Skyworks Introduces Low Noise General Purpose Amplifier
Solutions, Inc. has introduced a new low noise amplifier (LNA) that operates in the 250 megahertz (MHz) to 6
gigahertz (GHz) range – the SKY65038-70LF.
The SKY65038 is a general purpose, broadband amplifier fabricated from Skyworks’ pHEMT process and packaged in a
miniature SOT-89 package. The amplifier's low noise figure of 2 dB and high output IP3 of 40 dBm at 1.0 GHz allows
these devices to be used in various transmit/receive applications. In addition, the amplifier's output impedance
is 50 Ω, which enables these devices to be easily cascaded with a simple input impedance matching network.
The SKY65038 is lead (Pb)-free and RoHS-compliant. It also contains no antimony or halogens such as bromine. A
populated evaluation board is available upon request.
The datasheet is located
and samples are available.
Pricing depends on quantities. Please contact a sales representative
at firstname.lastname@example.org or visit the company’s Web site at www.skyworksinc.com for more information.
Skyworks Solutions, Inc. is an innovator of high performance analog and mixed signal
semiconductors enabling mobile connectivity. The company's power amplifiers, front-end modules and direct
conversion radios are at the heart of many of today's leading-edge multimedia handsets. Leveraging core
technologies, Skyworks also offers a diverse portfolio of linear products that support automotive, broadband,
cellular infrastructure, industrial and medical applications.
Headquartered in Woburn, Mass., Skyworks is
worldwide with engineering, manufacturing, sales and service facilities throughout Asia, Europe and North America.
For more information, please visit Skyworks’ Web site at:
Senior Public Relations Manager
Skyworks Solutions, Inc.
5221 California Avenue
Irvine, CA 92617-3073
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those projected, and may affect our future operating results, financial position and cash flows.
risks and uncertainties include, but are not limited to: unprecedented uncertainty regarding global economic and
financial market conditions; the susceptibility of the wireless semiconductor industry and the markets addressed
by our, and our customers', products to economic downturns; the timing, rescheduling or cancellation of
significant customer orders and our ability, as well as the ability of our customers, to manage inventory; losses
or curtailments of purchases or payments from key customers, or the timing of customer inventory adjustments;
changes in laws, regulations and/or policies in the United States that could adversely affect financial markets
and our ability to raise capital; our ability to develop, manufacture and market innovative products in a highly
price competitive and rapidly changing technological environment; economic, social and political conditions in the
countries in which we, our customers or our suppliers operate, including security and health risks, possible
disruptions in transportation networks and fluctuations in foreign currency exchange rates; fluctuations in our
manufacturing yields due to our complex and specialized manufacturing processes; delays or disruptions in
production due to equipment maintenance, repairs and/or upgrades; our reliance on several key customers for a
large percentage of our sales; fluctuations in the manufacturing yields of our third party semiconductor foundries
and other problems or delays in the fabrication, assembly, testing or delivery of our products; the availability
and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; our ability to
timely and accurately predict market requirements and evolving industry standards, and to identify opportunities
in new markets; uncertainties of litigation, including potential disputes over intellectual property infringement
and rights, as well as payments related to the licensing and/or sale of such rights; our ability to rapidly
develop new products and avoid product obsolescence; our ability to retain, recruit and hire key executives,
technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at
the compensation levels needed to implement our business and product plans; lengthy product development cycles
that impact the timing of new product introductions; unfavorable changes in product mix; the quality of our
products and any remediation costs; shorter than expected product life cycles; problems or delays that we may face
in shifting our products to smaller geometry process technologies and in achieving higher levels of design
integration; and our ability to continue to grow and maintain an intellectual property portfolio and obtain needed
licenses from third parties, as well as other risks and uncertainties, including but not limited to those detailed
from time to time in our filings with the Securities and Exchange Commission.
These forward-looking statements are made only as of the date hereof, and we undertake no obligation to update or
revise the forward-looking statements, whether as a result of new information, future events or otherwise.