Tips for Increasing Yields When Wire Bonding Small MESA Chips

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KirtB
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Tips for Increasing Yields When Wire Bonding Small MESA Chips

Post by KirtB » Mon Jul 24, 2017 1:32 pm

Tips for Increasing Yields When Wire Bonding Small MESA Chips

Many moons ago (early-mid 1980s), I did quite a bit of microcircuit assembly and wire bonding in an engineering prototype lab at Westinghouse. It was a unique and valuable experience. When this app note notice showed up in a recent edition of NASA tech Briefs, I though it would be good to let you know about. "The common failure modes of wire bonds, for instance cratering / peeling, bond wire damage, trailing wire bond tails, poor adhesion, and missed bond pads, are exacerbated when wire bonding small MESA chips. There are many variables that need to be balanced to optimize a wire bond process, and limit the amount of time consuming and costly ..." http://www.semigen.net/increasing-yields-wire-bonding-mesa-chips
Kirt Blattenberger
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