Content is the copyright
of the company represented, but the page format is my copyright and cannot be distributed
to other media outlets. Please submit your content for consideration to
Press Release Archives:
...from Scott McMorrow, Dr. Thomas Cameron and
August 29, 2017 (Norwood, Mass.) - To add to its high-quality line-up of education, the
Electronic Design Innovation Conference
and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave
and high-speed digital design engineers and system integrators, announced today its plenary
keynote speakers at EDI CON USA, September 11-13 at the Hynes Convention Center in Boston,
EDI CON USA will host more than 100 exhibitors and feature 88 education sessions that fall
into five focused areas: RF & Microwave Design, High-Speed Digital Design, Measurement &
Modeling, Systems Engineering and 5G Advanced Communications. In addition, EDI CON has a pre-conference
training day, Monday September 11th that includes 3-hour intensive short courses in the morning
and afternoon with a luncheon and evening reception for conference pass holders.
To add to the three days of extraordinary education, training and networking opportunities,
is this year's distinguished line-up of keynote speakers who will address the latest engineering
trends and challenges, including "in the trenches" stories of design challenges, successes
and failures. Scott McMorrow, Dr. Thomas Cameron and Faride Akretch are slated to speak at
10:30 AM on September 12th, prior to the opening of the Exhibition Hall.
Betting Your Job – Finding Your Voice and Being a Change Agent in a Corporate World
with Scott McMorrow
McMorrow, an engineer, change agent, problem solver and a trusted technical adviser, approaches
every recommendation as a "I bet my job" moment. During his presentation, he will discuss
how his philosophy has helped in the development of diverse products where failure could place
$100M to $1B+ at risk. Both horror stories and successes in the electronics industry will
be revealed. McMorrow, CTO for Signal Integrity Products at Samtec, has helped numerous companies
develop high performance products while training signal integrity engineers.
A discussion by Dr. Thomas Cameron on 5G Five Years from Now – How do we Get There?
Cameron, CTO for the Communications Business Unit at Analog Devices, will discuss the 5G
industry goals and motivations. He will review the technologies that are in development today
enabling the early 5G radio designs and highlight some of the challenges that lay ahead for
the RF design community. Cameron is currently working on the research and development of radio
technology for 5G systems in both cellular and microwave frequency bands. He has over 30 years
of experience in research and development of technology for telecom networks including cellular
basestations, microwave radios and cable systems. He holds a Ph.D. in Electrical Engineering
from the Georgia Institute of Technology and serves as the Technical Program Co-Chair for
EDI CON USA.
'Delivering value' everybody says it, but what does it mean – A look behind the
Scenes of Test & Measurement with Faride Akretch
Akretch, segment marketing manager at Rohde & Schwarz, will take a look behind the
scenes of Rohde & Schwarz and explore what value means to the different departments of
the company. He will explore specific examples where the concept of delivering value to customers
and a long-term vision have produced some extraordinary products and services. With more than
20 years in the industry Akretch has held a variety of positions in Germany, Japan, and the
United States, including application engineer, product marketing and business and market development.
He holds a master's in electrical engineering/electronics from the Technical University of
EDI CON USA 2017 is supported by its primary media sponsors, Microwave Journal and Signal Integrity Journal. More
information, including how to register for EDI CON USA 2017, is available at http://www.ediconusa.com. For future
planning, EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara,
CA) on October 17-19, 2018.
About EDI CON USA
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design
engineers and system integrators for networking, training, and learning opportunities. Attendees
come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate
practice for today's communication, defense, consumer electronics, aerospace, and medical
industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers
to see techniques and technologies used in other applications that could be applied or adapted
to solve their latest design challenges. The exhibition hall features product displays, demonstrations,
interactive sessions, speed trainings, networking opportunities, and educational talks that
address all aspects of design, simulation, test, and verification.
About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event
planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity
Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong
Kong) to organize and produce EDI CON China (March 20-22, 2018 in Beijing, China). An experienced
and well-established organizer of targeted events, Horizon House additionally organizes European
Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and the M2M Zone
at CTIA Super Mobility Week/Mobile World Congress Americas. To subscribe to Signal Integrity
Journal, visit www.signalintegrityjournal.com.
To subscribe to the Microwave Journal, visit http://www.mwjournal.com.
The EDI CON technical program is developed in collaboration with leading international
technology companies and experts in high-frequency and high-speed electronic design with experience
ranging from modeling and design to component characterization, system integration, and verification.
Janine Love, Event Director +1-857-350-2216
Carl Sheffres, Publisher +1-781-619-1949 firstname.lastname@example.org
North America: Pat Hindle +1 781-619-1946
International: Richard Mumford +44 207 596 8787
Posted August 30, 2017