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MECA Electronics Attenuators

New AWR Application Note Describes Benefits of Circuit Envelope Simulation
for 3G and 4G Amplifier Design

June 14, 2012 Press Release

Click to visit the AWR Corporation website


El Segundo, CA – June 14, 2012
 
What: Current and emerging wireless systems place greater demands on RF power amplifiers, including exceptional linearity, efficiency, and bandwidth. This new application note from AWR entitled “Leverage Circuit Envelope Simulation to Improve PA Performance” describes circuit envelope simulation, now part of AWR 2011. This technique lets designers optimize performance between linearity, efficiency, and bandwidth from the device to the system level. It builds on SPICE time domain and harmonic balance frequency domain simulation to provide more than either one alone can achieve. The full story continues on line:  www.awrcorp.com/Usa/Products/Visual-System-Simulator/
 
New AWR Application Note Describes Benefits of Circuit Envelope Simulation for 3G and 4G Amplifier DesignWhere: 
Online at http://web.awrcorp.com/content/Downloads/AWR-VSS-Envelope-White-Paper.pdf  and as a PDF attached to this media alert.
 
When: 
Immediately




About AWR
AWR, the innovation leader in high-frequency EDA software, dramatically reduces development time and cost for products employed in wireless, high-speed wired, broadband, aerospace and defense, and electro-optical applications.

Visit AWR at: AWR.TV, AWR Blogs, RSS, Facebook, Twitter, YouTube, and LinkedIn

© Copyright 2012 AWR Corporation. All rights reserved. AWR is a National Instruments Company. AWR, the AWR logo, AXIEM and Analog Office are registered trademarks and Microwave Office, Visual System Simulator and iMatch are trademarks of AWR Corporation. Other product and company names listed are trademarks or trade names of their respective companies.


Contacts:

Sherry Hess
Vice President of Marketing
AWR Corporation
(310) 726-3000
hess@awrcorp.com




Posted  6/15/2012
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