Authority | Standard | Test Method | Title |
DoD | MIL-STD-883E | 1001 | Barometric pressure, reduced (altitude operation) |
DoD | MIL-STD-883E | 1002 | Immersion |
DoD | MIL-STD-883E | 1003 | Insulation resistance |
DoD | MIL-STD-883E | 1004.7 | Moisture resistance |
DoD | MIL-STD-883E | 1005.8 | Steady state life |
DoD | MIL-STD-883E | 1006 | Intermittent life |
DoD | MIL-STD-883E | 1007 | Agree life |
DoD | MIL-STD-883E | 1008.2 | Stabilization bake |
DoD | MIL-STD-883E | 1009.8 | Salt atmosphere (corrosion) |
DoD | MIL-STD-883E | 1010.7 | Temperature cycling |
DoD | MIL-STD-883E | 1011.9 | Thermal shock |
DoD | MIL-STD-883E | 1012.1 | Thermal characteristics |
DoD | MIL-STD-883E | 1013 | Dew point |
DoD | MIL-STD-883E | 1014.1 | Seal |
DoD | MIL-STD-883E | 1015.9 | Burn-in test |
DoD | MIL-STD-883E | 1016 | Life/reliability characterization tests |
DoD | MIL-STD-883E | 1017.2 | Neutron irradiation |
DoD | MIL-STD-883E | 1015.2 | Internal water-vapor content |
DoD | MIL-STD-883E | 1019.4 | Ionizing radiation (total dose) test procedure |
DoD | MIL-STD-883E | 1020.1 | Dose rate induced latchup test procedure |
DoD | MIL-STD-883E | 1021.2 | Dose rate upset testing of digital microcircuits |
DoD | MIL-STD-883E | 1022 | Mosfet threshold voltage |
DoD | MIL-STD-883E | 1023.2 | Dose rate response of linear microcircuits |
DoD | MIL-STD-883E | 1030.1 | Preseal burn-in |
DoD | MIL-STD-883E | 1031 | Thin film corrosion test |
DoD | MIL-STD-883E | 1032.1 | Package induced soft error test procedure (due to alpha particles) |
DoD | MIL-STD-883E | 1033 | Endurance life test |
DoD | MIL-STD-883E | 1034 | Die penetrant test (for plastic devices) |
DoD | MIL-STD-883E | 2001.2 | Constant acceleration |
DoD | MIL-STD-883E | 2002.3 | Mechanical shock |
DoD | MIL-STD-883E | 2003.7 | Solderability |
DoD | MIL-STD-883E | 2004.5 | Lead integrity |
DoD | MIL-STD-883E | 2005.2 | Vibration fatigue |
DoD | MIL-STD-883E | 2006.1 | Vibration noise |
DoD | MIL-STD-883E | 2007.2 | Vibration, variable frequency |
DoD | MIL-STD-883E | 2008.1 | Visual and mechanical |
DoD | MIL-STD-883E | 2009.9 | External visual |
DoD | MIL-STD-883E | 2010.10 | Internal visual (monolithic) |
DoD | MIL-STD-883E | 2011.7 | Bond strength (destructive bond pull test) |
DoD | MIL-STD-883E | 2012.7 | Radiography |
DoD | MIL-STD-883E | 2013.1 | Internal visual inspection for DPA |
DoD | MIL-STD-883E | 2014 | Internal visual and mechanical |
DoD | MIL-STD-883E | 2015.11 | Resistance to solvents |
DoD | MIL-STD-883E | 2016 | Physical dimensions |
DoD | MIL-STD-883E | 2017.7 | Internal visual (hybrid) |
DoD | MIL-STD-883E | 2015.3 | Scanning electron microscope (SEM) inspection of metallization |
DoD | MIL-STD-883E | 2019.5 | Die shear strength |
DoD | MIL-STD-883E | 2020.7 | Particle impact noise detection test |
DoD | MIL-STD-883E | 2021.3 | Glassivation layer integrity |
DoD | MIL-STD-883E | 2022.2 | Wetting balance solderability |
