RFMD Releases Family of WCDMA/HSPA+ Power Amplifier Modules for 3G Multi-Band, Multimode Mobile Devices
RF720x Product Family is Optimized to Mate With Reference Designs
Spain, Feb. 18 /PRNewswire-FirstCall/ -- RF Micro Devices, Inc. (Nasdaq GS: RFMD), a global leader in the
design and manufacture of high-performance semiconductor components, today released the RF720x family of
WCDMA/HSPA+ power amplifiers (PAs). RFMD's RF720x product family is comprised of four PAs designed for 3G
multimode devices implementing mode-specific, band-specific front end architectures. The RF720x product family
accommodates all major WCDMA/HSPA+ bands and band combinations and is optimized to mate with reference designs
from the industry's leading open market 3G chipset supplier.
Leading Open Market 3G Chipset Supplier
Paul Augustine, general manager of RFMD's Component Solutions Business Unit, said, "The RF720x greatly
increases RFMD's ability to extend our leadership in 3G while expanding our customer footprint, particularly in
Korea, China and Taiwan, by delivering compatibility with reference designs from the leading open-market 3G
chipset supplier. We continue to expect double-digit growth in 3G in calendar year 2009, and we are encouraged by
ongoing favorable design activity in this growth market."
The RF7200 (band 1), RF7206 (band
2), RF7203 (band 3, 4, 9 or 10) and the RF7211 (band 11) are designed for single-band operation, while the RF7201
(band 1/8), RF7202 (band 2/5) and the RF7205 (band 1/5) feature two band-specific PAs integrated in a single
module package. Each band of amplification in the RF720x product family is addressed with a band-specific
high-efficiency, linear power amplifier designed to lower current consumption as output power levels decrease. The
improvement in low-power efficiency is enabled through the use of three digital power modes that adjust bias
current and optimize the PA for the desired output power range while maintaining linearity.
Each PA in the RF720x product family includes an integrated output power coupler, which eliminates the need for
external couplers in chipsets monitoring and adjusting PA output power. The integrated power coupler also
significantly reduces the board area required for front end implementation and lowers mobile device
bill-of-material (BOM) costs. The RF7201 and RF7202 further reduce board area and streamline implementation by
combining the highest volume WCDMA/HSPA+ 3G band combinations in one module. By combining multiple PAs from the
RF720x family, handset manufacturers and platform providers can accommodate the majority of WCDMA/HSPA+ band
combinations, including bands 1/8, bands 1/5, bands 2/5, bands 1/2/5 and bands 1/3/8.
Industry-Leading 3G PA Technology
RFMD's broad 3G front end portfolio features innovative products and product families capable of
accommodating all major 3G RF architectures, including existing mode-specific/band-specific and
mode-specific/multi-band architectures as well as emerging multimode/multi-band "converged" architectures.
RFMD's mode-specific/band-specific offerings, such as the RF720x product family, deliver low cost in single-band
3G implementations and design flexibility in multi-band 3G applications. RFMD's mode-specific/multi-band offerings
leverage RFMD's proven quadrature (or "balanced") PA technology and include the RF6280 3G transmit system as well
as the RF9372 (single path), RF3278 (dual path) and RF6278 (triple path) broadband PAs. RFMD's quadrature PAs
enhance multi-band platform capability and improve immunity to VSWR ("antenna mismatch").
RFMD's revolutionary multimode/multi-band converged offerings include the recently introduced RF6460 front
end platform, which leverages RFMD's high-volume quadrature PA technology to deliver the industry's broadest band
coverage (Band 1-6, 8-10) from a single, scalable front end platform. RFMD's converged front end platforms enable
the smallest size and lowest implementation cost for multi-band smartphones (and other mobile devices, such as
data cards), while supporting all air standards--GSM/GPRS, EDGE, CDMA, TD-SCDMA (3G), WCDMA/HSPA+ (3G), and LTE
Technical features of the RF720x family include:
Compact, low profile packages: Single-band - 3 x 3 x 1 mm, Dual-Band -
4 x 5 x 1 mm
-- Excellent low-power
-- 3 power-mode states with chipset-specific digital control interfaces
-- Integrated voltage regulator (Vreg)
-- Integrated output power couplers
-- Highly integrated modules requiring no external blocking or decoupling
Availability and Pricing
Samples and pre-production quantities of the RF720x family are available immediately. Pricing is available upon
request by contacting an RFMD sales representative or by visiting
www.rfmd.com/purchase. Based upon current design activity, RFMD expects shipments of RF720x PAs to commence in
the fourth quarter of calendar year 2009.
RFMD's product portfolio
will be on display
at the 2009 GSMA Mobile World Congress February 16 to February 19 in Hall 8, Stand 8B79.
RF Micro Devices, Inc. (Nasdaq GS: RFMD) is a global leader in the design and
manufacture of high-performance semiconductor components. RFMD's products enable worldwide mobility, provide
enhanced connectivity and support advanced functionality in the cellular handset, wireless infrastructure,
wireless local area network (WLAN), CATV/broadband and aerospace and defense markets. RFMD is recognized for its
diverse portfolio of semiconductor technologies and RF systems expertise and is a preferred supplier to the
world's leading mobile device, customer premises and communications equipment providers.
Headquartered in Greensboro, N.C., RFMD is an ISO 9001- and ISO 14001-certified manufacturer with worldwide
engineering, design, sales and service facilities. RFMD is traded on the NASDAQ Global Select Market under the
symbol RFMD. For more information, please visit RFMD's web site at
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SOURCE RF Micro Devices, Inc. 01/20/2009
CONTACT: Doug DeLieto, VP, Investor Relations, +1-336-678-7968,
or Jerry Neal, Executive Vice President,
+1-336-678-7001, both of RFMD