 |
||||
Skyworks Solutions Press Release - October 12, 2009 |
||||
Skyworks Powers LG’s Next Generation of Multimedia HandsetsFlagship Phones Leveraging Skyworks’ Front-End Solutions WOBURN,
Mass. – October 12, 2009 – Skyworks Solutions, Inc. (NASDAQ:SWKS), an innovator of high reliability
analog and mixed signal semiconductors enabling a broad range of end markets, today announced that it is powering
several of LG Electronics’ newest multimedia handsets. In particular, Skyworks’ front-end solutions are at the
heart of LG’s
GM200,
GR500 and
KP500 - - - innovative platforms with enhanced touchscreen, audio, camera and messaging functionality.  “Skyworks
is pleased to support LG with our family of high-quality 3G and 4G front-end solutions, particularly as they
launch their suite of next generation, feature-rich mobile handsets,” said Liam K. Griffin, senior vice president,
sales and marketing for Skyworks. “As a valued business partner, we look forward to further enhancing our
relationship with LG as they increasingly expand their global mobile communications presence.” About LG’s Newest Handsets The LG-GM200 camera mobile phone has a 2.1 channel active sub-woofer with dual-side speakers, Dolby mobile, wireless FM radio with recording smart profiling, a 2 megapixel (MP) camera with video recording, Bluetooth® 2.0, MicroSD memory port, radio alarm, and up to 10 hours of talk time. The innovative LG-GR500, or Xenon, features a large touch screen with vibration feedback and enhanced flash equating to increased functionality, full slideout 4-line QWERTY keyboard, music player, speaker independent voice commands, enhanced user interface, MicroSD memory port, 2 MP camera and camcorder with flash, is Bluetooth® capable, and offers advanced messaging. The attractively-priced LG-KP500 utilizes a high-end full 3 inch touch screen phone with improved navigation to watch videos, play motion-sensor games, and look at photos. In addition, the handset contains an active flash user interface (UI), handwriting and editing functionality, auto-rotating display, and an embedded stylus pen. About Skyworks’ Front-End Solutions The small and efficient SKY77175 dual-band power amplifier (PA) for WCDMA/HSDPA band II (1850-1910 MHz), band V (824-849 MHz) is a fully matched, 14-pad surface-mount technology (SMT) module that meets the stringent spectral linearity requirements of WCDMA transmission, high power-added efficiency (PAE) for power output to 29 dBm (Band II) and 29 dBm (Band V), and a low current analog pad (VCONT) to improve efficiency for the low RF power range operation. The SKY77340 PA module is designed in a compact-form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, PCS1900, supporting gaussian minimum shift keying (GMSK) and linear EDGE modulation, and Class 12 GPRS multi-slot operation. Two separate HBT PA blocks supporting the GSM850/900 band and the DCS1800/PCS1900 band are fabricated onto indium gallium arsenide (InGaP) die. Inputs and outputs are impedance-matched to 50 ohms, and a custom complementary metal oxide semiconductor (CMOS) IC provides the internal MFC function and interface circuitry. The SKY77521 transmit and receive (Tx-Rx) front-end module (FEM), designed in a very low profile (1 mm), contains compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800 and PCS1900 operation – making it a complete transmit VCO-to-antenna and antenna-to-receive surface-acoustic wave (SAW) filter solution. The FEM also supports Class 12 GPRS multi-slot operation and EDGE polar modulation. WCDMA switch-through support is provided by three dedicated high-linearity ports. The SKY77531 Tx/Rx integrated phase and amplitude controller (iPAC) FEM is in a low profile compact form factor, and supports quad-band cellular handsets operating GSM850/900 and DCS1800/PCS1900, and Class 12 GPRS multi-slot operation. The module consists of separate GSM850/900 and DCS1800/PCS1900 PA blocks, 50-ohm impedance-matched inputs and outputs, TX harmonics filtering, high linearity and a low insertion loss pseudomorphic high electron mobility transistor (pHEMT) RF switch, and a PAC block with internal current sense resistor. About Skyworks Skyworks Solutions, Inc. is an innovator of high performance analog and mixed signal semiconductors enabling mobile connectivity. The company's power amplifiers, front-end modules and direct conversion radios are at the heart of many of today's leading-edge multimedia handsets. Leveraging core technologies, Skyworks also offers a diverse portfolio of linear products that support automotive, broadband, cellular infrastructure, industrial and medical applications. Headquartered in Woburn, Mass., Skyworks is worldwide with engineering, manufacturing, sales and service facilities throughout Asia, Europe and North America. For more information, please visit Skyworks’ Web site at: www.skyworksinc.com. Amanda Ingalls Senior Public Relations Manager Skyworks Solutions, Inc. 5221 California Avenue Irvine, CA 92617-3073 949-231-3045 (telephone) 949-231-4117 (fax) amanda.ingalls@skyworksinc.com www.skyworksinc.com Safe Harbor Statement This news release includes "forward-looking statements" intended to qualify for the safe harbor from liability established by the Private Securities Litigation Reform Act of 1995. These forward-looking statements include information relating to future results and expectations of Skyworks (including certain projections and business trends). Forward-looking statements can often be identified by words such as "anticipates," "expects," "forecasts," "intends," "believes," "plans," "may," "will," "continue," similar expressions, and variations or negatives of these words. All such statements are subject to certain risks and uncertainties that could cause actual results to differ materially and adversely from those projected, and may affect our future operating results, financial position and cash flows. These risks and uncertainties include, but are not limited to: unprecedented uncertainty regarding global economic and financial market conditions; the susceptibility of the wireless semiconductor industry and the markets addressed by our, and our customers', products to economic downturns; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; losses or curtailments of purchases or payments from key customers, or the timing of customer inventory adjustments; changes in laws, regulations and/or policies in the United States that could adversely affect financial markets and our ability to raise capital; our ability to develop, manufacture and market innovative products in a highly price competitive and rapidly changing technological environment; economic, social and political conditions in the countries in which we, our customers or our suppliers operate, including security and health risks, possible disruptions in transportation networks and fluctuations in foreign currency exchange rates; fluctuations in our manufacturing yields due to our complex and specialized manufacturing processes; delays or disruptions in production due to equipment maintenance, repairs and/or upgrades; our reliance on several key customers for a large percentage of our sales; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the availability and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; our ability to timely and accurately predict market requirements and evolving industry standards, and to identify opportunities in new markets; uncertainties of litigation, including potential disputes over intellectual property infringement and rights, as well as payments related to the licensing and/or sale of such rights; our ability to rapidly develop new products and avoid product obsolescence; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans; lengthy product development cycles that impact the timing of new product introductions; unfavorable changes in product mix; the quality of our products and any remediation costs; shorter than expected product life cycles; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; and our ability to continue to grow and maintain an intellectual property portfolio and obtain needed licenses from third parties, as well as other risks and uncertainties, including but not limited to those detailed from time to time in our filings with the Securities and Exchange Commission. These forward-looking statements are made only as of the date hereof, and we undertake no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise. Date Posted 10/13/2009 |
||||
|
||||