DoD | MIL-STD-883E | 2023.5 | Nondestructive bond pull |
DoD | MIL-STD-883E | 2024.2 | Lid torque for glass-frit-sealed packages |
DoD | MIL-STD-883E | 2025.4 | Adhesion of lead finish |
DoD | MIL-STD-883E | 2026 | Random vibration |
DoD | MIL-STD-883E | 2027.2 | Substrate attach strength |
DoD | MIL-STD-883E | 2028.4 | Pin grid package destructive lead pull test |
DoD | MIL-STD-883E | 2029 | Ceramic chip carrier bond strength |
DoD | MIL-STD-883E | 2030 | Ultrasonic inspection of die attach |
DoD | MIL-STD-883E | 2031.1 | Flip chip pull-off test |
DoD | MIL-STD-883E | 2032.1 | Visual inspection of passive elements |
DoD | MIL-STD-883E | 2035 | Ultrasonic inspection of TAB bonds |
DoD | MIL-STD-883E | 3001.1 | Drive source, dynamic |
DoD | MIL-STD-883E | 3002.1 | Load conditions |
DoD | MIL-STD-883E | 3003.1 | Delay measurements |
DoD | MIL-STD-883E | 3004.1 | Transition time measurements |
DoD | MIL-STD-883E | 3005.1 | Power supply current |
DoD | MIL-STD-883E | 3006.1 | High level output voltage |
DoD | MIL-STD-883E | 3007.1 | Low level output voltage |
DoD | MIL-STD-883E | 3008.1 | Breakdown voltage, input or output |
DoD | MIL-STD-883E | 3009.1 | Input current, low level |
DoD | MIL-STD-883E | 3010.1 | Input current, high level |
DoD | MIL-STD-883E | 3011.1 | Output short circuit current |
DoD | MIL-STD-883E | 3012.1 | Terminal capacitance |
DoD | MIL-STD-883E | 3013.1 | Noise margin measurements for digital microelectronic devices |
DoD | MIL-STD-883E | 3014 | Functional testing |
DoD | MIL-STD-883E | 3015.7 | Electrostatic discharge sensitivity classification |
DoD | MIL-STD-883E | 3016 | Activation time verification |
DoD | MIL-STD-883E | 3017 | Microelectronics package digital signal transmission |
DoD | MIL-STD-883E | 3015 | Crosstalk measurements for digital microelectronic device packages |
DoD | MIL-STD-883E | 3019.1 | Ground and power supply impedance measurements for digital microelectronics device packages |
DoD | MIL-STD-883E | 3020 | High impedance (off-state) low-level output leakage current |
DoD | MIL-STD-883E | 3021 | High impedance (off-state) high-level output leakage current |
DoD | MIL-STD-883E | 3022 | Input clamp voltage |
DoD | MIL-STD-883E | 3023 | Static latch-up measurements for digital CMOS microelectronic devices |
DoD | MIL-STD-883E | 3024 | Simultaneous switching noise measurements for digital microelectronic devices |
DoD | MIL-STD-883E | 4001.1 | Input offset voltage and current and bias current |
DoD | MIL-STD-883E | 4002.1 | Phase margin and slew rate measurements |
DoD | MIL-STD-883E | 4003.1 | Common mode input voltage range, Common mode rejection ratio, Supply voltage rejection ratio |
DoD | MIL-STD-883E | 4004.1 | Open loop performance |
DoD | MIL-STD-883E | 4005.1 | Output performance |
DoD | MIL-STD-883E | 4006.1 | Power gain and noise figure |
DoD | MIL-STD-883E | 4007 | Automatic gain control range |
DoD | MIL-STD-883E | 5001 | Parameter mean value control |
