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EDI CON 2014 Presents RF and High Speed IC Design and EDA in China
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April 8-10, 2014 Beijing, China www.EDICONCHINA.com
A special panel on the state of IC design and EDA tool use Overview:
Due to the country’s relatively short-term experience in IC design, China’s current
state of indigenous IC design capability is limited by several factors including limited self
generated core-IP and a generally weak knowledge of IC foundries and necessary EDA infrastructure.
These new fabless IC design centers, many of whom have been in existence for less than 10 years,
face a number of challenges specific to EDA use. Many enterprises have yet to establish proper
CAD support departments and efficient EDA design flows. Young design engineers and CAD support
teams often do not fully understand and utilize existing process design kits (PDKs) and parameterized
active (transistor) and passive models. Investment in specialized EDA tools such as RF/microwave
and high-speed circuit analysis, parasitic extraction, LVS/DRC and yield optimization is significantly
lower than the level of investment made by design centers in North America and Europe.
Microwave
Journal Editor, David Vye moderates a round table panel discussion among leading EDA vendors
as they consider the state of IC design in China and the challenges for organization’s looking
to develop a world-class EDA design flow infrastructure and adopt design automation tools. Panelists
will discuss design entry and management, PDKs, EM simulation/modeling, various types of RF
specific analyses, third party integration and the role of EDA companies in providing engineering
support/training programs. Participating EDA vendors include:
- Agilent Technologies – Advanced Design System (ADS), GoldenGlobe (RFIC ), SystemVue
- ANSYS – HFSS, SIWave, ANSYS Designer, APACHE
- AWR – Microwave Office, Axiem, ANALYST, VSS
- CST – Microwave Studio
- EMSS - FEKO
- Sonnet Software - Sonnet
Background:
As a leading manufacturer of electronic products, China currently consumes
more than half of the world’s semiconductor devices. As of 2012, integrated circuits represent
China’s leading imported commodity, surpassing oil imports. While China’s IC sales have tripled
in the past ten years, their current IC global market share represents only 12% of the total
supply, an increase from approximately 5% in 2005. Government programs to promote indigenous
design and manufacturing have resulted in an increase in localized IC and electronic package
design. IC design is currently the fastest growing segment of China’s semiconductor industry,
growing by 21% in 2012 to reach record revenues of US$9.9bn, according to the China Semiconductor
Industry Association (CSIA).
China’s IC design sector was responsible for
over a quarter of China’s semiconductor industry revenue in 2012 with over five hundred indigenous
fabless IC design enterprises in operation as reported by the government. Employment growth
in China’s IC design sector moderated even further in 2012. The total number of employees in
the IC design sector increased by 6% in 2012 to about 112,5001. Five percent of the chips designed
in China are RFICs according to a presentation by Dr. Xiaowei Li, Institute of Computing Technology,
Chinese Academy of Sciences speaking at DAC 2013. According to this report, 11% of all locally
designed ICs are for mobile communications and another 11% target military and space applications
(27% are for consumer electronics).
About EDI
CON 2014
The Electronic Design Innovation Conference (EDI CON 2014) takes place at the
Beijing International Convention Center in Beijing, China on April 8-10. For more details, visit
the conferences web site at www.ediconchina.com
References 1.
https://www.pwc.com/en_GX/gx/technology/chinas-impact-on-semiconductor-industry/assets/china-semicon-2013.pdf
Posted February 11, 2014
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