Because of the high maintenance needed to monitor and filter spammers from the RF Cafe Forums, I decided that it would
be best to just archive the pages to make all the good information posted in the past available for review. It is unfortunate
that the scumbags of the world ruin an otherwise useful venue for people wanting to exchanged useful ideas and views.
It seems that the more formal social media like Facebook pretty much dominate this kind of venue anymore anyway, so if
you would like to post something on RF Cafe's
page, please do.
Below are all of the forum threads, including all
the responses to the original posts.
Post subject: MicroElectronic Packaging Engineer - Skyworks Solutions
Posted: Wed May 02, 2012 11:02 am
Joined: Mon Feb 21, 2011
Cedar Rapids, IA
• Support the design, prototype assembly, documentation
and release to production of new RFIC and multi-chip
module (MCM) packages using appropriate technology.
• Acts as a liaison with internal Advanced Packaging
Group, Suppliers, and Internal and External Manufacturing.
• Direct and potentially manage Packaging resources
used in build, design, development and documentation
of industry leading wireless semiconductor products.
• Using appropriate tools, perform product cost
trade-offs, package integrity analysis (thermal,
mechanical, cross-sectioning, assembly process,
etc.) for customer and internal requirements.
• Define package requirements for product groups
assuring compliance with customer and internal Quality
and Reliability requirements.
• Support the
design and development of test fixture assemblies
for product development and production test.
This individual must work well in a team on
problems of a diverse scope where analysis of situations
or data requires a review of identifiable factors.
Must exercise judgment within defined procedures
and practices to determine appropriate solutions.
This position requires a BS degree and 2 years minimum
of experience with knowledge of state-of-the-art
materials and packaging related to semiconductor
technology. Experience with Thermal and Mechanical
Analysis, Auto-CAD and Cadence APD or similar CAD
tools is a preference. A basic understanding of
Micro-Electronic Packaging and Manufacturing is
also highly preferred