DoD | MIL-STD-883E | 5002.1 | Parameter distribution control |
DoD | MIL-STD-883E | 5003 | Failure analysis procedures for microcircuits |
DoD | MIL-STD-883E | 5004.10 | Screening procedures |
DoD | MIL-STD-883E | 5005.13 | Qualification and quality conformance procedures |
DoD | MIL-STD-883E | 5006 | Limit testing |
DoD | MIL-STD-883E | 5007.6 | Wafer lot acceptance |
DoD | MIL-STD-883E | 5008.8 | Test procedures for hybrid and multichip microcircuits |
DoD | MIL-STD-883E | 5009.1 | Destructive physical analysis |
DoD | MIL-STD-883E | 5010.3 | Test procedures for custom monolithic microcircuits |
DoD | MIL-STD-883E | 5011.4 | Evaluation and acceptance procedures for polymeric adhesives. |
DoD | MIL-STD-883E | 5012.1 | Fault coverage measurement for digital microcircuits. |
DoD | MIL-STD-883E | 5013 | Wafer fabrication control and wafer acceptance procedures for processed GaAs wafers. |
IPC | TM-650 | 2.1.1D | Microsectioning - 3/98 |
IPC | TM-650 | 2.1.1.1 | Microsectioning, Ceramic Substrate - 12/87 |
IPC | TM-650 | 2.1.1.2 | Microsectioning - Semi or Automatic Technique Microsection Equipment (Alternate) - 7/93 |
IPC | TM-650 | 2.1.2A | Pinhole Evaluation, Dye Penetration Method - 3/76 |
IPC | TM-650 | 2.1.3A | Plated-Through Hole Structure Evaluation - 8/76 |
IPC | TM-650 | 2.1.5A | Surface Examination, Unclad and Metal Clad Material - 12/82 |
IPC | TM-650 | 2.1.6B | Thickness of Glass Fabric - 12/94 |
IPC | TM-650 | 2.1.6.1 | Weight of Fabric Reinforcements - 12/94 |
IPC | TM-650 | 2.1.7C | Thread Count of Glass Fabric - 12/94 |
IPC | TM-650 | 2.1.7.1 | Thread Count, Organic Fibers - 12/87 |
IPC | TM-650 | 2.1.8B | Workmanship - 12/94 |
IPC | TM-650 | 2.1.9 | Surface Scratch Examination Metal Clad Foil - 5/86 |
IPC | TM-650 | 2.1.10A | Visual Inspection for Undissolved Dicyandiamide - 12/94 |
IPC | TM-650 | 2.1.13A | Inspection for Inclusions and Voids in Flexible Printed Wiring Materials - 5/98 |
IPC | TM-650 | 2.2.1A | Mechanical Dimensional Verification - 8/97 |
IPC | TM-650 | 2.2.2B | Optical Dimensional Verification - 8/97 |
IPC | TM-650 | 2.2.4C | Dimensional Stability, Flexible Dielectric Materials - 5/98 |
IPC | TM-650 | 2.2.5A | Dimensional Inspections Using Mircosections - 8/97 |
IPC | TM-650 | 2.2.6A | Hole Size Measurement, Drilled - 8/97 |
IPC | TM-650 | 2.2.7A | Hole Size Measurement, Plated - 5/86 |
IPC | TM-650 | 2.2.8 | Location of Holes - 4/73 |
IPC | TM-650 | 2.2.10A | Hole Location and Conductor Location - 12/83 |
IPC | TM-650 | 2.2.12A | Thickness of Copper by Weight- 3/76 |
IPC | TM-650 | 2.2.12.1 | Overall Thickness and Profile Factor of Copper Foils Treated and Untreated - 9/87 |
IPC | TM-650 | 2.2.12.2 | Weight and Thickness of Copper Foils with Releasable Carriers - 7/89 |
IPC | TM-650 | 2.2.12.3 | Weight and Thickness Determination of Copper Foils With Etchable Carriers - 7/89 |
IPC | TM-650 | 2.2.13.1A | Thickness, Plating in Holes, Microhm Method - 1/83 |
