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Skyworks Solutions Press Release - 2/16/2009

Skyworks Unveils Industry’s Smallest WCDMA
Power Amplifiers with Integrated Directional Couplers

Family of Single and Dual-Band Products Designed for Seamless Operation
with UMTS Chipsets; Addresses Most Widely Used Frequency Bands


Click to visit the Skyworks websiteBARCELONA, Spain − Mobile World Congress − Feb. 16, 2009--Skyworks Solutions, Inc. (NASDAQ:SWKS), an innovator of high reliability analog and mixed signal semiconductors enabling a broad range of end markets, today introduced a family of single and dual-band WCDMA power amplifiers (PA) for universal mobile telecommunications system (UMTS) applications that integrate the directional coupler, significantly reducing the phone board footprint and bill-of-material costs.

The company’s expanded portfolio of front-end solutions now includes five of the world’s smallest and highest performance UMTS PAs that support Bands I, II, IV, V and VIII, and two dual band PAs that support the most popular band combinations – bands I/VIII and II/V. These compact solutions provide seamless operation and offer high power added efficiency (PAE) at mid and low powers, significantly increasing talk times.

SKY77191 Block Diagram“Skyworks is proud to continue its tradition of delivering industry-leading solutions that meet today’s demanding 3G requirements,” said Gregory L. Waters, executive vice president and general manager, front-end solutions. “Our newest family of power amplifiers offers significant benefits to handset OEMs who must constantly address size, cost and performance issues across a broad range of frequencies.”

Skyworks’ Family of WCDMA Power Amplifiers
Skyworks’ Intera™ portfolio now includes the:
SKY77186 for Band I: 1920-1980 MHz
SKY77187
for Band II: 1850-1910 MHz
SKY77188
for Band V, VI: 824-849 MHz
SKY77189
for Band VIII: 880-915 MHz
SKY77191
for Band IV, IX, X: 1710-1785 MHz

The five small and efficient 3 x 3 millimeter (mm) solutions are fully matched, 10-pad surface mount modules. Because of high efficiencies attained throughout the entire power range, the devices deliver unsurpassed talk-time advantages. They also meet stringent spectral linearity requirements of high-speed downlink packet access (HSDPA) data transmission with high PAE.

SKY77195 for Bands I and VIII: 1920-1980 MHz and 880-915 MHz
SKY77196
for Bands II and V: 1850-1910 MHz and 824-849 MHz

The two 4 x 5 mm dual band PA modules provide convenient solutions for these increasingly popular phone models. Skyworks’ revolutionary integration techniques pack most of the external passive components into the modules, requiring only two external bypassing capacitors for the two bands compared to 10-14 passives typically required with two single band PA modules. This results in unmatched bill of materials count savings as well as up to 40-50 percent board area savings, enabling OEMs to devote more functionality to the phone without increasing its size.

The single gallium arsenide (GaAs) microwave monolithic integrated circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. Output match into a 50-ohm load is realized off-chip within the module package to optimize efficiency and power performance.
The PA modules are manufactured with Skyworks’ indium gallium phosphide (InGaP) heterojunction bipolar transistor (HBT) bipolar field effect transistor (BiFET) process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity.

Pricing and Availability
Samples are currently available, with volume production scheduled to commence the quarter. For customized pricing, please contact sales@skyworksinc.com.

Skyworks at Mobile World Congress

 Skyworks will be showcasing its portfolio of Intera™ solutions in Hall 8, Stand C132 at Mobile World Congress, being held February 16-19. 

About Skyworks
Skyworks Solutions, Inc. is an innovator of high performance analog and mixed signal semiconductors enabling mobile connectivity.  The company's power amplifiers, front-end modules and direct conversion radios are at the heart of many of today's leading-edge multimedia handsets. Leveraging core technologies, Skyworks also offers a diverse portfolio of linear products that support automotive, broadband, cellular infrastructure, industrial and medical applications.
Headquartered in Woburn, Mass., Skyworks is worldwide with engineering, manufacturing, sales and service facilities throughout Asia, Europe and North America. For more information, please visit Skyworks’ Web site at: www.skyworksinc.com.

Amanda Ingalls
Senior Public Relations Manager
Skyworks Solutions, Inc.
5221 California Avenue
Irvine, CA 92617-3073
949-231-3045 (telephone)
949-231-4117 (fax)
amanda.ingalls@skyworksinc.com
www.skyworksinc.com
 

Safe Harbor Statement
This news release includes "forward-looking statements" intended to qualify for the safe harbor from liability established by the Private Securities Litigation Reform Act of 1995. These forward-looking statements include information relating to future results and expectations of Skyworks (including certain projections and business trends). Forward-looking statements can often be identified by words such as "anticipates," "expects," "forecasts," "intends," "believes," "plans," "may," "will," "continue," similar expressions, and variations or negatives of these words. All such statements are subject to certain risks and uncertainties that could cause actual results to differ materially and adversely from those projected, and may affect our future operating results, financial position and cash flows.

These risks and uncertainties include, but are not limited to: unprecedented uncertainty regarding global economic and financial market conditions; the susceptibility of the wireless semiconductor industry and the markets addressed by our, and our customers', products to economic downturns; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; losses or curtailments of purchases or payments from key customers, or the timing of customer inventory adjustments; changes in laws, regulations and/or policies in the United States that could adversely affect financial markets and our ability to raise capital; our ability to develop, manufacture and market innovative products in a highly price competitive and rapidly changing technological environment; economic, social and political conditions in the countries in which we, our customers or our suppliers operate, including security and health risks, possible disruptions in transportation networks and fluctuations in foreign currency exchange rates; fluctuations in our manufacturing yields due to our complex and specialized manufacturing processes; delays or disruptions in production due to equipment maintenance, repairs and/or upgrades; our reliance on several key customers for a large percentage of our sales; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the availability and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; our ability to timely and accurately predict market requirements and evolving industry standards, and to identify opportunities in new markets; uncertainties of litigation, including potential disputes over intellectual property infringement and rights, as well as payments related to the licensing and/or sale of such rights; our ability to rapidly develop new products and avoid product obsolescence; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans; lengthy product development cycles that impact the timing of new product introductions; unfavorable changes in product mix; the quality of our products and any remediation costs; shorter than expected product life cycles; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; and our ability to continue to grow and maintain an intellectual property portfolio and obtain needed licenses from third parties, as well as other risks and uncertainties, including but not limited to those detailed from time to time in our filings with the Securities and Exchange Commission.


These forward-looking statements are made only as of the date hereof, and we undertake no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.
 

 

Posted 2/17/2009

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