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January 29, 2018 (Norwood, Mass.) - The Electronic Design Innovation Conference and
Exhibition (EDI CON) USA, the industry event that brings together RF/microwave and high-speed
digital design engineers and system integrators, has opened the Call for Abstracts for
EDI CON USA 2018. Selected papers will be presented at EDI CON USA 2018, held October
17-19, 2018 at the Santa Clara Convention Center, Santa Clara, CA.
Track selections include RF & Microwave Design,
Mobile Front End Design, Low Power RF & IoT, 5G Advanced Communications, Broadband
Networks, Radar & Defense, Amplifier Design, Signal Integrity, Power Integrity, EMC/EMI,
Simulation & Modeling, and Test & Measurement.
This year's Technical
Advisory Committee (TAC) is led by co-chairs Jin Bains, Head of Connectivity, SCL,
at Facebook, and Ransom Stephens, Ph.D., author, technologist, and physicist. The EDI
CON USA 2018 TAC will evaluate submitted abstracts based on quality, relevance, impact,
and originality. To be accepted, submissions must be high quality and comprehensive,
aimed at advancing the knowledge of attendees.
CON technical sessions are educational, providing practical information on how to address
today’s design challenges using available materials, tools, products, and techniques,"
said Janine Love, Event Director. “We are looking forward to putting on another engaging
and constructive conference and exhibition for engineers working on the latest RF, microwave,
and digital designs.”
The Call for Abstracts closes May 3, 2018. More information and the submission portal
is available online.
EDI CON USA 2018 is supported by its primary media sponsors,
Microwave Journal and
Signal Integrity Journal.
More information, including how to exhibit at EDI CON USA 2018, is available at
CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara, CA) on October
About EDI CON USA
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital
design engineers and system integrators for networking, training, and learning opportunities.
Attendees come to EDI CON USA to find solutions, products, and design ideas that they
can put into immediate practice for today's communication, defense, consumer electronics,
aerospace, and medical industries. Drawing attendees from both the analog and digital
spheres, EDI CON enables designers to see techniques and technologies used in other applications
that could be applied or adapted to solve their latest design challenges. The exhibition
hall features product displays, demonstrations, interactive sessions, speed trainings,
networking opportunities, and educational talks that address all aspects of design, simulation,
test, and verification. www.ediconusa.com
About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the
event planning division of their parent company, Horizon House. Microwave Journal, Signal
Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International
(Hong Kong) to organize and produce EDI CON China (March 20-22, 2018 in Beijing, China).
An experienced and well-established organizer of targeted events, Horizon House additionally
organizes European Microwave Week (EuMW) on behalf of the European Microwave Association
(EuMA). To subscribe to Signal Integrity Journal, visit
To subscribe to the Microwave Journal, visit http://www.mwjournal.com.
Posted January 30, 2018