|US Microwave is a supplier of a
broad range of standard thin film and semiconductor products for very high microwave
MIC Technology for custom microwave thin film circuits
High Q and High Self-Resonance Microwave Spiral Chip Inductors
Microwave MOS, Binary and MNOS, MIS & MIM Capacitors
Microwave High Q Single-Layer Dielectric Chip Capacitors
Microwave High Q Single-Layer Quartz Chip Capacitors to 100
Quartz Microwave Thin-Film Chip resistors to >40 GHz, Single
RF & Microwave Thin Film AlN & BeO Power Resistors
Known Good Die (KGD) IC Bare Die for Analog and Microwave
Hybrid Thin Film Circuits
For more information, contact
US Microwaves (a
division of Semiconix Corporation)
2964-2966 Scott Blvd
Additional information can be found at
Text and images copied from US Microwaves copyrighted material.
US Microwaves capabilities encompass
circuit / layout design, process design/simulations, mask manufacturing, substrate
laser machining, sputtering depositions, patterning, electroplating, etching, PECVD
dielectric depositions, vacuum and controlled atmosphere annealing, dicing, E-test,
visual inspections, die attach, wire bonding, waffle packing, custom housings, etc.
The wafer fabrication plant is located in Santa Clara, California. All critical
wafer fabrication steps are conducted in a class 10 environment to ensure highest
yields and reliability of our products.
US Microwaves starts production cycles for microwave thin film circuits with
sophisticated layout design tools and experienced design engineers that convert
customers requirements in data that is fed to the mask shop operation. In the mask
shop, 10x and 4x steppers are used for generating high quality chrome masks.
Typical turn around for the masks is 24 hours from receipt of customer data.
Ceramic substrates are coated via sputter deposition and further processed through
photolithography, electroplating, plasma etching, annealing, dicing, e-testing,
visual inspection, waffle packaging.