Thank you for visiting RF Cafe! Electronics World Cover,TOC,and list of posted Popular Electronics articles QST Radio & TV News Radio-Craft Radio-Electronics Short Wave Craft Wireless World About RF Cafe RF Cafe Homepage RF Cafe in Morse Code Google Search of RF Cafe website Sitemap Electronics Equations Mathematics Equations Equations physics Manufacturers & distributors Engineer Jobs Twitter LinkedIn Crosswords Engineering Humor Kirt's Cogitations Engineering Event Calendar RF Engineering Quizzes AN/MPN-14 Radar 5CCG Notable Quotes App Notes Calculators Education Magazines Software,T-Shirts,Coffee Mugs Articles - submitted by RF Cafe visitors Simulators Technical Writings RF Cafe Archives Test Notes Wireless System Designer RF Stencils for Visio Shapes for Word Search RF Cafe Sitemap Advertising Facebook RF Cafe Forums RF Cafe Homepage Thank you for visiting RF Cafe!

Inductance Lead Effects - RF Cafe Forums

The original RF Cafe Forums were shut down in late 2012 due to maintenance issues. Original posts:

Amateur Radio | Antennas | Circuits & Components | Systems | Test & Measurement

Post subject: Inductance lead effects Posted: Fri Sep 09, 2005 3:59 am

Joined: Tue Mar 15, 2005 11:43 pm
Posts: 65
Location: Singapore
I'm currently designing 3.5GHz power amplifier module, with the clip pin lead. I'm wondering whether the inductance of the lead (especially output lead) will significantly affect the performance?

and also due to the substrate thickness, the lead will be bent to connect to evaluation board (jig). So, there'll be gaps in between. I'm not sure whether it'll affect the performance especially at 3.5GHz range?

I've done some simulation by adding some inductance at the output. The gain is not significantly affected, but there's some effect at output return loss ( although not "high" ). Since so far, I only be able to do small signal simulation, I'm worried that it'll affect power performance at the end.

Could anybody kindly advise me how to do the "right and accurate" simulations to observe/ predict the effects on overall performance?
I need to prepare some anaylsis before send to fabrication.

Your advice is much appreciated.

Thanks and Regards,.


Post subject: Posted: Fri Sep 09, 2005 9:03 am

Site Admin

Joined: Mon Jun 27, 2005 2:02 pm
Posts: 373
Location: Germany
Hello Jean,

I didn't understand compleltly from your description what is a clip pin lead

Could you tell what is the package type?

If you mean that there is an air gap between one pin of yor active device to the substrate this will certainly cause a discontinuity in the impedance and will affect your return loss. If this occurs at the output it could be worse, because as you may know, the output is much more dominant in PA design.

I think that you can simulate an air-gap by measuring the dimensions of the air-gap and add a shape(s) of transmission line(s) with the same dimensions that has a dielectric coefficient of Er=1 (Dielectric coefficient of air).

Please provide the information above so I can help you more.

Best regards,

- IR

Posted  11/12/2012

RF Cafe Software

   Wireless System Designer - RF Cafe
Wireless System Designer

RF & EE Symbols Word
RF Stencils for Visio
Calculator Workbook
RF Workbench
Smith Chartâ„¢ for Visio
Smith Chartâ„¢ for Excel

About RF Cafe

Kirt Blattenberger - RF Cafe WebmasterCopyright
1996 - 2022
Kirt Blattenberger,

RF Cafe began life in 1996 as "RF Tools" in an AOL screen name web space totaling 2 MB. Its primary purpose was to provide me with ready access to commonly needed formulas and reference material while performing my work as an RF system and circuit design engineer. The Internet was still largely an unknown entity at the time and not much was available in the form of WYSIWYG ...

All trademarks, copyrights, patents, and other rights of ownership to images and text used on the RF Cafe website are hereby acknowledged.

My Hobby Website:

Try Using SEARCH
to Find What You Need. 
There are 1,000s of Pages Indexed on RF Cafe !