July 19, 2016 (Norwood, Mass.) – EDI CON USA 2016, a conference that brings together engineers working on high-frequency analog and high-speed digital designs, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, announces it sold-out its show floor, with a total of 138 exhibiting companies from the RF, microwave, and high-speed digital industries. As a result, the show management has issued a second floor expansion. There is also limited availability for a demo pod in the Signal Integrity Zone.
The EDI CON USA 2016 show floor and exhibitor list can be found online at ediconusa.com. Exhibitors include Keysight Technologies, Rohde & Schwarz, National Instruments, CST- Computer Simulation, Mini Circuits, Analog Devices, ANSYS, Copper Mountain Tech, Electro Rent Corp, Mercury Systems, NXP (Freescale), Rogers Corp, Anritsu, Mathworks, TowerJazz, COMSOL, Giga Test Labs, IDT- Integrated Device Tech, MACOM, Mentor Graphics, Microwave Development Laboratories, and Mitsubishi Electric.
Registration is now open for the show, which boasts a robust technical program that includes a kick-off plenary as well as 60 technical sessions, 27 workshops and panels, 4 short courses, an all-day RF Back to Basics seminar, and 12 sponsored talks. On the exhibition floor, attendees can take advantage of three days of technical programming in the Frequency Matters Theater, as well as live demonstrations, a poster session, hands-on training, and the Signal Integrity Zone, in addition to the full show floor of exhibitors from the RF, microwave, and high-speed digital industries.
Focused on providing actionable information to practicing engineers, EDI CON USA offers multiple specialized conference tracks in order to appeal to engineers looking for in-depth technical information to help on the job today. These tracks include: RF/Microwave Design, Measurement, Modeling, Radar/Defense, Signal Integrity/Power Integrity, RF/Microwave Amplifiers, 5G/Advanced Communications, and Systems. Attending the conference sessions and short courses will require a 1-day or 3-day conference pass. All exhibition floor programming can be accessed using a free Expo pass. Conference registration is open now http://www.ediconusa.com/registration.asp.
About EDI CON USA
EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries.
Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, design contests, interactive sessions, speed trainings, networking opportunities, and educational talks that will address all aspects of design, simulation, test, and verification.
About the Organizers
EDI CON USA is organized by Microwave Journal and the event planning division of its parent company, Horizon House. Microwave Journal and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China. An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA) and several major microwave related conferences/exhibitions such as the M2M and Mobile Backhaul Zones at CTIA Super Mobility. The EDI CON program is developed in collaboration with leading international technology companies and experts in high-frequency and high-speed electronic design with experience ranging from modeling and design to component characterization, system integration, and verification.
Janine Love, Event Director
Carl Sheffres, Publisher
Phone: +44 207 596 8787
Posted July 20, 2016