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EDI CON USA Returns to Boston in 2 Weeks with Powerful Education and Keynotes

EDI CON USA 2017 Announces European Radar Summit - RF Cafe

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...from Scott McMorrow, Dr. Thomas Cameron and Faride Akretch

August 29, 2017 (Norwood, Mass.) - To add to its high-quality line-up of education, the Electronic Design Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together RF/microwave and high-speed digital design engineers and system integrators, announced today its plenary keynote speakers at EDI CON USA, September 11-13 at the Hynes Convention Center in Boston, MA.

EDI CON USA will host more than 100 exhibitors and feature 88 education sessions that fall into five focused areas: RF & Microwave Design, High-Speed Digital Design, Measurement & Modeling, Systems Engineering and 5G Advanced Communications. In addition, EDI CON has a pre-conference training day, Monday September 11th that includes 3-hour intensive short courses in the morning and afternoon with a luncheon and evening reception for conference pass holders.

To add to the three days of extraordinary education, training and networking opportunities, is this year's distinguished line-up of keynote speakers who will address the latest engineering trends and challenges, including "in the trenches" stories of design challenges, successes and failures. Scott McMorrow, Dr. Thomas Cameron and Faride Akretch are slated to speak at 10:30 AM on September 12th, prior to the opening of the Exhibition Hall.


Betting Your Job – Finding Your Voice and Being a Change Agent in a Corporate World with Scott McMorrow

McMorrow, an engineer, change agent, problem solver and a trusted technical adviser, approaches every recommendation as a "I bet my job" moment. During his presentation, he will discuss how his philosophy has helped in the development of diverse products where failure could place $100M to $1B+ at risk. Both horror stories and successes in the electronics industry will be revealed. McMorrow, CTO for Signal Integrity Products at Samtec, has helped numerous companies develop high performance products while training signal integrity engineers.


A discussion by Dr. Thomas Cameron on 5G Five Years from Now – How do we Get There?

Cameron, CTO for the Communications Business Unit at Analog Devices, will discuss the 5G industry goals and motivations. He will review the technologies that are in development today enabling the early 5G radio designs and highlight some of the challenges that lay ahead for the RF design community. Cameron is currently working on the research and development of radio technology for 5G systems in both cellular and microwave frequency bands. He has over 30 years of experience in research and development of technology for telecom networks including cellular basestations, microwave radios and cable systems. He holds a Ph.D. in Electrical Engineering from the Georgia Institute of Technology and serves as the Technical Program Co-Chair for EDI CON USA.


'Delivering value' everybody says it, but what does it mean – A look behind the Scenes of Test & Measurement with Faride Akretch

Akretch, segment marketing manager at Rohde & Schwarz, will take a look behind the scenes of Rohde & Schwarz and explore what value means to the different departments of the company. He will explore specific examples where the concept of delivering value to customers and a long-term vision have produced some extraordinary products and services. With more than 20 years in the industry Akretch has held a variety of positions in Germany, Japan, and the United States, including application engineer, product marketing and business and market development. He holds a master's in electrical engineering/electronics from the Technical University of Berlin.

EDI CON USA 2017 is supported by its primary media sponsors, Microwave Journal and Signal Integrity Journal. More information, including how to register for EDI CON USA 2017, is available at For future planning, EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara, CA) on October 17-19, 2018.


EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification.

About the Organizers

EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (March 20-22, 2018 in Beijing, China). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and the M2M Zone at CTIA Super Mobility Week/Mobile World Congress Americas. To subscribe to Signal Integrity Journal, visit To subscribe to the Microwave Journal, visit

The EDI CON technical program is developed in collaboration with leading international technology companies and experts in high-frequency and high-speed electronic design with experience ranging from modeling and design to component characterization, system integration, and verification.

Event Contact:

Janine Love, Event Director +1-857-350-2216 Twitter: @tb_janine

Sales Contact:

Carl Sheffres, Publisher +1-781-619-1949

Editorial Contacts:

North America: Pat Hindle +1 781-619-1946 Twitter: @pathindle

International: Richard Mumford +44 207 596 8787



Posted August 30, 2017

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