Electro-Photonics Expands Offering to Include Passive RF Components
Palm City, FL -- April 8, 2010 -- Electro-Photonics LLC offers performance high frequency
components and design services. We offer wire bondable passive components, coaxial products, printed antennas and
very useful test boards for evaluating RF/Microwave components. We custom design passive components and offer high
frequency packaging services.
The Electro-Photonics team can support your small R&D design requirements
and save you valuable design and characterization time. Available are chip and wire assembly services in a 10K
clean room and high frequency measurements to 110GHz.
Bondable Components Wire bondable inductors and capacitors are commonly used in hybrid circuits. Our
quartz spiral inductors offer excellent high frequency performance, while minimizing parasitic effects. In
addition, we offer a great selection of standard and custom single layer capacitors. The single layer capacitors
are used for RF bypass, AC coupling and resonant circuits.
Components Our current product offerings include SMA power
dividers/combiners. These power dividers have very low insertion loss and are compact in size covering the
frequency range from 0.5GHz to 18GHz. Future offerings will include directional and hybrid couplers, isolators,
Frequency Evaluation Boards We make design engineers’ jobs easier by offering test boards that
simplify the process of evaluating passive and active components. You save valuable CAD and engineering resources
and don't have to wait 8-12 weeks to get your
eval board. Despite their “simplicity”, we all know that these boards can cost a lot of money and time.
Our unique 0402 RF eval board will help you evaluate, in minutes, many passive components up to 10GHz. An
optimized through line, short, and open are included for quick de-embedding. Everything you need to evaluate any
passive component is on one easy to use board.
patch antennas optimized for MIMO WiFi applications at 2.4GHz. The antenna has an optimized RF launch for
quick measurements. This patch antenna can be used as a single element or in an array configuration.
Additionally, we design and manufacture antenna evaluation boards. These boards have an optimized RF launch for
quick measurements and are an inexpensive option allowing you to rapidly evaluate any patch, slot, or SMT chip
High Frequency MMIC Packaging Utilizing our extensive high frequency design experience,
Electro-Photonics can help you with your next MMIC packaging project. 3D EM analysis, combined with our experience
in hybrid circuit design and high frequency measurement, will save you money and time.
Diamond Design Services Electro-Photonics LLC offers
CVD diamond substrates for high frequency components, circuits, and packaging. Our technical solutions meet
the most demanding applications in RF/Microwave and optics. Typical applications include RF passive components,
power transistors packaging, high power diodes, high frequency hybrid circuits, and laser diodes.
RF Cable Assemblies
RF cable assemblies with high quality connectors and low loss flexible cables.