RFMD® Introduces Industry-Best WiFi Front End Modules
at IEEE International Microwave Symposium (IMS) 2012
Sr. Manager, Communications
Montreal, Canada, June 18, 2012- RF Micro Devices, Inc. (Nasdaq GS: RFMD), a global leader in the design and
manufacture of high-performance semiconductor components and compound semiconductor technologies, today announced
the release of four high-performance front end modules (FEMs) for next generation WiFi applications. The RFMD®
RFFM8200, RFFM8500, RFFM8202, and RFFM8502 are highly integrated FEM solutions covering multiple WiFi standards
and frequency bands, particularly IEEE802.11n and the emerging 802.11ac specification. RFMD’s FEMs achieve
industry-leading linear power and dynamic error vector magnitude (EVM) performance in support of the newest
reference designs from the world’s leading WiFi chipset providers.
The WiFi market is growing rapidly,
driven by increasing consumer demand for access to mobile broadband data and the expanding operator requirements
for data offload to accommodate increased cellular and cable network services. By 2015, it is projected the WiFi
FEM mobile/embedded and consumer premises equipment markets will exceed $1.8 billion.
general manager of RFMD’s wireless connectivity business unit, said, “RFMD’s newest WiFi front end modules
demonstrate industry-leading performance and are aligned with the industry’s leading WiFi chipset providers on
their most anticipated reference designs. By achieving superior linearity and dynamic EVM, RFMD’s WiFi front end
modules enable the proliferation of mobile broadband connectivity across an ever-expanding range of growth
markets, including smartphones, tablets, notebooks, ultra-books, PCs, TV/video, e-readers, gaming, and
Dynamic EVM is a critical design specification for high data rate WiFi systems. While competitor solutions
have traditionally measured static EVM performance, RFMD’s FEMs achieve superior dynamic EVM to deliver
best-in-class real-world WiFi system performance. This enables optimum data throughput at increased operator
range, current savings through optimal transmit and receive speeds, and an enhanced user experience during video
streaming, gaming, and other high data rate applications.
RFMD’s RFFM8200/8202 (2.5GHz) and RFFM8500/8502
(5GHz) FEMs integrate the power amplifier, LNA, and switch functionality into a single plastic QFN package.
Designed for both “chip on board” and “system-in-package” (SiP) implementations, both product families deliver
best-in-class linear output power while operating over a wide range of operating voltages. The highly integrated
FEMs significantly reduce external component count outside the core WiFi chipset.
RFMD is exhibiting its
broad portfolio of WiFi products at the IEEE International Microwave Symposium, through June 22, 2012, in Booth
1210 at the Palais des congres convention center, in Montreal, Canada.
production quantities are available now through RFMD’s online store or through local RFMD sales channels.
RF Micro Devices, Inc. (Nasdaq GS: RFMD) is a global
leader in the design and manufacture of high-performance radio frequency components and compound semiconductor
technologies. RFMD’s products enable worldwide mobility, provide enhanced connectivity and support advanced
functionality in the cellular handset, wireless infrastructure, wireless local area network (WLAN), CATV/broadband
and aerospace and defense markets. RFMD is recognized for its diverse portfolio of semiconductor technologies and
RF systems expertise and is a preferred supplier to the world's leading mobile device, customer premises and
communications equipment providers.
Headquartered in Greensboro, N.C., RFMD is an ISO 9001- and ISO
14001-certified manufacturer with worldwide engineering, design, sales and service facilities. RFMD is traded on
the NASDAQ Global Select Market under the symbol RFMD. For more information, please visit RFMD's web site at
release includes "forward-looking statements" within the meaning of the safe harbor provisions of the Private
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numerous risks and uncertainties, including variability in operating results, risks associated with the impact of
global macroeconomic and credit conditions on our business and the business of our suppliers and customers, our
reliance on a few large customers for a substantial portion of our revenue, the rate of growth and development of
wireless markets, our ability to bring new products to market, our reliance on inclusion in third party reference
designs for a portion of our revenue, our ability to manage channel partner and customer relationships, risks
associated with the operation of our wafer fabrication, molecular beam epitaxy, assembly and test and tape and
reel facilities, our ability to complete acquisitions and integrate acquired companies, including the risk that we
may not realize expected synergies from our business combinations, our ability to attract and retain skilled
personnel and develop leaders, variability in production yields, raw material costs and availability, our ability
to reduce costs and improve margins in response to declining average selling prices, our ability to adjust
production capacity in a timely fashion in response to changes in demand for our products, dependence on gallium
arsenide (GaAs) for the majority of our products, dependence on third parties, and substantial reliance on
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VP, Investor Relations
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