IPC | TM-650 | 2.2.14 | Solder Powder Particle Size Distribution - Screen Method for Types 1-4 - 1/95 |
IPC | TM-650 | 2.2.14.1 | Solder Powder Particle Size Distribution - Measuring Microscope Method - 1/95 |
IPC | TM-650 | 2.2.14.2 | Solder Powder Particle Size Distribution - Optical Image Analyzer Method--1/95 |
IPC | TM-650 | 2.2.14.3 | Determination of Maximum Solder Powder Particle Size - 1/95 |
IPC | TM-650 | 2.2.15 | Cable Dimensions (Flat Cable) - 6/79 |
IPC | TM-650 | 2.2.16 | Artwork Master Evaluation by Use of a Drilled Panel - 12/87 |
IPC | TM-650 | 2.2.16.1 | Artwork Master Evaluation by Overlay - 12/87 |
IPC | TM-650 | 2.2.17 | Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique)- 3/90 |
IPC | TM-650 | 2.2.15 | Determination of Thickness of Laminates by Mechanical Measurement - 12/94 |
IPC | TM-650 | 2.2.15.1 | Determination of Thickness of Metallic Clad Laminates, Cross-sectional - 12/94 |
IPC | TM-650 | 2.2.19 | Measuring Hole Pattern Location-12/87 |
IPC | TM-650 | 2.2.19.1 | Length, Width and Perpendicularity of Laminate and Prepreg Panels - 12/94 |
IPC | TM-650 | 2.2.20 | Solder Paste Metal Content by Weight - 1/95 |
IPC | TM-650 | 2.2.21 | Planarity of Dielectrics for High Density Interconnection (HDI) Microvia Technology - 11-98 |
IPC | TM-650 | 2.3.1 | Chemical Processing, Suitable Processing Material- 4/73 |
IPC | TM-650 | 2.3.1.1B | Chemical Cleaning of Metal Clad Laminates- 5/86 |
IPC | TM-650 | 2.3.2F | Chemical Resistance Of Flexible Printed Wiring Materials - 5/98 |
IPC | TM-650 | 2.3.3A | Chemical Resistance of Insulating Materials- 2/78 |
IPC | TM-650 | 2.3.4B | Chemical Resistance, Marking Paints and Inks - 8/97 |
IPC | TM-650 | 2.3.4.2A | Chemical Resistance of Laminates, Prepreg and Coated Foil Products, by Solvent Exposure - 12/94 |
IPC | TM-650 | 2.3.4.3 | Chemical Resistance of Core Materials to Methylene Chloride- 5/86 |
IPC | TM-650 | 2.3.5B | Density, Insulating Material - 8/97 |
IPC | TM-650 | 2.3.6A | Etching, Ammonium Persulfate Method - 7/75 |
IPC | TM-650 | 2.3.7A | Etching, Ferric Chloride Method - 7/75 |
IPC | TM-650 | 2.3.7.1A | Cupric Chloride Etching Method - 12/94 |
IPC | TM-650 | 2.3.7.2A | Alkaline Etching Method - 12/94 |
IPC | TM-650 | 2.3.8A | Flammability, Flexible Insulating Materials- 12/82 |
IPC | TM-650 | 2.3.8.1 | Flammability of Flexible Printed Wiring- 12/88 |
IPC | TM-650 | 2.3.9D | Flammability of Prepreg and Thin Laminate - 8/97 |
IPC | TM-650 | 2.3.10B | Flammability of Laminate - 12/94 |
IPC | TM-650 | 2.3.10.1 | Flammability of Soldermask on Printed Wiring Laminate- 8/98 |
IPC | TM-650 | 2.3.11 | Glass Fabric Construction- 4/73 |
IPC | TM-650 | 2.3.13 | Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual Titration Methods- 1/95 |
IPC | TM-650 | 2.3.14 | Print, Etch, and Plate Test- 4/73 |
IPC | TM-650 | 2.3.15C | Purity, Copper Foil or Plating - 8/97 |
IPC | TM-650 | 2.3.16B | Resin Content of Prepreg, by Burn-off - 12/94 |
