Skyworks Powers LG’s Next Generation of Multimedia Handsets
Flagship Phones Leveraging Skyworks’ Front-End Solutions
Mass. – October 12, 2009
– Skyworks Solutions, Inc. (NASDAQ:SWKS), an innovator of high reliability
analog and mixed signal semiconductors enabling a broad range of end markets, today announced that it is powering
several of LG Electronics’ newest multimedia handsets. In particular, Skyworks’ front-end solutions are at the
heart of LG’s
- - - innovative platforms with enhanced touchscreen, audio, camera and messaging functionality.
is pleased to support LG with our family of high-quality 3G and 4G front-end solutions, particularly as they
launch their suite of next generation, feature-rich mobile handsets,” said Liam K. Griffin, senior vice president,
sales and marketing for Skyworks. “As a valued business partner, we look forward to further enhancing our
relationship with LG as they increasingly expand their global mobile communications presence.”
About LG’s Newest Handsets
camera mobile phone has a 2.1 channel active sub-woofer with dual-side speakers, Dolby mobile,
wireless FM radio with recording smart profiling, a 2 megapixel (MP) camera with video recording, Bluetooth® 2.0,
MicroSD memory port, radio alarm, and up to 10 hours of talk time.
, or Xenon, features a large touch screen with vibration feedback and enhanced flash equating to
increased functionality, full slideout 4-line QWERTY keyboard, music player, speaker independent voice commands,
enhanced user interface, MicroSD memory port, 2 MP camera and camcorder with flash, is Bluetooth® capable, and
offers advanced messaging.
utilizes a high-end full 3 inch touch screen phone with improved navigation to watch videos, play
motion-sensor games, and look at photos. In addition, the handset contains an active flash user interface (UI),
handwriting and editing functionality, auto-rotating display, and an embedded stylus pen.
About Skyworks’ Front-End Solutions
The small and efficient
dual-band power amplifier (PA) for WCDMA/HSDPA band II (1850-1910 MHz), band V (824-849 MHz) is a
fully matched, 14-pad surface-mount technology (SMT) module that meets the stringent spectral linearity
requirements of WCDMA transmission, high power-added efficiency (PAE) for power output to 29 dBm (Band II) and 29
dBm (Band V), and a low current analog pad (VCONT) to improve efficiency for the low RF power range operation.
PA module is designed in a compact-form factor for quad-band cellular handsets comprising GSM850/900,
DCS1800, PCS1900, supporting gaussian minimum shift keying (GMSK) and linear EDGE modulation, and Class 12 GPRS
multi-slot operation. Two separate HBT PA blocks supporting the GSM850/900 band and the DCS1800/PCS1900 band are
fabricated onto indium gallium arsenide (InGaP) die. Inputs and outputs are impedance-matched to 50 ohms, and a
custom complementary metal oxide semiconductor (CMOS) IC provides the internal MFC function and interface
transmit and receive (Tx-Rx) front-end module (FEM), designed in a very low profile (1 mm), contains
compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800 and PCS1900 operation – making
it a complete transmit VCO-to-antenna and antenna-to-receive surface-acoustic wave (SAW) filter solution. The FEM
also supports Class 12 GPRS multi-slot operation and EDGE polar modulation. WCDMA switch-through support is
provided by three dedicated high-linearity ports.
Tx/Rx integrated phase and amplitude controller (iPAC) FEM is in a low profile compact form factor,
and supports quad-band cellular handsets operating GSM850/900 and DCS1800/PCS1900, and Class 12 GPRS multi-slot
operation. The module consists of separate GSM850/900 and DCS1800/PCS1900 PA blocks, 50-ohm impedance-matched
inputs and outputs, TX harmonics filtering, high linearity and a low insertion loss pseudomorphic high electron
mobility transistor (pHEMT) RF switch, and a PAC block with internal current sense resistor.
Skyworks Solutions, Inc. is an innovator of high performance analog and mixed
signal semiconductors enabling mobile connectivity. The company's power amplifiers, front-end modules and direct
conversion radios are at the heart of many of today's leading-edge multimedia handsets. Leveraging core
technologies, Skyworks also offers a diverse portfolio of linear products that support automotive, broadband,
cellular infrastructure, industrial and medical applications.
Headquartered in Woburn, Mass., Skyworks is
worldwide with engineering, manufacturing, sales and service facilities throughout Asia, Europe and North America.
For more information, please visit Skyworks’ Web site at:
Senior Public Relations Manager
Skyworks Solutions, Inc.
5221 California Avenue
Irvine, CA 92617-3073
Safe Harbor Statement
This news release includes "forward-looking statements" intended to qualify for the safe harbor from liability
established by the Private Securities Litigation Reform Act of 1995. These forward-looking statements include
information relating to future results and expectations of Skyworks (including certain projections and business
trends). Forward-looking statements can often be identified by words such as "anticipates," "expects,"
"forecasts," "intends," "believes," "plans," "may," "will," "continue," similar expressions, and variations or
negatives of these words. All such statements are subject to certain risks and uncertainties that could cause
actual results to differ materially and adversely from those projected, and may affect our future operating
results, financial position and cash flows.
These risks and uncertainties include, but are not limited to:
unprecedented uncertainty regarding global economic and financial market conditions; the susceptibility of the
wireless semiconductor industry and the markets addressed by our, and our customers', products to economic
downturns; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the
ability of our customers, to manage inventory; losses or curtailments of purchases or payments from key customers,
or the timing of customer inventory adjustments; changes in laws, regulations and/or policies in the United States
that could adversely affect financial markets and our ability to raise capital; our ability to develop,
manufacture and market innovative products in a highly price competitive and rapidly changing technological
environment; economic, social and political conditions in the countries in which we, our customers or our
suppliers operate, including security and health risks, possible disruptions in transportation networks and
fluctuations in foreign currency exchange rates; fluctuations in our manufacturing yields due to our complex and
specialized manufacturing processes; delays or disruptions in production due to equipment maintenance, repairs
and/or upgrades; our reliance on several key customers for a large percentage of our sales; fluctuations in the
manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication,
assembly, testing or delivery of our products; the availability and pricing of third party semiconductor foundry,
assembly and test capacity and raw materials; our ability to timely and accurately predict market requirements and
evolving industry standards, and to identify opportunities in new markets; uncertainties of litigation, including
potential disputes over intellectual property infringement and rights, as well as payments related to the
licensing and/or sale of such rights; our ability to rapidly develop new products and avoid product obsolescence;
our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions
and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business
and product plans; lengthy product development cycles that impact the timing of new product introductions;
unfavorable changes in product mix; the quality of our products and any remediation costs; shorter than expected
product life cycles; problems or delays that we may face in shifting our products to smaller geometry process
technologies and in achieving higher levels of design integration; and our ability to continue to grow and
maintain an intellectual property portfolio and obtain needed licenses from third parties, as well as other risks
and uncertainties, including but not limited to those detailed from time to time in our filings with the
Securities and Exchange Commission.These forward-looking statements are made
only as of the date hereof, and we undertake no obligation to update or revise the forward-looking statements,
whether as a result of new information, future events or otherwise.
Date Posted 10/13/2009