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Mounting Inductance - RF Cafe Forums

Because of the high maintenance needed to monitor and filter spammers from the RF Cafe Forums, I decided that it would be best to just archive the pages to make all the good information posted in the past available for review. It is unfortunate that the scumbags of the world ruin an otherwise useful venue for people wanting to exchanged useful ideas and views. It seems that the more formal social media like Facebook pretty much dominate this kind of venue anymore anyway, so if you would like to post something on RF Cafe's Facebook page, please do.

Below are all of the forum threads, including all the responses to the original posts.


ashishbondia
Post subject: Mounting Inductance Posted: Tue Dec 02, 2008 2:43 am

Captain


Joined: Wed Aug 16, 2006 8:20 am
Posts: 23
Location: India
Hi!
Does anyone has any idea of how to model the effect of the Solder metal inductance use for mounting the various components on RF board.

_________________
Ashish Bondia,
Design Engineer- RF


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IR
Post subject: Posted: Tue Dec 02, 2008 10:31 am

Site Admin


Joined: Mon Jun 27, 2005 2:02 pm
Posts: 373
Location: Germany
You can use an additional layer of metalization in your substrate definition. You need to assume the thickness of the soldering tin and also find out the composition of the tin used.

I never did that and I think that this is an ''over-kill'' unless you are talking on a frequency above 25GHz or doing a research project on the capabilities of your simulation tool


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ashishbondia
Post subject: Posted: Thu Dec 04, 2008 2:59 am

Captain


Joined: Wed Aug 16, 2006 8:20 am
Posts: 23
Location: India
The whole idea was to find out the degradation in SRF of the inductors due to addition of the Solder metals on their terminals while mounting. I need 0.5 nH inductors at some places for matching. even a 10-20 % deviation from this value degrades the performance. I was thinking if I can estimate the inductance added by the solder then I might even think about not using an inductor and just short the pads (for inductor) on my board by sufficient volume of solder metal.

_________________
Ashish Bondia,
Design Engineer- RF








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