Hittite Expands Its Optical Modulator Driver Product Line

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January 28, 2013 Press Release



--  32 Gbps Compact Dual Channel Optical Modulator Driver
    Swings 8 Vp-p
 
Chelmsford, MA, 1/28/2013 - Hittite Microwave Corporation, the world class supplier of complete MMIC based solutions for communication & military markets, has released a compact dual channel 32 Gbps Mach-Zehnder Optical Modulator Driver to further expand its fiber optics portfolio to support the next generation of 40 Gbps and 100 Gbps Metro and Long-haul applications. The HMC6620BG is the first dual channel modulator driver in a compact BGA package with excellent channel-to-channel isolation of > 30 dB up to 30 GHz and optional top or bottom cooling capability to ease space constrained module designs.

Hittite Expands Optical Modulator Driver Product Line - RF CafeHMC6620BG Functional Block Diagram - RF CafeFeatures such as high gain across a wide frequency range, low power dissipation, compact size, integrated peak detector function, fast rise/fall time, and integrated bias-tee inductor make the HMC6620BG a best-in-class product.  The driver provides 8 Vp-p saturated output swing up to 32 Gbps and features output swing cross point adjustment. With a wide supply operating range from +5V to +7V, the HMC6620BG is an environmentally friendly product consuming only 0.9 W of power with output swing of 6V and supply at +5V.
 
The HMC6620BG provides Long Haul system designers with scalable power dissipation for varying output drive requirements. The integrated peak detector function enables monitoring and maintains a constant output swing from the modulator driver to help designers improve system lifetime margin. Integrated high speed bias-tee eliminates the requirement for external components. The HMC6620BG can interface with the HMC981LP3E active bias controller, enabling stability of performance over all operating conditions. The HMC6620BG is rated for operations from -5 °C to +85 °C, provides up to 30 dB of gain, exhibits very low additive rms jitter of 300 fs and supports up to 32 Gbps operation. The output swing is adjustable from 5 Vp-p to 8.5 Vp-p.
 
Detailed package design reduces the channel-to-channel skew to only 1ps. The HMC6620BG is housed in 13.76 mm x 13 mm x 3.63 mm laminate substrate based BGA surface-mount package with integrated ESD protection. Samples and evaluation PC boards for all SMT packaged products are available from stock and can be ordered via the company's e-commerce site or via direct purchase order. Request a data sheet on-line at www.hittite.com.
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[borders/inc-300x250.htm]About Hittite Microwave
Hittite Microwave Corporation is an innovative designer and manufacturer of high performance integrated circuits, or ICs, modules, subsystems and instrumentation for technically demanding digital, RF, microwave and millimeterwave applications covering DC to 110 GHz. The Company's standard and custom products apply analog, digital and mixed-signal semiconductor technologies, which are used in a wide variety of wireless / wired communication and sensor applications for Automotive, Broadband, Cellular Infrastructure, Fiber Optics & Networking, Microwave & Millimeterwave Communications, Military, Test & Measurement, and Space markets. The Company is headquartered in Chelmsford, Massachusetts.


Contact
Beth McGreevy
Marketing Communications Manager
mcgreevy@hittite.com
Hittite Microwave Corporation
2 Elizabeth Dr.
Chelmsford, MA 01824
978-250-3343, ext. 1117
978-250-3373 Fax



Posted  1/28/2013