IPC | TM-650 | 2.3.16.1C | Resin Content of Prepeg, by Treated Weight--12/94 |
IPC | TM-650 | 2.3.16.2 | Treated Weight of Prepreg - 12/94 |
IPC | TM-650 | 2.3.17D | Resin Flow Percent of Prepreg - 8/97 |
IPC | TM-650 | 2.3.17.1B | Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films - 5/98 |
IPC | TM-650 | 2.3.17.2B | Resin Flow of "No Flow" Prepreg - 8/97 |
IPC | TM-650 | 2.3.15A | Gel Time, Prepreg Materials - 4/86 |
IPC | TM-650 | 2.3.19C | Volatile Content of Prepreg - 12/94 |
IPC | TM-650 | 2.3.20 | Plating Quality, Hull Cell Method - 8/97 |
IPC | TM-650 | 2.3.22 | Copper Protective Coating Quality - 2-78 |
IPC | TM-650 | 2.3.23B | Cure (Permanency) Thermally Cured Solder Mask - 2/88 |
IPC | TM-650 | 2.3.23.1A | Cure (Permanency) UV Initiated Dry Film Solder Mask - 2/88 |
IPC | TM-650 | 2.3.24 | Porosity of Gold Plating- 2/78 |
IPC | TM-650 | 2.3.24.1 | Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method - 10/85 |
IPC | TM-650 | 2.3.24.2A | Porosity of Metallic Coatings on Copper-Based Alloys and Nickel (Nitric Acid Vapor Test) - 8/97 |
IPC | TM-650 | 2.3.25B | Detection and Measurement of Ionizable Surface Contaminants - 8/97 |
IPC | TM-650 | 2.3.26A | Ionizable Detection of Surface Contaminants (Dynamic Method) - 11/94 |
IPC | TM-650 | 2.3.26.1 | Ionizable Detection of Surface Contaminants (Static Method) - 11/94 |
IPC | TM-650 | 2.3.26.2 | Mobile Ion Content of Polymer Films - 7/95 |
IPC | TM-650 | 2.3.27 | Cleanliness Test - Residual Rosin - 1/95 |
IPC | TM-650 | 2.3.27.1 | Rosin Flux Residue Analysis-HPLC Method - 1/95 |
IPC | TM-650 | 2.3.28 | Ionic Analysis of Circuit Boards, Ion Chromatography Method - 1/95 |
IPC | TM-650 | 2.3.29 | Flammability, Flexible Flat Cable- 11/88 |
IPC | TM-650 | 2.3.30A | Solvent pH Determination in Anhydrous Flourocarbon Solvents- 11/81 |
IPC | TM-650 | 2.3.31 | Relative Degree of Cure of U.V. Curable Material - 2/88 |
IPC | TM-650 | 2.3.32C | Flux Induced Corrosion (Copper Mirror Method)- 1/95 |
IPC | TM-650 | 2.3.33C | Presence of Halides in Flux, Silver Chromate Method - 1/95 |
IPC | TM-650 | 2.3.34B | Solids Content, Flux - 1/95 |
IPC | TM-650 | 2.3.34.1B | Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder - 1/95 |
IPC | TM-650 | 2.3.35B | Halide Content, Quantitative (Chloride and Bromide)- 1/95 |
IPC | TM-650 | 2.3.35.1 | Fluorides by Spot Test, Fluxes - Qualitative - 1/95 |
IPC | TM-650 | 2.3.35.2 | Flouride Concentration, Fluxes - Quantitative--1/95 |
IPC | TM-650 | 2.3.36 | Acid Acceptance of Chlorinated Solvents- 10/85 |
IPC | TM-650 | 2.3.37B | Volatile Content of Adhesive Coated Dielectric Films - 5/98 |
IPC | TM-650 | 2.3.38B | Surface Organic Contaminant Detection Test - 8/97 |
IPC | TM-650 | 2.3.39B | Surface Organic Contaminant Identification Test (Infrared Analytical Method) - 8/97 |
IPC | TM-650 | 2.3.40 | Thermal Stability - 7/95 |
IPC | TM-650 | 2.4.1D | Adhesion, Tape Testing--8/97 |
