AWR Connected for Cadence Allegro Streamlines High-Performance PCB Design
Segundo, CA – June 15, 2010 –
AWR® Corporation, the innovation leader in high-frequency
EDA, announced today AWR Connected™ for Cadence® Allegro®, which enables PCB and RF co-design, simplifying the
design process for high performance printed circuit board (PCB) design and significantly shortening cycle times.
AWR Connected for Cadence Allegro is an interface between Cadence’s Allegro products, including both Allegro
PCB and Allegro package/SiP design tools, and AWR’s Microwave
Office® design software.
The combined product flow works by extracting user-specified data from
Allegro — conductors, nets, components, pins, substrate, material properties — and generating a file that can then
be quickly and easily imported into Microwave Office for simulation. The PCB layout is exported directly from
Cadence Allegro for layout and schematic creation in Microwave Office, and the imported design is ready for EM
extraction flow with, for example, AWR’s ACE ™ or AXIEM ™.
"Today’s RF and wireless PCBs contain analog,
digital, mixed-signal, and RF circuitry all on the same board. As a result, designers need to integrate their RF
design data with PCB layout technology,” said Hemant Shah, product management director for Cadence’s Allegro PCB &
FPGA products. “Our cooperative effort with AWR provides our customers with just such a flow and solution.”
“AWR Connected for Cadence Allegro is the latest in a series of AWR Connected products developed specifically to
integrate AWR software with complementary industry-leading design hardware and software,” said Sherry Hess, vice
president of marketing at AWR. “With AWR Connected products, our customers are able to leverage Microwave Office
software across a broad spectrum of hardware/software co-design.”
AWR, the innovation leader in high-frequency EDA software, dramatically
reduces development time and cost for products employed in wireless, high-speed wired, broadband, aerospace and
defense, and electro-optical applications. For more information, visit