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Post subject: General question on Packaging and circuit Board Posted: Fri Oct 06, 2006 4:46 pm
Joined: Fri Jun 30, 2006 9:56 am
Location: Blacksburg Virginia
I have an open and general question regarding material such as Roger3000, LTCC or Ceramic..
have heard people complaning about those material at frequency above 30GHz, either for the loss, for the unstable
lateral dimensions or price.
Does anyone has experience with those type of material for either packaging or
circuit and could give me more details.. What problems do people usually face with those type of materials?
there a frequency at which there is no solution for chip on package or it is to expensive(above $100/inch^2)?? or
just to much twinking required???
I hope my question is not to vague... and there is some kind of
Rohm and Haas