ADI takes the lead sponsorship position at EDI
CON USA, supporting networking and training opportunities for engineers working in high-frequency
and high-speed applications.
July 31, 2017 (Norwood, Mass.) - The Electronic Design
Innovation Conference and Exhibition (EDI CON) USA, the first industry event to bring together
RF/microwave and high-speed digital design engineers and system integrators, announced today
that Analog Devices, Inc. (ADI) is taking on the role of host sponsor of the exhibition and
conference program at the Hynes Convention Center, September 11-13 in Boston, MA. Engineers
from ADI will be presenting a short course, several paper sessions, and workshops on topics
for high-frequency and high-speed electronic applications.
Dr. Thomas Cameron, CTO for the Communications Business Unit at ADI, and one of EDI CON
USA's technical program co-chairs, is an invited speaker at the plenary session, which will
be held on Tuesday, September 12th beginning at 10:30. As one of three presenters, Dr. Cameron
will be speaking on, "5G Five Years From Now – How do we Get There?" With more than 30 years
of experience in technology R&D for telecom networks, Cameron is currently working on
the research and development of radio technology for 5G systems in both cellular and microwave
frequency bands. As one of the technical co-chairs of EDI CON USA (he shares that role with
Dr. Istvan Novak, Senior Principal Engineer at Oracle), he helped to steer the technical direction
of the event, which includes 3-hour short courses (on Monday) as well as technical paper sessions,
workshops, and panels (on Tuesday and Wednesday).
ADI will also serve as host of the Welcome Reception, which is being held on Tuesday September
12th from 5-7PM on the EXPO hall, featuring food and drinks for attendees who have either
come for the entire day or those who are attending EDI CON USA after a day at the office.
The exhibition hall will be home to more than 100 exhibitors, including hands-on demonstrations
(such as the SI/PI Measurement Lab in the High-Speed Zone) and training and talks in the Frequency
Matters Theater.
ADI engineers Del Jones and Michelle Viani will present a short course on Monday, September
11th entitled "Streamline Flexible System Designs with RF Data Converters." Technical papers
from ADI engineers that will be presented on Tuesday and Wednesday include:
- Challenges and Benefits of Implementing UWB Digital Pre-Distortion (DPD) in Cable Distribution
Systems, Patrick Pratt
- How Complex Modulation, Zero IF, and Advanced Algorithms Enable Next Generation Transceiver
Radios, David Frizelle
- Massive MIMO and "beamforming": The signal processing behind the 5G buzzwords, Claire
Masterson
- Transmit LO Leakage (LOL) – An Issue of Zero IF That Isn't Making People Laugh Out Loud,
Frank Kearney
ADI's featured workshops will occur on Wednesday, September 13th from 1-4PM, and include:
EDI CON USA 2017 is supported by its primary media sponsors, Microwave Journal and Signal Integrity Journal. More
information, including how to register for EDI CON USA 2017, is available at http://www.ediconusa.com. For future
planning, EDI CON USA 2018 will be held at the Santa Clara Convention Center (Santa Clara,
CA) on October 17-19, 2018.
About EDI CON USA
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design
engineers and system integrators for networking, training, and learning opportunities. Attendees
come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate
practice for today's communication, defense, consumer electronics, aerospace, and medical
industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers
to see techniques and technologies used in other applications that could be applied or adapted
to solve their latest design challenges. The exhibition hall features product displays, demonstrations,
interactive sessions, speed trainings, networking opportunities, and educational talks that
address all aspects of design, simulation, test, and verification.
About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event
planning division of their parent company, Horizon House. Microwave Journal, Signal Integrity
Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong
Kong) to organize and produce EDI CON China (April 25-27, 2017 in Shanghai, China). An experienced
and well-established organizer of targeted events, Horizon House additionally organizes European
Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and the M2M Zone
at CTIA Super Mobility Week/Mobile World Congress Americas. To subscribe to Signal Integrity
Journal, visit www.signalintegrityjournal.com
Event Contact:
Janine Love, Event Director +1-857-350-2216
jlove@horizonhouse.com
Twitter: @tb_janine
Sales Contact:
Carl Sheffres, Publisher +1-781-619-1949 csheffres@mwjournal.com
Editorial Contacts:
North America: Pat Hindle +1 781-619-1946
PHindle@MWJournal.com
Twitter: @pathindle
International: Richard Mumford +44 207 596 8787
RMumford@MWJournal.com
Posted August 1, 2017
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