Electro-Photonics Press Release - April 8, 2010
The Electro-Photonics team can support your small R&D design requirements and save you valuable design and characterization time. Available are chip and wire assembly services in a 10K clean room and high frequency measurements to 110GHz.
Wire Bondable Components
Wire bondable inductors and capacitors are commonly used in hybrid circuits. Our quartz spiral inductors offer excellent high frequency performance, while minimizing parasitic effects. In addition, we offer a great selection of standard and custom single layer capacitors. The single layer capacitors are used for RF bypass, AC coupling and resonant circuits.
Our current product offerings include SMA power dividers/combiners. These power dividers have very low insertion loss and are compact in size covering the frequency range from 0.5GHz to 18GHz. Future offerings will include directional and hybrid couplers, isolators, and filters.
High Frequency Evaluation Boards
We make design engineers’ jobs easier by offering test boards that simplify the process of evaluating passive and active components. You save valuable CAD and engineering resources and don't have to wait 8-12 weeks to get your eval board. Despite their “simplicity”, we all know that these boards can cost a lot of money and time.
Our unique 0402 RF eval board will help you evaluate, in minutes, many passive components up to 10GHz. An optimized through line, short, and open are included for quick de-embedding. Everything you need to evaluate any passive component is on one easy to use board.
Electro-Photonics offers patch antennas optimized for MIMO WiFi applications at 2.4GHz. The antenna has an optimized RF launch for quick measurements. This patch antenna can be used as a single element or in an array configuration.
Additionally, we design and manufacture antenna evaluation boards. These boards have an optimized RF launch for quick measurements and are an inexpensive option allowing you to rapidly evaluate any patch, slot, or SMT chip antenna.
High Frequency MMIC Packaging
Utilizing our extensive high frequency design experience, Electro-Photonics can help you with your next MMIC packaging project. 3D EM analysis, combined with our experience in hybrid circuit design and high frequency measurement, will save you money and time.
CVD Diamond Design Services
Electro-Photonics LLC offers CVD diamond substrates for high frequency components, circuits, and packaging. Our technical solutions meet the most demanding applications in RF/Microwave and optics. Typical applications include RF passive components, power transistors packaging, high power diodes, high frequency hybrid circuits, and laser diodes.
RF Cable Assemblies
We offer RF cable assemblies with high quality connectors and low loss flexible cables.
2740 SW Martin Downs Blvd. #122
Palm City, FL 34990
Cage Code: 5ZPZ7
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