Chipworks Press Release - October 13, 2011
Ottawa, Ontario, October 13, 2011 – Chipworks announced it has posted initial results of its Apple iPhone 4S teardown and will continuously update images and information as it comes out of its labs over the next 48 hours. The focus of this analysis is on the die level to provide information that is not readily available at the board level.
Images and information from the teardown will be posted at http://www.chipworks.com/en/technical-competitive-analysis/resources/recent-teardowns, and select images are being shared with iFixit at http://www.ifixit.com/Teardown/iPhone-4S-Teardown/6610/1.
A full analysis will be available on the Chipworks website including de-capsulated images of the chips in the iPhone 4S, die layouts, and information on the process technology used to build some of the devices.
“The iPhone 4S contains a lot of the same devices observed in the iPhone 4 and the iPad 2 making this somewhat of a technology hybrid between the two,” says Jim Morrison, Product Manager at Chipworks. “We’re going to be looking deeper to confirm other similarities and differences. For example, we will confirm whether the A5 chip found in the iPhone 4S is still being fabricated by Samsung or has been moved to TSMC’s 40 nm low power process.”Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company’s ability to analyze the circuitry and physical composition of these systems makes it a key partner in the success of the world’s largest semiconductor and microelectronics companies. For more information, visit www.chipworks.com.
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