IPC | TM-650 | 2.4.1.1B | Adhesion, Marking Paints and Inks--11/88 |
IPC | TM-650 | 2.4.1.2 | Adhesion of Conductors on Hybrid Substrates--12/87 |
IPC | TM-650 | 2.4.1.3 | Adhesion, Resistors (Hybrid Circuits)--12/87 |
IPC | TM-650 | 2.4.1.4 | Adhesion, Overglaze (Hybrid Circuits)--12/87 |
IPC | TM-650 | 2.4.1.5A | Determination of Heat Transfer--5/95 |
IPC | TM-650 | 2.4.1.6 | Adhesion, Polymer Coating--7/95 |
IPC | TM-650 | 2.4.2A | Ductility of Copper Foil--3/76 |
IPC | TM-650 | 2.4.2.1D | Flexural Fatigue and Ductility, Foil--3/91 |
IPC | TM-650 | 2.4.3D | Flexural Fatigue, Flexible Printed Wiring Materials--5/98 |
IPC | TM-650 | 2.4.3.1C | Flexural Fatigue and Ductility, Flexible Printed Wiring--3/91 |
IPC | TM-650 | 2.4.3.2C | Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics--3/91 |
IPC | TM-650 | 2.4.4B | Flexural Strength of Laminates (at Ambient Temperature)--12/94 |
IPC | TM-650 | 2.4.4.1A | Flexural Strength of Laminates (at Elevated Temperature)--12/94 |
IPC | TM-650 | 2.4.5 | Folding Endurance, Flexible Printed Wiring Materials--4/73 |
IPC | TM-650 | 2.4.6 | Hot Oil--4/73 |
IPC | TM-650 | 2.4.7A | Machinability, Printed Wiring Materials--7/75 |
IPC | TM-650 | 2.4.8C | Peel Strength of Metallic Clad Laminates--12/94 |
IPC | TM-650 | 2.4.8.1 | Peel Strength, Metal Foil (Keyhole Method for Thin Laminates)--1/86 |
IPC | TM-650 | 2.4.8.2A | Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method)--12/94 |
IPC | TM-650 | 2.4.8.3A | Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method)--12/94 |
IPC | TM-650 | 2.4.8.4 | Carrier Release, Thin Copper--1/90 |
IPC | TM-650 | 2.4.9D | Peel Strength, Flexible Dielectric Materials--10/88 |
IPC | TM-650 | 2.4.9.1 | Peel Strength of Flexible Circuits - 11/98 |
IPC | TM-650 | 2.4.9.2 | Bonding Process - 11/98 |
IPC | TM-650 | 2.4.10 | Plating Adhesion--4/73 |
IPC | TM-650 | 2.4.11 | Shear Strength Flexible Dielectric Materials--4/73 |
IPC | TM-650 | 2.4.12A | Solderability, Edge Dip Method--6/91 |
IPC | TM-650 | 2.4.13F | Solder Float Resistance Flexible Printed Wiring Materials--5/98 |
IPC | TM-650 | 2.4.13.1 | Thermal Stress of Laminates--12/94 |
IPC | TM-650 | 2.4.14 | Solderability of Metallic Surfaces--4/73 |
IPC | TM-650 | 2.4.14.1 | Solderability, Wave Solder Method--3/79 |
IPC | TM-650 | 2.4.14.2 | Liquid Flux Activity, Wetting Balance Method--1/95 |
IPC | TM-650 | 2.4.15A | Surface Finish, Metal Foil--3/76 |
IPC | TM-650 | 2.4.16A | Initiation Tear Strength, Flexible Insulating Materials--12/82 |
IPC | TM-650 | 2.4.17 | Tear Strength, Propagation--4/73 |
IPC | TM-650 | 2.4.17.1A | Propagation, Tear Strength, Flexible Insulating Materials--12/82 |
IPC | TM-650 | 2.4.15B | Tensile Strength and Elongation, Copper Foil--8/80 |
IPC | TM-650 | 2.4.15.1 | Tensile Strength and Elongation, In-House Plating--8/97 |
IPC | TM-650 | 2.4.15.2 | Hot Rupture Strength, Foil--7/89 |
IPC | TM-650 | 2.4.15.3 | Tensile Strength, Elongation, and Modulus--7/95 |
