June 14, 2012 Press Release
El Segundo, CA – June 14, 2012
What: Current and emerging wireless systems place greater demands on RF power amplifiers, including exceptional linearity, efficiency, and bandwidth. This new application note from AWR entitled “Leverage Circuit Envelope Simulation to Improve PA Performance” describes circuit envelope simulation, now part of AWR 2011. This technique lets designers optimize performance between linearity, efficiency, and bandwidth from the device to the system level. It builds on SPICE time domain and harmonic balance frequency domain simulation to provide more than either one alone can achieve. The full story continues on line: www.awrcorp.com/Usa/Products/Visual-System-Simulator/
Online at http://web.awrcorp.com/content/Downloads/AWR-VSS-Envelope-White-Paper.pdf and as a PDF attached to this media alert.
AWR, the innovation leader in high-frequency EDA software, dramatically reduces development time and cost for products employed in wireless, high-speed wired, broadband, aerospace and defense, and electro-optical applications.
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