May 15, 2012 Press Release
Software Demos in Booth #1514 Include AWR 2011 Product Portfolio, Analyst™ 3D FEM EM Debut; AWR and Partners MicroApps; and Annual Customer Party
EL SEGUNDO, Calif. – May 15, 2012 – AWR Corporation, the innovation leader in high-frequency EDA software, once again takes a leadership position at the International Microwave Symposium (IMS) 2012 with a full slate of AWR 2011 software demonstrations, MicroApps presentations and panel, and its renowned Customer Appreciation Party.
IMS 2012 takes place from June 17 to 22 in Montréal, Canada.
Visit AWR at Booth #1514 to see Analyst 2012, AWR’s 3D FEM EM technology for bumps, bond wires, tapered vias and more, as well as the latest release of Microwave Office™, Visual System Simulator™ (VSS), AXIEM® and Analog Office® for MMIC, RFIC, RF PCBs and module design.
AWR and its partners will be presenting 11 MicroApps and participating on a panel at the MicroApps Theater (Booth #1223). These talks provide additional insight into novel applications for and technologies within AWR software.
AWR software demonstrations:
• Analyst 2012 debut:
– 3D FEM EM for bond wires, bumps, balls, ribbons, tapered vias, finite dielectrics
• AWR 2011 product line including recent additions of:
– VSS and LabVIEW co-simulation for signal processing, hardware in the loop, and communications
standards like LTE and 802.11ac
– VSS’s Radar Library, Frequency Planner and more
– Microwave Office/AXIEM and CapeSym for electrical-thermal MMIC co-simulation
– Microwave Office/AXIEM for PCB verification via ODB++
– AXIEM’s 3D antenna plots
Tuesday, June 19:
12:50 p.m. Fully Integrating 3D Electromagnetic (EM)
Simulation into Circuit Simulation
Wednesday, June 20:
9:05 a.m. RF Link Prediction - A New and Novel Approach
10:50 a.m. Linking RF Design through to Test
12:05 p.m. Panel Session: Device Characterization Methods
and Advanced RF/Microwave Design - webcast and
registration details are available at
3:30 p.m. RF System Design -- Moving Beyond a Linear
3:35 p.m. Improve Microwave Circuit Design Flow through Passive Model Yield and Sensitivity Analysis
4:35 p.m. Electrical/Thermal Coupled Solutions for Flip Chip Designs
4:50 p.m. System Simulation Featuring Signal Processing Blocks
Thursday, June 21:
11:20 a.m. Optimizing the Design and Verification of 4G RF Power Amplifiers
11:35 a.m. Simulating an NXP Doherty Power Amplifier with Digital Pre-Distortion
12:50 p.m. Practical Electromagnetic Modeling of Parallel Plate Capacitors at High Frequency
1:20 p.m. Use of FPGAs for Faster Test Times and Repeatability on Cellular Measurements
1:50 p.m. Mind Your Reference Plane
Lastly, AWR’s 8th Annual Customer Appreciation Party (Petite Fête d’AWR 2012) is set for Wednesday, June 20 from 7:00 p.m. to midnight at the Pub St. Paul in Old Towne Montréal. Register for this not-to-be-missed event at http://www.awr-petitefete.com/
AWR, the innovation leader in high-frequency EDA software, dramatically reduces development time and cost for products employed in wireless, high-speed wired, broadband, aerospace and defense, and electro-optical applications.
Visit AWR at: AWR.TV, AWR Blogs, RSS, Facebook, Twitter, YouTube, and LinkedIn
© Copyright 2012 AWR Corporation. All rights reserved. AWR is a National Instruments Company. AWR, the AWR logo, AXIEM and Analog Office are registered trademarks and Microwave Office, Visual System Simulator and iMatch are trademarks of AWR Corporation. Other product and company names listed are trademarks or trade names of their respective companies.
Vice President of Marketing