyne LeCroy, Mini-Circuits, and Keysight
Technologies. Here is this year's line up:
Wednesday, Oct. 17, 9-11AM, 3 courses to choose from:
Antenna Design for IoT, Henry Lau,
This course offers participants technical insights on the vital aspects of antenna
design from an industrial and practical perspective. It covers fundamental theory, concepts &
definitions to the features, specifications and performance of different types of commonly-used
and advanced antennas found in IoT products. Practical implementation strategies on overall
product design for optimum antenna performance will also be presented.
Millimeter Wave Measurement Insights, Gennady Farber & Suren
Singh, Keysight Technologies
Sponsored by Keysight Technologies, this university session covers both millimeter
wave measurement challenges and specific techniques for component characterization. The
first presentation covers the basics of making measurements at millimeter-wave frequencies
as it relates to transmission line theory, connector topology, and over-the-air transmission
and will also examine a number of associated design and measurement challenges at these
wider bandwidths. The second presentation focuses on how a vector network analyzer can
be used to address the need for millimeter-wave component characterization for both passive
and active devices and will include real-life measurement examples.
How to Measure Ultra-Low Impedance (100 uOhm) and Lower PDNs,
Steve Sandler, Picotest
Today, it is common to see 500 uOhm power rails, but more recently the bleeding
edge is below 100 uOhms. Measuring 100 uOhms is a significant challenge, even
using the venerable 2-port shunt-thru measurement that has served as the staple of ultra-low
impedance measurement. At these ultra-low impedance levels everything matters, from the
quality of the instrument interconnects, to the quality of the ground loop isolator.
In this tutorial, you'll learn some techniques that will improve the accuracy and fidelity
of your sub 100 uOhm measurements. You'll learn the pros and cons of the 2-port
vs 3-port measurement technique. With a little bit of luck, we'll demonstrate a 100 uOhm
impedance measurement as well as showing some measurements that highlight the challenges
you'll face along the way.
Thursday, Oct. 18, 9-11AM; 3 courses to choose from:
Real Time Spectral Analysis of Power Rail Noise, Eric Bogatin,
Sponsored by Teledyne LeCroy, this session begins by noting that while the real world
is the time domain, sometimes we can gain insight about the origin of problems by looking
in the frequency domain. For some types of products, such as analog parts, mixed signal
or clock generation, very low levels of power rail noise can have a big impact on performance.
Sometimes the best way of finding these noise sources is by frequency domain analysis.
In this seminar, we introduce the best measurement practices for analyzing the real time
spectra of signals and apply these methods to power rail noise to provide insight into
the root cause of the problems.
High-Speed Board Design Rules to Get Your PCB Designed Right the First Time,
Shalom-Shlomi Zigdon, itech-icollege.com
Understanding the principles of signal/power integrity and EMI by the electronic engineer
is necessary, but, unfortunately, our experience does not guarantee the successful functioning
of the system. Converting the principles into quantities built by the PCB layout designer
will bring us closer to this goal. This lecture will cover 10 critical issues regarding
the return current path and bypass capacitors roles, crosstalk by coupling, gap crossing,
layers construction and order, stitching vias, and Faraday cages. All of these topics
are converted into a guide that is concise but effective and proven to achieve the goals.
Build Your Own VNA, Aleksey Amitai, Vayyar Imaging & Aaron Vaisman,
Sponsored by Mini-Circuits, this hands-on course is designed for university students,
graduate students, engineers who are early in their career, or anyone who wants a better
understanding of how measurements actually work and what effect a good measurement has
on your design. The goal of this course is to bridge the gap between academics and real-world
engineering. Attendees will work in teams to build a VNA, load the scripts, talk about
the math behind the measurements, make a measurement, and see if they got the measurement
correct. Topics covered include: transmission line theory and lab measurements, basics
of s-parameter measurements, and construction of a VNA.
In addition to two full days of conference programming, including the above courses,
plenary keynote talks, technical papers, workshops, and panels, EDI CON USA includes
a celebration of innovation in the EDI CON EXPO hall, complete with show-floor networking
opportunities and speed trainings.
More information and registration is available online. EDI CON
USA 2018 is supported by its primary media sponsors,
Microwave Journal and
Signal Integrity Journal.
More information, including how to exhibit at EDI CON USA 2018, is available at
About EDI CON USA
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital
design engineers and system integrators for networking, training, and learning opportunities.
Attendees come to EDI CON USA to find solutions, products, and design ideas that they
can put into immediate practice for today's communication, defense, consumer electronics,
aerospace, and medical industries. Drawing attendees from both the analog and digital
spheres, EDI CON enables designers to see techniques and technologies used in other applications
that could be applied or adapted to solve their latest design challenges. The exhibition
hall features product displays, demonstrations, interactive sessions, speed trainings,
networking opportunities, and educational talks that address all aspects of design, simulation,
test, and verification. www.ediconusa.com
About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal,
and the event planning division of their parent company, Horizon House. Microwave
Journal, Signal Integrity Journal, and Horizon House also team with Microwave
Journal China and ACT International (Hong Kong) to organize and produce EDI CON
China (March 20-22, 2018 in Beijing, China). An experienced and well-established organizer
of targeted events, Horizon House additionally organizes European Microwave Week (EuMW)
on behalf of the European Microwave Association (EuMA). To subscribe to Signal Integrity
Journal, visit www.signalintegrityjournal.com.
To subscribe to the Microwave Journal, visit http://www.mwjournal.com.
Phone: (852) 28386298
Posted July 24, 2018