Skyworks Supports Samsung's Newest GPRS, EDGE and 3G Handsets
Partners with Qualcomm, Broadcom, Infineon, NXP and Other Baseband Suppliers
Mass. – Feb. 9, 2009 – Skyworks Solutions, Inc. (NASDAQ: SWKS), an innovator of high reliability analog
and mixed signal semiconductors enabling a broad range of end markets, today announced that Samsung is leveraging
its front-end modules (FEM) and power amplifiers (PA) in its innovative general packet radio service (GPRS),
enhanced data GSM management (EDGE), and third generation (3G) – in particular its universal mobile
telecommunications system (UMTS) – models. Skyworks is partnering with baseband suppliers such as Qualcomm,
Broadcom, Infineon and NXP to provide highly integrated front-end solutions for tier-one mobile handset
manufacturers such as Samsung.
Samsung is utilizing Skyworks’ FEMs and PAs in their latest B3030, B320 and S7330 models. Optimized
features include Bluetooth, USB, Web browsing, camera, gaming and messaging functionality – included in ultra
compact devices with impressive talk times up to seven hours.
“Skyworks is pleased to be an integral part of
Samsung’s compelling new lineup of GPRS, EDGE and 3G handsets as we continue to partner with a broader set of
baseband suppliers,” said Liam K. Griffin, Skyworks’ senior vice president of sales and marketing. “Our front-end
module and power amplifier participation in their newest models is a reflection of yet another multimode
design-win and increasing market share gains at Samsung and other OEMs.”
Skyworks’ FEMs and PAs
- The SKY77170 PA module for wideband code division multiple access (WCDMA) is a fully matched 10-pad
surface mount module that covers the full 1920-1980 megahertz (MHz) bandwidth and meets the stringent spectral
linearity requirements of high-speed downlink packet access (HSDPA) data transmission with high power-added
efficiency (PAE) for up to 27 dBm output.
- The SKY77336 PA module for quad-band global system for mobile communications (GSM)/GPRS is designed in a
compact form factor for cellular handsets supporting gaussian minimum-shift keying (GMSK) and polar EDGE
- The SKY77344 PA module for quad-band GSM and EDGE is designed in a compact form factor for cellular
handsets supporting GMSK and linear EDGE modulation.
- The SKY77519 transmit-receive (Tx-RX) FEM for quad-band GSM/GPRS/EDGE-single band WCDMA antenna switch
support contains a very low profile and EDGE polar modulation.
- The SKY77531 Tx-Rx integrated phase and amplitude controller (iPAC)™ quad-band FEM for GSM/GPRS also
contains a low profile compact form factor.
- The SKY77534 Tx-Rx iPAC dual-band GSM/GPRS FEM is designed in a low profile, compact form factor
and offers a complete transmit voltage-controlled oscillator (VCO)-to-antenna and antenna-to-receive surface
acoustic wave (SAW) filter solution.
Skyworks Solutions, Inc. is an innovator of high performance analog and
mixed signal semiconductors enabling mobile connectivity. The company's power amplifiers, front-end modules and
direct conversion radios are at the heart of many of today's leading-edge multimedia handsets. Leveraging core
technologies, Skyworks also offers a diverse portfolio of linear products that support automotive, broadband,
cellular infrastructure, industrial and medical applications.
Headquartered in Woburn, Mass., Skyworks is
worldwide with engineering, manufacturing, sales and service facilities throughout Asia, Europe and North America.
For more information, please visit Skyworks’ Web site at:
Senior Public Relations Manager
Skyworks Solutions, Inc.
5221 California Avenue
Irvine, CA 92617-3073
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Litigation Reform Act of 1995. These forward-looking statements include information relating to future results and
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those projected, and may affect our future operating results, financial position and cash flows.
risks and uncertainties include, but are not limited to: unprecedented uncertainty regarding global economic and
financial market conditions; the susceptibility of the wireless semiconductor industry and the markets addressed
by our, and our customers', products to economic downturns; the timing, rescheduling or cancellation of
significant customer orders and our ability, as well as the ability of our customers, to manage inventory; losses
or curtailments of purchases or payments from key customers, or the timing of customer inventory adjustments;
changes in laws, regulations and/or policies in the United States that could adversely affect financial markets
and our ability to raise capital; our ability to develop, manufacture and market innovative products in a highly
price competitive and rapidly changing technological environment; economic, social and political conditions in the
countries in which we, our customers or our suppliers operate, including security and health risks, possible
disruptions in transportation networks and fluctuations in foreign currency exchange rates; fluctuations in our
manufacturing yields due to our complex and specialized manufacturing processes; delays or disruptions in
production due to equipment maintenance, repairs and/or upgrades; our reliance on several key customers for a
large percentage of our sales; fluctuations in the manufacturing yields of our third party semiconductor foundries
and other problems or delays in the fabrication, assembly, testing or delivery of our products; the availability
and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; our ability to
timely and accurately predict market requirements and evolving industry standards, and to identify opportunities
in new markets; uncertainties of litigation, including potential disputes over intellectual property infringement
and rights, as well as payments related to the licensing and/or sale of such rights; our ability to rapidly
develop new products and avoid product obsolescence; our ability to retain, recruit and hire key executives,
technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at
the compensation levels needed to implement our business and product plans; lengthy product development cycles
that impact the timing of new product introductions; unfavorable changes in product mix; the quality of our
products and any remediation costs; shorter than expected product life cycles; problems or delays that we may face
in shifting our products to smaller geometry process technologies and in achieving higher levels of design
integration; and our ability to continue to grow and maintain an intellectual property portfolio and obtain needed
licenses from third parties, as well as other risks and uncertainties, including but not limited to those detailed
from time to time in our filings with the Securities and Exchange Commission.
These forward-looking statements are made only as of the date hereof, and we undertake no obligation to update or
revise the forward-looking statements, whether as a result of new information, future events or otherwise.