EDI CON USA 2018 Announces EDI CON University

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Attendees earn IEEE CEU/PDHs while learning from industry leaders in RF, microwave, signal integrity, and power integrity.

July 23, 2018 (Norwood, Mass.) - Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the industry event that brings together RF/microwave and high-speed digital design engineers and system integrators, is pleased to introduce its EDI CON University 2018 program at its event this October 17 and 18 at the Santa Clara Convention Center. These 2-hour sessions offer in-depth training in a particular topic, such as MIMO Test, Amplifier Design, and Measuring Impedance.

All conference pass holders are eligible to attend, but pre-registration happens during the registration process. After attending an EDI CON University course, attendees can earn IEEE Continuing Education Unit/Personal Development Hour (CEU/PDH) certificates and enjoy a complimentary lunch on the expo floor. This year's EDI CON University sessions are sponsored by Teledyne LeCroy, Mini-Circuits, and Keysight Technologies. Here is this year's line up:

This course offers participants technical insights on the vital aspects of antenna design from an industrial and practical perspective. It covers fundamental theory, concepts & definitions to the features, specifications and performance of different types of commonly-used and advanced antennas found in IoT products. Practical implementation strategies on overall product design for optimum antenna performance will also be presented.

Millimeter Wave Measurement Insights, Gennady Farber & Suren Singh, Keysight Technologies

Sponsored by Keysight Technologies, this university session covers both millimeter wave measurement challenges and specific techniques for component characterization. The first presentation covers the basics of making measurements at millimeter-wave frequencies as it relates to transmission line theory, connector topology, and over-the-air transmission and will also examine a number of associated design and measurement challenges at these wider bandwidths. The second presentation focuses on how a vector network analyzer can be used to address the need for millimeter-wave component characterization for both passive and active devices and will include real-life measurement examples.

How to Measure Ultra-Low Impedance (100 uOhm) and Lower PDNs, Steve Sandler, Picotest

Today, it is common to see 500 uOhm power rails, but more recently the bleeding edge is below 100 uOhms. Measuring 100 uOhms is a significant challenge, even using the venerable 2-port shunt-thru measurement that has served as the staple of ultra-low impedance measurement. At these ultra-low impedance levels everything matters, from the quality of the instrument interconnects, to the quality of the ground loop isolator. In this tutorial, you'll learn some techniques that will improve the accuracy and fidelity of your sub 100 uOhm measurements. You'll learn the pros and cons of the 2-port vs 3-port measurement technique. With a little bit of luck, we'll demonstrate a 100 uOhm impedance measurement as well as showing some measurements that highlight the challenges you'll face along the way.

Real Time Spectral Analysis of Power Rail Noise, Eric Bogatin, Teledyne LeCroy

Sponsored by Teledyne LeCroy, this session begins by noting that while the real world is the time domain, sometimes we can gain insight about the origin of problems by looking in the frequency domain. For some types of products, such as analog parts, mixed signal or clock generation, very low levels of power rail noise can have a big impact on performance. Sometimes the best way of finding these noise sources is by frequency domain analysis. In this seminar, we introduce the best measurement practices for analyzing the real time spectra of signals and apply these methods to power rail noise to provide insight into the root cause of the problems.

High-Speed Board Design Rules to Get Your PCB Designed Right the First Time, Shalom-Shlomi Zigdon, itech-icollege.com

Understanding the principles of signal/power integrity and EMI by the electronic engineer is necessary, but, unfortunately, our experience does not guarantee the successful functioning of the system. Converting the principles into quantities built by the PCB layout designer will bring us closer to this goal. This lecture will cover 10 critical issues regarding the return current path and bypass capacitors roles, crosstalk by coupling, gap crossing, layers construction and order, stitching vias, and Faraday cages. All of these topics are converted into a guide that is concise but effective and proven to achieve the goals.

Build Your Own VNA, Aleksey Amitai, Vayyar Imaging & Aaron Vaisman, Mini-Circuits.

Sponsored by Mini-Circuits, this hands-on course is designed for university students, graduate students, engineers who are early in their career, or anyone who wants a better understanding of how measurements actually work and what effect a good measurement has on your design. The goal of this course is to bridge the gap between academics and real-world engineering. Attendees will work in teams to build a VNA, load the scripts, talk about the math behind the measurements, make a measurement, and see if they got the measurement correct. Topics covered include: transmission line theory and lab measurements, basics of s-parameter measurements, and construction of a VNA.

In addition to two full days of conference programming, including the above courses, plenary keynote talks, technical papers, workshops, and panels, EDI CON USA includes a celebration of innovation in the EDI CON EXPO hall, complete with show-floor networking opportunities and speed trainings.

EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification. www.ediconusa.com

EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (March 20-22, 2018 in Beijing, China). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA). To subscribe to Signal Integrity Journal, visit www.signalintegrityjournal.com. To subscribe to the Microwave Journal, visit http://www.mwjournal.com.