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Skyworks Solutions Press Release - 2/17/2009

Skyworks Introduces the Most Comprehensive Portfolio of LTE Power Amplifiers and Front-End Modules

Solutions Cover Multiple Bands and Modes for 4G Handsets, PC Cards and Other Embedded Solutions

Click to visit the Skyworks websiteBARCELONA, Spain − Mobile World Congress − Feb. 17, 2009--Skyworks Solutions, Inc. (NASDAQ:SWKS), an innovator of high reliability analog and mixed signal semiconductors enabling a broad range of end markets, today introduced the industry’s broadest family of power amplifiers (PA) and front-end modules (FEM) for long-term evolution (LTE) applications. LTE has emerged as the dominant 4G standard with all major handset OEMs, infrastructure suppliers, and operators across the globe committed to this technology. According to Strategy Analytics, the global LTE handset market alone is expected to reach 150 million units by 2013.
This multi-band and multi-mode family of products, which now includes two new PA modules and four new FEMs, supports 13 frequency bands - - - the largest across the industry - - - and provides the most complete and flexible set of options for manufacturers developing and building 4G-enabled handsets, infrastructure basestations, wireless PC cards, and a variety of other embedded solutions. The portfolio includes the industry’s first PA modules supporting LTE-FDD for the United States (the SKY77449 and SKY77453) and LTE-TDD for China (the SKY77441); and the industry’s first LTE front-end module for Band VII.

“Skyworks’ newest product offerings solidify the company’s 4G leadership position and illustrate our commitment to providing the smallest, most cost-effective and highest performance wireless analog solutions,” said Dr. Gene A. Tkachenko, senior director of engineering responsible for LTE development at Skyworks. “Through our complete product portfolio, we are enabling multiple applications across a wide range of frequencies, supporting next-generation technologies worldwide.”

About Skyworks’ Newest LTE Power Amplifiers and Front-End Modules

The SKY77455, SKY77456, SKY77457 and SKY77458 -- compact front-end modules that support Bands I, IV/X, V/VI and VIII, respectively -- are fully matched and completely compliant for LTE, as well as HSDPA and WCDMA standards. These FEMs integrate the PA, interstage filter, input/output matching, power detection, and duplexer functionality in a small 4 x 7 millimeter (mm) form factor.

The SKY77449 for Bands XIII and XIV, and the SKY77453 for Bands XII and XVII, are both fully matched PA modules developed for 4G LTE/EUTRAN standards. They integrate all active RF circuitry, including the input, interstage and output matching circuits and power detector functionality within a single 4 x 4 x 0.85 mm low-profile package.

Using Skyworks' advanced indium gallium phosphide (InGaP) bipolar field effect transistor (BiFET) design, which provides advanced bias and detection architecture implementation, and Skyworks GreenTM packaging solutions, the family also supports low-operating voltage down to 3 volts (V) with high power added efficiency (PAE), high reliability and quality. The portfolio also delivers high linear power under quadrature phase-shift keying (QPSK), 16 quadrature amplitude modulations (QAM), and wideband code division multiple access (WCDMA) modulation, with up to 20 megahertz (MHz) in bandwidth and partial or full resource block allocation.

The SKY77445 PA module for Band VII and the SKY77441 FEM for Bands 38 and 40 were introduced in 2008 and complete this newly expanded LTE product family.
Pricing and Availability
Samples of all new devices are currently available, with volume production scheduled to begin this year. For customized pricing, please contact sales@skyworksinc.com.
Skyworks at Mobile World Congre

 Skyworks will be showcasing its portfolio of Intera™ solutions in Hall 8, Stand C132 at Mobile World Congress, being held February 16-19.
About Skyworks
Skyworks Solutions, Inc. is an innovator of high performance analog and mixed signal semiconductors enabling mobile connectivity.  The company's power amplifiers, front-end modules and direct conversion radios are at the heart of many of today's leading-edge multimedia handsets. Leveraging core technologies, Skyworks also offers a diverse portfolio of linear products that support automotive, broadband, cellular infrastructure, industrial and medical applications.
Headquartered in Woburn, Mass., Skyworks is worldwide with engineering, manufacturing, sales and service facilities throughout Asia, Europe and North America. For more information, please visit Skyworks’ Web site at: www.skyworksinc.com.

Amanda Ingalls
Senior Public Relations Manager
Skyworks Solutions, Inc.
5221 California Avenue
Irvine, CA 92617-3073
949-231-3045 (telephone)
949-231-4117 (fax)
Safe Harbor Statement
This news release includes "forward-looking statements" intended to qualify for the safe harbor from liability established by the Private Securities Litigation Reform Act of 1995. These forward-looking statements include information relating to future results and expectations of Skyworks (including certain projections and business trends). Forward-looking statements can often be identified by words such as "anticipates," "expects," "forecasts," "intends," "believes," "plans," "may," "will," "continue," similar expressions, and variations or negatives of these words. All such statements are subject to certain risks and uncertainties that could cause actual results to differ materially and adversely from those projected, and may affect our future operating results, financial position and cash flows.

These risks and uncertainties include, but are not limited to: unprecedented uncertainty regarding global economic and financial market conditions; the susceptibility of the wireless semiconductor industry and the markets addressed by our, and our customers', products to economic downturns; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; losses or curtailments of purchases or payments from key customers, or the timing of customer inventory adjustments; changes in laws, regulations and/or policies in the United States that could adversely affect financial markets and our ability to raise capital; our ability to develop, manufacture and market innovative products in a highly price competitive and rapidly changing technological environment; economic, social and political conditions in the countries in which we, our customers or our suppliers operate, including security and health risks, possible disruptions in transportation networks and fluctuations in foreign currency exchange rates; fluctuations in our manufacturing yields due to our complex and specialized manufacturing processes; delays or disruptions in production due to equipment maintenance, repairs and/or upgrades; our reliance on several key customers for a large percentage of our sales; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the availability and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; our ability to timely and accurately predict market requirements and evolving industry standards, and to identify opportunities in new markets; uncertainties of litigation, including potential disputes over intellectual property infringement and rights, as well as payments related to the licensing and/or sale of such rights; our ability to rapidly develop new products and avoid product obsolescence; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans; lengthy product development cycles that impact the timing of new product introductions; unfavorable changes in product mix; the quality of our products and any remediation costs; shorter than expected product life cycles; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; and our ability to continue to grow and maintain an intellectual property portfolio and obtain needed licenses from third parties, as well as other risks and uncertainties, including but not limited to those detailed from time to time in our filings with the Securities and Exchange Commission.

These forward-looking statements are made only as of the date hereof, and we undertake no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.


Date Posted  2/20/2009

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