Flip-chip Packaging Significantly Reduces Overall Footprint, Enabling Thinner Solutions for
WOBURN, Mass., March 10, 2014– Skyworks Solutions, Inc. (NASDAQ: SWKS), an innovator of high
performance analog semiconductors enabling a broad range of end markets today unveiled several
wireless networking products incorporating flip-chip packaging, augmenting its existing world-class
mobile connectivity portfolio. Skyworks’s newest devices leverage innovative and proprietary
manufacturing techniques that allow smartphone and tablet OEMs to incorporate smaller, thinner
solutions for 802.11ac system-in-package (SiP) modules. As high-end mobile devices deliver
ever-increasing functionality and ubiquitous connectivity, reducing the front-end circuit board
footprint is critical as system providers seek high performance, highly flexible solutions for
“Skyworks’ unique flip-chip packaging capabilities are enabling us to offer unprecedented
form factors in support of flagship smartphones and tablets,” said Bill Vaillancourt, vice president
and general manager of mobile connectivity solutions at Skyworks. “Our newest wireless
networking devices are highly integrated and solve our customers’ analog and RF complexity challenges
so consumers can enjoy mobile platforms with fast, reliable anytime, anywhere data access.”
Flip chip is a type of surface mountable packaging technology that reduces footprint and
thickness (compared to conventional packaging), weighs less, is easy to assemble, lowers production
costs and improves electrical and thermal performance. Flip-chip solutions combine the
strengths of various packaging techniques, such as the size and performance advantage of bare
die assembly with the reliability of encapsulated devices which can also be fully RF tested
at die level. Their significant size and weight reduction makes them ideal for use in a variety
of mobile devices including smartphones and tablets.
About Skyworks’ Connectivity Solutions
a single-pole, triple-throw switch with an integrated LNA for 2.4 GHz, 802.11ac modules
a single-pole, double-throw switch with an integrated LNA for 5 GHz, 802.11ac modules
- Both devices are highly integrated and feature an LNA with bypass mode, low loss RF switch
and DC blocking capacitors in a single, compact flip-chip package.
- In addition, these Skyworks Green™ products are compliant with all applicable legislation
and are halogen-free.
- Additional products in this portfolio will be released later this year.
Skyworks Solutions, Inc. is an innovator of high performance analog
semiconductors. Leveraging core technologies, Skyworks supports automotive, broadband, cellular
infrastructure, energy management, GPS, industrial, medical, military, wireless networking,
smartphone and tablet applications. The Company’s portfolio includes amplifiers, attenuators,
circulators, detectors, diodes, directional couplers, front-end modules, hybrids, infrastructure
RF subsystems, isolators, lighting and display solutions, mixers/demodulators, optocouplers,
optoisolators, phase shifters, PLLs/synthesizers/VCOs, power dividers/combiners, power management
devices, receivers, switches and technical ceramics.
Headquartered in Woburn, Mass.,
Skyworks is worldwide with engineering, manufacturing, sales and service facilities throughout
Asia, Europe and North America. For more information, please visit Skyworks’ Web site at:
Posted March 17, 2014