I would like to apply my resume to Korea site or another site. If you have any question my resume, please contact my E-mail address.

Nationality : Korea
Name : Simon Lim
Cell phone : 82-10-2424-1155
E-mail : ism1155@shinbiro.com
Target Occupation : Hardware/RF/SiP module Engineer

EDUCATION BACKGROUND : Computer & communication engineering Choung-ju university Graduation

Man power :
Fully capability from design module which is verified with simulation to Testing spec.

Carrier-------------------------------------------

Codial.co.ltd Hardware team 2002 ~ 2004 year

Main job – Development Circuit for CDMA celluer phone.
Development RF&Multimedia part in laminated PCB for CDMA celluer phone.

2002 year - Followed up CDMA Celluer phone @450MHz MSM 5100 base for Synertek mobile phone.
2003 year - Development CDMA Celluer phone@800 MHz MSM 5100 base for Arima, Amoisonic mobile phone.
2004 year - Development Triple mode CDMA Celluer phone @MSM 6100 base for Super board for testing.

Jahwa electronics.co.ltd R&D 1 team 2004~2008 year

Main job – Development Circuit for RF module with LTCC (Low Temperature Co-fired Ceramic) carrier.
Development RF part in LTCC carrier for GSM celluer phone.

2004 year - Development Dual band GSM900, DCS1800 Antenna switch module (4.5x3.2 mm) for SEC GSM mobile phone.
2005 year - Development Triple band GSM900, DCS1800, PCS1900 Antenna switch module (4.5x3.2 mm) for SEC GSM mobile phone.
2006 year - Development Dual band GSM900, DCS1800 Front End module (5.4x4.0 mm) for SEC GSM mobile phone.
2007 year - Development Triple band GSM900, DCS1800, PCS1900 Front End module (5.4x4.0 mm) for SEC GSM mobile phone.

ASE Korea R&D team 2008 year ~ Now

Main job – Development Circuit for RF/SiP/Power module with various carrier (Laminated PCB, LTCC..)
Development RF/Power/Digital part in various carrier for Mobile and PC application.

2008 year - Development 2.45GHz Zigbee System in Package Module 10 x 10 mm for Radiopulse
2008 year – Development DCDC converter(Buck) System in Package Module 15 x 15 mm for Intersil.
2008 year – Development 3Gbps SATA controller FBGA 14x14mm for Indilinx.
2009 year - Development 2.45GHz Zigbee System in Package Module 9 x 9 mm for Radiopulse with included
Embedded Passive Discrete to apply to low cost model.
2009 year - Development DCDC converter (Buck) System in Package Module 10 x 15 mm for MAXIM.
2009 year - Development 2.45GHz Zigbee USIM card for Radiopulse.
2009 year - Development 900MHz RFID USIM card for Radiopulse.
2009 year - Development Power Management Module ; W/B+WLCPS combo 12x12mm for QCT.
2010 year – Development 900MHz UHF band Balun+LPF LTCC type module 3.5x3.5mm for Radiopulse.
2010 year - Development 2.45GHz Zigbee + 1GB Flash RAM MicroSD card for Radiopulse.


Master grade skill

Design tool: Mentor PowerPCB, logic, Cadence Allegro Package Designer, Cadence CIS.
Simulation tool: Agilent ADS, Momentum, Ansoft HFSS, Links, RLC extractor.
Measurement tool: Oscilloscope, Signal generator, Spectrum analyzer, Network analyzer…

Fully capability from design module which is verified with simulation to Testing spec.