Skyworks Introduces New pHEMT GaAs IC SP3T Switch
24, 2009 - Skyworks Solutions, Inc. has introduced a pseudomorphic high electron mobility transistor
(pHEMT) gallium arsenide (GaAs) integrated circuit (IC) SP3T switch for 0.1 to 6.0 GHz. The SKY13317-373LF
symmetric switch offers low insertion loss and high isolation with a 44 percent reduction in size than
SKY13309-370LF. Featuring higher overall transmit efficiency and linearity, less board space is used with greater
design/layout flexibility, equating to a small and thin end product. Appropriate for high volume, consumer
products -- end users will also discover better linearity and a clearer signal. The SKY13317-373LF is currently
being used with wireless local area network (WLAN) and Bluetooth® combo chipsets.
Samples are available, and pricing depends on quantities.
About Skyworks Skyworks Solutions, Inc. is an innovator of high performance analog
and mixed signal semiconductors enabling mobile connectivity. The company's power amplifiers, front-end modules
and direct conversion radios are at the heart of many of today's leading-edge multimedia handsets. Leveraging core
technologies, Skyworks also offers a diverse portfolio of linear products that support automotive, broadband,
cellular infrastructure, industrial and medical applications. Headquartered in Woburn, Mass., Skyworks is
worldwide with engineering, manufacturing, sales and service facilities throughout Asia, Europe and North America.
For more information, please visit Skyworks’ Web site at:
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established by the Private Securities Litigation Reform Act of 1995. These forward-looking statements include
information relating to future results and expectations of Skyworks (including certain projections and business
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actual results to differ materially and adversely from those projected, and may affect our future operating
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These risks and uncertainties include, but are not limited to:
unprecedented uncertainty regarding global economic and financial market conditions; the susceptibility of the
wireless semiconductor industry and the markets addressed by our, and our customers', products to economic
downturns; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the
ability of our customers, to manage inventory; losses or curtailments of purchases or payments from key customers,
or the timing of customer inventory adjustments; changes in laws, regulations and/or policies in the United States
that could adversely affect financial markets and our ability to raise capital; our ability to develop,
manufacture and market innovative products in a highly price competitive and rapidly changing technological
environment; economic, social and political conditions in the countries in which we, our customers or our
suppliers operate, including security and health risks, possible disruptions in transportation networks and
fluctuations in foreign currency exchange rates; fluctuations in our manufacturing yields due to our complex and
specialized manufacturing processes; delays or disruptions in production due to equipment maintenance, repairs
and/or upgrades; our reliance on several key customers for a large percentage of our sales; fluctuations in the
manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication,
assembly, testing or delivery of our products; the availability and pricing of third party semiconductor foundry,
assembly and test capacity and raw materials; our ability to timely and accurately predict market requirements and
evolving industry standards, and to identify opportunities in new markets; uncertainties of litigation, including
potential disputes over intellectual property infringement and rights, as well as payments related to the
licensing and/or sale of such rights; our ability to rapidly develop new products and avoid product obsolescence;
our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions
and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business
and product plans; lengthy product development cycles that impact the timing of new product introductions;
unfavorable changes in product mix; the quality of our products and any remediation costs; shorter than expected
product life cycles; problems or delays that we may face in shifting our products to smaller geometry process
technologies and in achieving higher levels of design integration; and our ability to continue to grow and
maintain an intellectual property portfolio and obtain needed licenses from third parties, as well as other risks
and uncertainties, including but not limited to those detailed from time to time in our filings with the
Securities and Exchange Commission.
These forward-looking statements are made
only as of the date hereof, and we undertake no obligation to update or revise the forward-looking statements,
whether as a result of new information, future events or otherwise.