IPC | TM-650 | 2.4.19C | Tensile Strength and Elongation, Flexible Printed Wiring Materials--5/98 |
IPC | TM-650 | 2.4.20 | Terminal Bond Strength, Flexible Printed Wiring--4/73 |
IPC | TM-650 | 2.4.21D | Land Bond Strength, Unsupported Component Hole--8/97 |
IPC | TM-650 | 2.4.21.1C | Bond Strength, Surface Mount Lands Perpendicular Pull Method--5/91 |
IPC | TM-650 | 2.4.22C | Bow and Twist (Percentage)--6/99 |
IPC | TM-650 | 2.4.22.1C | Bow and Twist-Laminate--5/93 |
IPC | TM-650 | 2.4.22.2 | Substrate Curvature: Silicon Wafers with Deposited Dielectrics--7/95 |
IPC | TM-650 | 2.4.23 | Soldering Resistance of Laminate Materials--3/79 |
IPC | TM-650 | 2.4.24C | Glass Transition Temperature and Z-Axis Thermal Expansion by TMA--12/94 |
IPC | TM-650 | 2.4.24.1 | Time to Delamination (TMA Method)--12/94 |
IPC | TM-650 | 2.4.24.2 | Glass Transition Temperature of Organic Films - DMA Method--7/95 |
IPC | TM-650 | 2.4.24.3 | Glass Transition Temperature of Organic Films - TMA Method--7/95 |
IPC | TM-650 | 2.4.24.4 | Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias -DMA Method - 11/98 |
IPC | TM-650 | 2.4.24.5 | Glass Transition Temperature and Thermal Expansion of Materials Used In High Density Interconnection (HDI) and Microvias -TMA Method -11/98 |
IPC | TM-650 | 2.4.25C | Glass Transition Temperature and Cure Factor by DSC--12/94 |
IPC | TM-650 | 2.4.26 | Tape Test for Additive Printed Boards--3/79 |
IPC | TM-650 | 2.4.27.1B | Abrasion (Taber Method), Solder Mask and Conformal Coating--1/95 |
IPC | TM-650 | 2.4.27.2A | Solder Mask Abrasion (Pencil Method)--2/88 |
IPC | TM-650 | 2.4.28B | Adhesion, Solder Mask (Non-Melting Metals)--8/97 |
IPC | TM-650 | 2.4.28.1B | Adhesion, Solder Resist (Mask), Tape Test Method--8/97 |
IPC | TM-650 | 2.4.29B | Adhesion, Solder Mask, Flexible Circuit--2/88 |
IPC | TM-650 | 2.4.30 | Impact Resistance, Polymer Film--10/86 |
IPC | TM-650 | 2.4.31A | Folding, Flexible Flat Cable--4/86 |
IPC | TM-650 | 2.4.32A | Fold Temperature Testing, Flexible Flat Cable--4/86 |
IPC | TM-650 | 2.4.33C | Flexural Fatigue and Ductility, Flat Cable--3/91 |
IPC | TM-650 | 2.4.34 | Solder Paste Viscosity - T-Bar Spin Spindle Method (applicable for 300,000 to 1,600,000 Centipose)--1/95 |
IPC | TM-650 | 2.4.34.1 | Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centipose)--1/95 |
IPC | TM-650 | 2.4.34.2 | Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipose)--1/95 |
IPC | TM-650 | 2.4.34.3 | Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipose)--1/95 |
IPC | TM-650 | 2.4.34.4 | Paste Flux Viscosity - T-Bar Spindle Method--1/95 |
IPC | TM-650 | 2.4.35 | Solder Paste - Slump Test--1/95 |
IPC | TM-650 | 2.4.36B | Rework Simulation, Plated-Through Holes for Leaded Components--8/97 |
IPC | TM-650 | 2.4.37A | Evaluation of Hand Soldering Tools for Terminal Connections--7/91 |
IPC | TM-650 | 2.4.37.1A | Evaluation of Hand Soldering Tools for Printed Wiring Board Applications--7/91 |
