EL SEDUNDO, Calif. – May 7, 2012 –
AWR Corporation, the innovation leader in high-frequency EDA
software, announces the AWR Design Forum (ADF) 2012 for Japan and Korea. The Japan event is scheduled for Friday,
July 6, 2012 and the Korea event is scheduled for Tuesday, July 10, 2012. The call for papers for both events is
now open. Visit www.awrdesignforum.com to learn more
and to submit a presentation.
ADF 2012 is an open event for designers of microwave and RF circuits and
systems such as MMIC, RFIC, RF PCB, modules, and communication systems to come together to learn about AWR’s
latest products and technologies and how they can help solve today’s and tomorrow’s design problems. It is also
provides an excellent opportunity to network and collaborate on industry issues and trends.
topics, given by AWR as well as partner firms National Instruments, WIN Semiconductor and Zuken, may include:
· Optimizing the Design and Verification of 4G RF Power Amplifiers · Design of a Novel
Multi-Slot Antenna Featuring EM Parameterization and Optimization Techniques · Simulating an NXP
Doherty Power Amplifier with Digital Pre-Distortion · Electrical/Thermal Coupled Solutions for Flip
Chip Designs · Design and Simulation of Modern Radar Systems · Fully Integrating 3D
Electromagnetic (EM) Simulation into Circuit Simulation · System Simulation Featuring Signal
Processing Blocks · RF Link Prediction - A New and Novel Approach · Linking RF Design
thru to Test
· RF Moving Beyond a Linear Datasheet · MMIC Design in AWR 2011 · The AWR
Design Flow Advantage - Introduction to New Features and Capabilities
Call for Papers
AWR Design Forum also provides an opportunity for the
presentation of interesting and informative papers from customers and partners working in the microwave & RF
industry, as well as from research and educational institutions. Participants interested in presenting are
requested to submit an abstracts to
by May 30, 2012. Final presentations are due by June 30, 2012.
Suggested topics include but are not
limited to RFIC and MMIC design, EM analysis of planar components and 3D passive interconnect, and LTE
communication system and radar applications, as well as microwave components, RF and microwave circuit boards, and
RF SoCs, SiPs, and module design. All presentations will be made available for download from the AWR web site
after the event concludes. Additionally, prizes will be awarded for best paper/presentation per location.
About AWR AWR, the
innovation leader in high-frequency EDA software, dramatically reduces development time and cost for products
employed in wireless, high-speed wired, broadband, aerospace and defense, and electro-optical applications.