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MECA Electronics

Skyworks Launches Family of Highly Innovative Connectivity Solutions for Smartphones and Tablets

Click to visit Skyworks Solutions

-- Flip-chip Packaging Significantly Reduces Overall Footprint, Enabling Thinner Solutions for Mobile Platforms

WOBURN, Mass., March 10, 2014– Skyworks Solutions, Inc. (NASDAQ: SWKS), an innovator of high performance analog semiconductors enabling a broad range of end markets today unveiled several wireless networking products incorporating flip-chip packaging, augmenting its existing world-class mobile connectivity portfolio.  Skyworks’s newest devices leverage innovative and proprietary manufacturing techniques that allow smartphone and tablet OEMs to incorporate smaller, thinner solutions for 802.11ac system-in-package (SiP) modules.  As high-end mobile devices deliver ever-increasing functionality and ubiquitous connectivity, reducing the front-end circuit board footprint is critical as system providers seek high performance, highly flexible solutions for next-generation platforms.

Skyworks Launches Family of Highly Innovative Connectivity Solutions for Smartphones and Tablets - RF Cafe“Skyworks’ unique flip-chip packaging capabilities are enabling us to offer unprecedented form factors in support of flagship smartphones and tablets,” said Bill Vaillancourt, vice president and general manager of mobile connectivity solutions at Skyworks.  “Our newest wireless networking devices are highly integrated and solve our customers’ analog and RF complexity challenges so consumers can enjoy mobile platforms with fast, reliable anytime, anywhere data access.”

Flip chip is a type of surface mountable packaging technology that reduces footprint and thickness (compared to conventional packaging), weighs less, is easy to assemble, lowers production costs and improves electrical and thermal performance.  Flip-chip solutions combine the strengths of various packaging techniques, such as the size and performance advantage of bare die assembly with the reliability of encapsulated devices which can also be fully RF tested at die level. Their significant size and weight reduction makes them ideal for use in a variety of mobile devices including smartphones and tablets.

About Skyworks’ Connectivity Solutions

  • SKY85202-11: a single-pole, triple-throw switch with an integrated LNA for 2.4 GHz, 802.11ac modules
  • SKY85606-11: a single-pole, double-throw switch with an integrated LNA for 5 GHz, 802.11ac modules
  • Both devices are highly integrated and feature an LNA with bypass mode, low loss RF switch and DC blocking capacitors in a single, compact flip-chip package.
  • In addition, these Skyworks Green™ products are compliant with all applicable legislation and are halogen-free.
  • Additional products in this portfolio will be released later this year.

About Skyworks

Skyworks Solutions, Inc. is an innovator of high performance analog semiconductors. Leveraging core technologies, Skyworks supports automotive, broadband, cellular infrastructure, energy management, GPS, industrial, medical, military, wireless networking, smartphone and tablet applications. The Company’s portfolio includes amplifiers, attenuators, circulators, detectors, diodes, directional couplers, front-end modules, hybrids, infrastructure RF subsystems, isolators, lighting and display solutions, mixers/demodulators, optocouplers, optoisolators, phase shifters, PLLs/synthesizers/VCOs, power dividers/combiners, power management devices, receivers, switches and technical ceramics.

Headquartered in Woburn, Mass., Skyworks is worldwide with engineering, manufacturing, sales and service facilities throughout Asia, Europe and North America. For more information, please visit Skyworks’ Web site at: www.skyworksinc.com




Contact
Amanda Ingalls,
(949) 231-3045
sales@skyworksinc.com
www.skyworksinc.com





Posted  March 17, 2014
ERZIA (RF amplifiers, wireless, communications) - RF Cafe PCB Directory (Design)
Windfreak Technologies
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