IPC | TM-650 | 2.4.37.2 | Evaluation of Hand Soldering Tools on Heavy Thermal Loads--7/93 |
IPC | TM-650 | 2.4.38A | Prepeg Scaled Flow Testing--6/91 |
IPC | TM-650 | 2.4.39A | Dimensional Stability, Glass Reinforced Thin Laminates--2/86 |
IPC | TM-650 | 2.4.40 | Inner Layer Bond Strength of Multilayer Printed Circuit Boards--10/87 |
IPC | TM-650 | 2.4.41 | Coefficient of Lintear Thermal Expansion of Electrical Insulating Boards--3/86 |
IPC | TM-650 | 2.4.41.1A | Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method--8/97 |
IPC | TM-650 | 2.4.41.2 | Coefficient of Thermal Expansion - Strain Gage Method--8/97 |
IPC | TM-650 | 2.4.41.3 | In-Plane Coefficient of Thermal Expansion, Organic Films--7/95 |
IPC | TM-650 | 2.4.41.4 | Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates--7/95 |
IPC | TM-650 | 2.4.42 | Torsional Strength of Chip Adhesives--2/88 |
IPC | TM-650 | 2.4.42.1 | High Tempreature Mechanical Strength Retention of Adhesives--3/88 |
IPC | TM-650 | 2.4.42.2 | Die Shear Strength--2/98 |
IPC | TM-650 | 2.4.42.3 | Wire Bond Pull Strength--2/98 |
IPC | TM-650 | 2.4.43 | Solder Paste - Solder Ball Test--1/95 |
IPC | TM-650 | 2.4.44 | Solder Paste - Tack Test--3/98 |
IPC | TM-650 | 2.4.45 | Solder Paste - Wetting Test--1/95 |
IPC | TM-650 | 2.4.46 | Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored Wires or Preforms--1/95 |
IPC | TM-650 | 2.4.47 | Flux Residue Dryness--1/95 |
IPC | TM-650 | 2.4.48 | Spitting of Flux-Cored Wire Solder--1/95 |
IPC | TM-650 | 2.4.49 | Solder Pool Test--1/95 |
IPC | TM-650 | 2.4.50 | Thermal Conductivity, Polymer Films--7/95 |
IPC | TM-650 | 2.4.51 | Self Shimming Thermally Conductive Adhesives--1/95 |
IPC | TM-650 | 2.5.1B | Arc Resistance of Printed Wiring Materials--5/86 |
IPC | TM-650 | 2.5.2A | Capacitance of Insulating Materials--7/75 |
IPC | TM-650 | 2.5.3B | Current Breakdown, Plated Through Holes--8/97 |
IPC | TM-650 | 2.5.4 | Current Carrying Capacity, Multilayer Printed Wring--4/73 |
IPC | TM-650 | 2.5.4.1A | Conductor Temperature Rise Due to Current Changes in Conductors--8/97 |
IPC | TM-650 | 2.5.5A | Dielectric Constant of Printed Wiring Materials--7/75 |
IPC | TM-650 | 2.5.5.1B | Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 100MHz (Contacting Electrode Systems)--5/86 |
IPC | TM-650 | 2.5.5.2A | Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Clip Method--12/87 |
IPC | TM-650 | 2.5.5.3C | Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method)--12/87 |
IPC | TM-650 | 2.5.5.4 | Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Micrometer Method--10/85 |
IPC | TM-650 | 2.5.5.5C | Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band--3/98 |
IPC | TM-650 | 2.5.5.5.1 | Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ--3/98 |
IPC | TM-650 | 2.5.5.6 | Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates--5/89 |
IPC | TM-650 | 2.5.5.7 | Characteristic Impedance and Time Delay of Lines on |