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Microelectronic Packaging Engineer

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Posted 4/21/2011

Microelectronic Packaging Engineer

Location: Cedar Rapids

PRIMARY RESPONSIBILITY:
• Support the design, prototype assembly, documentation and release to production of new RFIC and multi-chip module (MCM) packages using appropriate technology.
• Acts as a liaison with internal Advanced Packaging Group, Suppliers, and Internal and External Manufacturing.
• Direct and potentially manage Packaging resources used in design, development and documentation of industry leading wireless semiconductor products.
• Using appropriate tools, perform product cost trade-offs, package integrity analysis (thermal, mechanical, cross-sectioning, assembly process, etc.) for customer and internal requirements.
• Define package requirements for product groups assuring compliance with customer and internal Quality and Reliability requirements.
• Support the design and development of test fixture assemblies for product development and production test.


BS required + minimum 5 years experience. MS preferred


deb.bunting@skyworksinc.com for more info.