May 12, 2016 (Norwood, Mass.) – EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, is pleased to announce Tom Sikina, Principal Engineering Fellow at Raytheon Co. as a keynote speaker in the EDI CON USA Plenary Session that will be held on Tuesday, September 20 at 4:30 PM.
As a renowned expert with more than 35 years of experience in a wide range of antenna design and development, Tom Sikina will take the EDI CON USA stage to discuss, "Innovation in Phased Arrays: Past, Present, and Future." Sikina will trace the development of phased array antennas, beginning with the earliest concepts developed by industry giants, such as Maxwell and Hertz, through to contemporary developments and innovations occurring today, such as adaptive arrays, MIMO, and phased array systems that are enabling remote sensing and multichannel communication systems. In keeping with the theme of the Electronic Design Innovation (EDI) conference (CON), Sikina promises to "trace a pathway of human discovery, often with amusing and amazing stories."
Raytheon Co. is a conference sponsor for EDI CON USA 2016. In addition to the Plenary Session, the EDI CON technical conference will include 30-minute technical sessions, 40-minute workshops, short courses, keynote talks, and panels, as well as educational and training programming in the Frequency Matters Theater and poster sessions on the exhibition floor.
EDI CON USA is a technical conference and exhibition that is designed for engineers and system integrators working with current technologies and methodologies to develop the electronic systems required today. Building on four successful years in China, the EDI CON event platform is launching in the USA starting in Boston, Mass. where there is a high concentration of electronic design engineers including both high-frequency and high-speed digital designers working in the commercial as well as aerospace markets. Organizers expect to attract more than 3,000 attendees during the 3-day event with close to 100 technical presentations, including workshops, short courses, and panels. The technical sessions will be arranged around tracks that are focused on RF & microwave design, high-speed digital design, measurement & modeling, systems engineering, and 5G advanced communications. Information about exhibition space and sponsorship is available at http://ediconusa.com/exhibitors.asp. Conference registration will open in June 2016. More information is available at http://www.ediconusa.com/.
About EDI CON USA
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries.
Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that will address all aspects of design, simulation, test, and verification.
About the Organizers
EDI CON USA is organized by Microwave Journal and the event planning division of its parent company, Horizon House. Microwave Journal and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China. An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and several major microwave related conferences/exhibitions such as the M2M and Mobile Backhaul Zones at CTIA Super Mobility. The EDI CON program is developed in collaboration with leading international technology companies and experts in high-frequency and high-speed electronic design with experience ranging from modeling and design to component characterization, system integration, and verification.
Janine Love, Event Director
Carl Sheffres, Publisher
Phone: +44 207 596 8787
Posted May 20, 2016