-- Set for Thursday July 12, 2012 -- Call for Papers Now Open
EL SEGUNDO, Calif. – May 29,
2012 – AWR Corporation, the innovation leader in high-frequency EDA
software, announces that it has added Taiwan to the list of cities scheduled for the July 2012 tour of the
AWR Design Forum (ADF) 2012. The Taiwan event will
take place on Thursday, July 12.
The call for papers for the Taiwan forum, as well as for those in Japan
and Korea, is now open. Visit www.awrdesignforum.com
to learn more and to submit a presentation.
ADF 2012 is an open event for designers of microwave and RF
circuits and systems such as MMIC, RFIC, RF PCB, modules, and communication systems to come together to learn
about AWR’s latest products and technologies and how they can help solve today’s and tomorrow’s design problems.
It also provides an excellent opportunity to network and collaborate on industry issues and trends.
Agenda topics presented by AWR and partner firms National Instruments, WIN Semiconductor and Zuken, may include:
· Optimizing the Design and Verification of 4G RF Power Amplifiers · Design of a Novel
Multi-Slot Antenna Featuring EM Parameterization and Optimization Techniques · Simulating an NXP
Doherty Power Amplifier with Digital Pre-Distortion · Electrical/Thermal Coupled Solutions for Flip
Chip Designs · Design and Simulation of Modern Radar Systems · Fully Integrating 3D
Electromagnetic (EM) Simulation into Circuit Simulation · System Simulation Featuring Signal
Processing Blocks · RF Link Prediction - A New and Novel Approach · Linking RF Design
thru to Test
· RF Moving Beyond a Linear Datasheet · MMIC Design in AWR 2011 · The AWR
Design Flow Advantage - Introduction to New Features and Capabilities
Call for Papers The AWR Design Forum
also provides an opportunity for the presentation of interesting and informative papers from customers and
partners working in the microwave & RF industry, as well as from research and educational institutions.
Participants interested in presenting are requested to submit an abstract to
email@example.com by May 30,
2012. Final presentations are due by June 30, 2012.
Suggested topics include but are not limited to RFIC
and MMIC design, EM analysis of planar components and 3D passive interconnect, and LTE communication system and
radar applications, as well as microwave components, RF and microwave circuit boards, and RF SoCs, SiPs, and
module design. All presentations will be made available for download from the AWR web site after the event
concludes. Additionally, prizes will be awarded for best paper/presentation per location.
About AWR AWR, the
innovation leader in high-frequency EDA software, dramatically reduces development time and cost for products
employed in wireless, high-speed wired, broadband, aerospace and defense, and electro-optical applications.