Nano Materials International (NMIC) Press Release - August 22, 2011
NMIC Introduces Industry’s First Aluminum Diamond
- Exceptional thermal conductivity can reduce device junction temperatures by 25%
Heat Spreader Material for GaN Devices
TUCSON, AZ (August 22, 2011) -- Nano Materials International Corp. ( NMIC)
today introduced the first commercial device-level solution for dissipating the heat generated by high-density
semiconductor devices such as gallium nitride (GaN) RF power transistors. When used as a heat spreader integrated
with a device, NMIC’s new aluminum diamond metal matrix composites (MMCs), have demonstrated their ability to
reduce device junction temperatures by up to 25%, allowing the devices to generate their full power output at
their highest efficiency and potentially extend their operating life. NMIC’s aluminum diamond MMC material is the
first aluminum diamond MMC material to be economically viable in high volume at a cost that adds minimally to each
GaN is the latest advancement in compound semiconductor technology for use in generating high
levels of RF power over broad frequency ranges well into the millimeter-wave range. GaN devices have much higher
power density than other technologies such as gallium arsenide (GaAs), silicon, and silicon germanium (SiGe) as
measured by the amount of power they can generate in given amount of device gate periphery. However, this power
density also results in the production of large amounts of waste heat that must be removed from the device, a
challenge that must be effectively met if GaN technology is to achieve its full potential.
Diamond has the highest thermal conductivity of any substance on Earth. When made as an aluminum-diamond
composite and used as a heat spreader material, this property remains about 80% higher than its nearest
competitor, copper-molybdenum-copper, which is widely used for this purpose. Aluminum diamond also has a
coefficient of thermal expansion (CTE) close to that of silicon carbide (SiC), which is essential as most GaN
devices employ SiC as their substrate material. NMIC’s aluminum diamond also has metallization properties well
suited for die attach, along with excellent dimensional tolerance and material stability.
NMIC’s MMC material with nickel-gold electrolytic or electroless plating is available in thicknesses, shapes, and
sizes required by GaN transistors or Microwave Monolithic Integrated Circuits (MMICs). It can be supplied as MMC
material alone or incorporated within a package in order to serve the needs of device manufacturers and package
Readers are encouraged to learn more by visiting
or by calling (520) 574-1980.
Nano Materials International Corp,
headquartered in Tucson, AZ was in 2005. It is dedicated to the development and commercialization of products
based on transparent ceramics (Spinel) for transparent ballistic protection and other applications, and aluminum
diamond metal matrix composites (MMCs) that offer the best properties for removing the heat generated by microwave
power transistors and laser diodes. The company operates in a 42,000 sq. ft. facility that incorporates
production, scale-up, application development, and technical support.
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